Device and method for determining the temperature of a heat sink

• US 9,967,966 B2
• Filed: 03/07/2016
• Issued: 05/08/2018
• Est. Priority Date: 03/22/2005
• Status: Active Grant

• Current Assignee: Sew-Eurodrive GmbH & Company KG (BV Beteiligung GmbH & Company KG)
• Original Assignee: Sew-Eurodrive GmbH & Company KG (BV Beteiligung GmbH & Company KG)
• Inventors: Schaefer, Harald
• Primary Examiner(s): Kaplan Verbitsky, Gail
• Application Number:
  US15/063,119
• Publication Number:
  US 20160192472A1
• Time in Patent Office: 792 Days
• Field of Search: 374 1, 374 4, 374 5, 374 29, 374 30, 374 43, 374 44, 374 45, 374137, 374102, 374100, 374178, 374170, 374208, 702130, 702 99, 361709, 36167801, 361748, 361760
• CPC Class Codes: H01L 23/34 Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/4006 with bolts or screws
• CPC Class Codes: H01L 23/62 Protection against overvoltage, e.g. fuses, shunts
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 1/0207 using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
• CPC Class Codes: H05K 2201/09745 Recess in conductor, e.g. in pad or in metallic substrate
• CPC Class Codes: H05K 2201/10409 Screws
• CPC Class Codes: H05K 2201/1056 Metal over component, i.e. metal plate over component mounted on or embedded in PCB
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20

Abstract

A method for determining the temperature of a heat source and an electronic unit, including a printed-circuit board equipped with a sensor and a heat sink, the sensor being connected to the heat sink in a heat-conducting manner.

Claims

1. A device, comprising:

a printed-circuit board;

a sensor; and

a heat sink connected to the sensor in a heat-conducting manner;

wherein the printed-circuit board is directly connected to the heat sink at a metallic area at a surface of the printed-circuit board facing the heat sink at least one of (a) electrically and (b) in a heat-conducting manner.

2. The device according to claim 1, wherein the connection of the printed-circuit board and the heat sink includes a fastening device detachably connecting the heat sink to the printed-circuit board.

3. The device according to claim 2, wherein the fastening device includes using a screw.

4. The device according to claim 1, wherein the sensor includes connecting elements electrically connected by soldered connections on a surface facing the heat sink, the connecting elements of the sensor being connected to at least one of (a) printed-circuit traces of surfaces facing away from the heat sink and (b) inner traces of the printed-circuit board.

5. The device according to claim 4, wherein the soldered connections are formed using an SMD technique.

6. The device according to claim 1, wherein at least one of (a) the sensor is mounted on a side of the printed-circuit board facing away from the heat sink, (b) the sensor is mounted on the side of the printed-circuit board facing the heat sink, and (c) the heat sink includes recesses which enclose parts of the printed-circuit board connected to the sensor.

7. The device according to claim 1, wherein the sensor is mounted in a region of the printed-circuit board having a spatial distance from a contact surface of the heat sink and the printed-circuit board that amounts to a multiple of a length of the sensor that exceeds one.

8. The device according to claim 1, wherein at least one of (a) the heat sink is connected to cooling surfaces of power semiconductors in a heat-conducting manner and (b) the heat sink is connected in a heat-conducting manner to cooling surfaces of power semiconductors, one of (1) indirectly and (2) directly, via at least one of (i) a ceramic plate and (ii) a heat-conducting foil.

9. The device according to claim 1, wherein the heat sink is at least one of (a) a part of a housing of an internal combustion engine, (b) a component part of a heating system, (c) a component part of a chemical plant for carrying out chemical reaction processes, and (d) a component part of a coolant circulation circuit.

10. The device according to claim 1, wherein the device is arranged as at least one of (a) an electronic unit, (b) an inverter, (c) a cycloconverter, (d) a voltage-source converter, and (e) a converter for supplying an electric motor.

11. The device according to claim 1, wherein the printed-circuit board is a multi-layer printed-circuit board.

12. The device comprising:

a printed-circuit board;

a sensor; and

a heat sink connected to the sensor in a heat-conducting manner;

wherein the printed-circuit board is directly connected to the heat sink at a metallic area at a surface of the printed-circuit board facing the heat sink at least one of (a) electrically and (b) in a heat-conducting manner;

wherein metallic areas of inner layers of the printed-circuit board are electrically and thermally connected to at least one metallic area at the surface of the printed-circuit board facing the heat sink, and

wherein metallic regions of the printed-circuit board have a higher thermal conductivity than a substrate material of the printed- circuit board substrate material to attain a temperature level which is substantially the same as a temperature of the heat sink, of areas of the inner layers which are spatially close to the sensor having distances from points of contact of parts of the sensor to the printed-circuit board less than a thickness of the printed-circuit board.

13. The device according to claim 12, wherein the electrical connections include through-contactings to produce a homogeneous temperature level In the inner layers of the printed-circuit board.

14. The device according to claim 12, wherein the metallic areas include copper or are made of copper.

15. The device according to claim 12, wherein the metallic areas are printed-circuit traces of the printed-circuit board.