Semiconductor device and busbar

• US 9,967,991 B2
• Filed: 10/07/2016
• Issued: 05/08/2018
• Est. Priority Date: 10/10/2014
• Status: Active Grant

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Ichikawa, Hiroaki
• Primary Examiner(s): Garber, Charles
• Assistant Examiner(s): Sabur, Alia
• Application Number:
  US15/288,137
• Publication Number:
  US 20170027074A1
• Time in Patent Office: 578 Days
• CPC Class Codes: H01L 23/49844 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/5383 Multilayer substrates H01L23/5385 takes precedence; multilayer metallisation on monolayer substrates H01L23/538
• CPC Class Codes: H01L 23/5384 Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 25/07 the devices being of a type provided for in group H01L29/00
• CPC Class Codes: H01L 25/115 the devices being arranged next to each other
• CPC Class Codes: H01L 25/18 the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02B 1/205 for connecting electrical apparatus mounted side by side on a rail
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 2201/10272 Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors metal strips H05K2201/1028
• CPC Class Codes: H05K 7/026 Multiple connections subassemblies
• CPC Class Codes: H05K 7/06 on insulating boards , e.g. wiring harnesses for printed circuits H05K1/18, H05K3/30
• CPC Class Codes: H05K 7/14329 specially adapted for the configuration of power bus bars

Abstract

A semiconductor device, including a plurality of semiconductor modules, each including a semiconductor element, a main terminal and a wiring portion that connects the semiconductor element and the main terminal, and at least one busbar that each includes a terminal portion, and a plurality of attachment portions, the attachment portions being respectively connected to the main terminals of the semiconductor modules, such that the at least one busbar connects the semiconductor modules in parallel. The largest resistance among all resistances between the terminal portion and each of the attachment portions in each busbar is 10% or less of a resistance of the wiring portion in each semiconductor module. The largest inductance among all inductances between the terminal portion and each of the attachment portions in each busbar is 10% or less of an inductance of the wiring portion in each semiconductor module.

Claims

1. A semiconductor device comprising:

a plurality of semiconductor modules, each including

a semiconductor element,

a main terminal that is exposed to a periphery, and

a wiring portion that connects the semiconductor element and the main terminal; and

at least one busbar that each includes

a terminal portion, and

a plurality of attachment portions,

the attachment portions being respectively connected to the main terminals of the semiconductor modules, such that the at least one busbar connects the semiconductor modules in parallel, wherein

a largest resistance among all resistances between the terminal portion and each of the attachment portions in each busbar is 10% or less of a resistance of the wiring portion in each semiconductor module, and

a largest inductance among all inductances between the terminal portion and each of the attachment portions in each busbar is 10% or less of an inductance of the wiring portion in each semiconductor module.

2. The semiconductor device according to claim 1, wherein

the largest resistance among all resistances between the terminal portion and each of the attachment portions in each busbar is 5% or less of the resistance of the wiring portion in each semiconductor module, and

the largest inductance among all inductances between the terminal portion and each of the attachment portions in each busbar is 5% or less of the inductance of the wiring portion in each semiconductor module.

3. The semiconductor device according to claim 1,

wherein the wiring portion in each semiconductor module includes an insulated substrate, a printed circuit board that faces the insulated substrate, and a conductive post that is connected to the printed circuit board.

4. The semiconductor device according to claim 3,

wherein in each semiconductor module the main terminal is connected to the insulated substrate and/or the printed circuit board.

5. The semiconductor device according to claim 1, wherein

the main terminal in each semiconductor module includes a first main terminal and a second main terminal, and

the at least one busbar includes a first busbar and a second busbar, which are in parallel to each other, and are respectively connected to the first and second main terminals of each semiconductor module.

6. The semiconductor device according to claim 5,

wherein the first and second busbars have a gap therebetween that has a width of 1 mm or less.

7. A busbar for connecting a plurality of semiconductor modules in parallel with another busbar connecting the plurality of semiconductor modules, a gap between the busbar and the another busbar being 1 mm or less, the busbar comprising:

a terminal portion, and

a plurality of attachment portions, via which the plurality of semiconductor modules are connectable in parallel to the busbar, wherein

a difference between a largest resistance and a smallest resistance among all resistances between the terminal portion and each of the attachment portions is 25nQ or less, and

a difference between a largest inductance and a smallest inductance among all inductances between the terminal portion and each of the attachment portions is 2 nH or less.

8. The busbar according to claim 7,

wherein the difference between the largest inductance and the smallest inductance among all inductances between the terminal portion and each of the attachment portions is 1 nH or less.