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Co-mold features on a chassis shell of a mobile device

  • US 9,967,374 B2
  • Filed: 10/07/2016
  • Issued: 05/08/2018
  • Est. Priority Date: 10/30/2015
  • Status: Active Grant
First Claim
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1. A mobile phone, comprising:

  • a circuit board having a processor thereon; and

    a chassis shell having an integral unibody including a co-mold loop feature surrounding a button profile feature, the co-mold loop feature and the button profile feature located on the surface of the chassis shell, the co-mold loop feature preventing an independent movement of the button profile feature, wherein the co-mold loop feature is integrally bonded to both the button profile feature and a passive part of the chassis shell surrounding the co-mold loop feature;

    a channel formed within the chassis shell defining the co-mold loop feature and electrically insulating the button profile feature from the chassis shell; and

    a sensor system coupled to the circuit board and the button profile feature from an interior side of the chassis shell, wherein the sensor system is configured to detect a user interaction event based on sensor readings from the sensor system and to register the user interaction event with the processor.

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