3D EMI suppression structure and electronic device having the same

• US 9,967,968 B2
• Filed: 07/18/2016
• Issued: 05/08/2018
• Est. Priority Date: 08/28/2015
• Status: Active Grant

• Current Assignee: SK Hynix Inc.
• Original Assignee: SK Hynix Inc.
• Inventors: Hung, Kuo Ying
• Primary Examiner(s): Pascal, Robert J
• Assistant Examiner(s): Glenn, Kimberly
• Application Number:
  US15/213,305
• Publication Number:
  US 20170064815A1
• Time in Patent Office: 659 Days
• CPC Class Codes: H01P 3/026 Coplanar striplines [CPS]
• CPC Class Codes: H01P 5/028 between strip lines
• CPC Class Codes: H05K 1/0219 Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 1/0225 Single or multiple openings in a shielding, ground or power plane H05K1/0227 takes precedence
• CPC Class Codes: H05K 1/0227 Split or nearly split shielding or ground planes
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 2201/0929 Conductive planes

Abstract

A 3D Electromagnetic Interference (EMI) suppression structure and an electronic device having the same, wherein a coplanar waveguide structure, an isolation layer, and a resonance layer may be installed. Furthermore, under the coplanar waveguide structure, the 3D EMI structure may be installed to connect to a conductor part of the resonance layer through a conductive connection part of the isolation layer, thereby further improving the EMI suppression effect and producing an excellent EMI suppression effect.

Claims

1. A 3D Electromagnetic Interference (EMI) suppression structure which is installed in a multilayer substrate and stacked in the vertical axis direction of one or more differential pairs of signal transmission lines installed at a first layer of the multilayer substrate, the 3D EMI suppression structure comprising:

a coplanar waveguide structure installed at a second layer of the multilayer substrate, and comprising a conducting wire band, two ground parts positioned at both sides of the conducting wire band and isolated from the conducting wire band by a distance corresponding to a first isolation groove, and a coupling groove positioned in each of the ground parts and connected to the first isolation groove adjacent thereto through an extended groove;

an isolation layer installed at a third layer of the multilayer substrate and having a conductive connection part connected to the conducting wire band through the isolation layer; and

a resonance layer installed at a fourth layer of the multilayer substrate, and comprising a conductor part and two ground conductor parts which are positioned at both sides of the conductor part and isolated from the conductor part by a distance corresponding to a second isolation groove,

wherein the conductor part is connected to the conductive connection part of the isolation layer.

2. The 3D EMI suppression structure according to claim 1, wherein the two coupling grooves installed at the second layer of the multilayer substrate are symmetrical with respect to the conducting wire band.

3. The 3D EMI suppression structure according to claim 2, wherein the coupling groove has a rectangular shape, a polygonal shape, or an S-shape in the in-plane direction of the coplanar waveguide structure.

4. The 3D EMI suppression structure according to claim 1, wherein an extension direction of the conducting wire band and the conductor part is parallel to a flow direction of the one or more differential pairs of signal transmission lines, the first isolation groove is extended to both ends of the conducting wire band and surrounds the conducting wire band, and the second isolation groove is extended to both ends of the conductor part and surrounds the conductor part.

5. The 3D EMI suppression structure according to claim 4, wherein a width of the conducting wire band is larger than a total width occupied by the one or more differential pairs of signal transmission lines adjacent to each other at the first layer of the multilayer structure.

6. The 3D EMI suppression structure according to claim 5, wherein a width of the conductor part is larger than the width of the conducting wire band.

7. The 3D EMI suppression structure according to claim 6, wherein a perimeter of the coupling groove corresponds to a common mode signal which is to be suppressed, and the common mode signal is passed through the one or more differential pairs of signal transmission lines, and has a specific frequency range.

8. An electronic device, comprising:

a multilayer substrate;

two signal contacts installed at a first layer of the multilayer substrate;

a differential pair of signal transmission lines installed at the first layer of the multilayer substrate, and comprising first and second signal lines connected between the signal contacts as a transmission path between the two signal contacts; and

a 3D Electromagnetic Interference (EMI) suppression structure installed in the multilayer substrate under the differential pair of transmission lines and comprising;

a coplanar waveguide structure installed at a second layer of the multilayer substrate, and comprising a conducting wire band, two ground parts positioned at both sides of the conducting wire band and isolated from the conducting wire band by a distance corresponding to a first isolation groove, and a coupling groove positioned in each of the ground parts and connected to the first isolation groove adjacent thereto through an extended groove;

an isolation layer installed at a third layer of the multilayer substrate and having a conductive connection part connected to the conducting wire band through the isolation layer; and

a resonance layer installed at a fourth layer of the multilayer substrate, and comprising a conductor part and two ground conductor parts which are positioned at both sides of the conductor part and isolated from the conductor part by a distance corresponding to a second isolation groove, the conductor part being connected to the conductive connection part of the isolation layer.

9. The electronic device according to claim 8, wherein an extension direction of the conducting wire band and the conductor part is parallel to a flow direction of the differential pair of signal transmission lines, the first isolation groove is extended to both ends of the conducting wire band so as to surround the conducting wire band, and the second isolation groove is extended to both ends of the conductor part so as to surround the conductor part.

10. The electronic device according to claim 9, wherein the two coupling grooves installed at the second layer of the multilayer substrate are symmetrical with respect to the conducting wire band.