Semiconductor device and busbar
First Claim
1. A semiconductor device comprising:
- a plurality of semiconductor modules, each includinga semiconductor element,a main terminal that is exposed to a periphery, anda wiring portion that connects the semiconductor element and the main terminal; and
at least one busbar that each includesa terminal portion, anda plurality of attachment portions,the attachment portions being respectively connected to the main terminals of the semiconductor modules, such that the at least one busbar connects the semiconductor modules in parallel, whereina largest resistance among all resistances between the terminal portion and each of the attachment portions in each busbar is 10% or less of a resistance of the wiring portion in each semiconductor module, anda largest inductance among all inductances between the terminal portion and each of the attachment portions in each busbar is 10% or less of an inductance of the wiring portion in each semiconductor module.
1 Assignment
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Accused Products
Abstract
A semiconductor device, including a plurality of semiconductor modules, each including a semiconductor element, a main terminal and a wiring portion that connects the semiconductor element and the main terminal, and at least one busbar that each includes a terminal portion, and a plurality of attachment portions, the attachment portions being respectively connected to the main terminals of the semiconductor modules, such that the at least one busbar connects the semiconductor modules in parallel. The largest resistance among all resistances between the terminal portion and each of the attachment portions in each busbar is 10% or less of a resistance of the wiring portion in each semiconductor module. The largest inductance among all inductances between the terminal portion and each of the attachment portions in each busbar is 10% or less of an inductance of the wiring portion in each semiconductor module.
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Citations
8 Claims
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1. A semiconductor device comprising:
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a plurality of semiconductor modules, each including a semiconductor element, a main terminal that is exposed to a periphery, and a wiring portion that connects the semiconductor element and the main terminal; and at least one busbar that each includes a terminal portion, and a plurality of attachment portions, the attachment portions being respectively connected to the main terminals of the semiconductor modules, such that the at least one busbar connects the semiconductor modules in parallel, wherein a largest resistance among all resistances between the terminal portion and each of the attachment portions in each busbar is 10% or less of a resistance of the wiring portion in each semiconductor module, and a largest inductance among all inductances between the terminal portion and each of the attachment portions in each busbar is 10% or less of an inductance of the wiring portion in each semiconductor module. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A busbar for connecting a plurality of semiconductor modules in parallel with another busbar connecting the plurality of semiconductor modules, a gap between the busbar and the another busbar being 1 mm or less, the busbar comprising:
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a terminal portion, and a plurality of attachment portions, via which the plurality of semiconductor modules are connectable in parallel to the busbar, wherein a difference between a largest resistance and a smallest resistance among all resistances between the terminal portion and each of the attachment portions is 25nQ or less, and a difference between a largest inductance and a smallest inductance among all inductances between the terminal portion and each of the attachment portions is 2 nH or less. - View Dependent Claims (8)
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Specification