Manufacturing method of strain sensor, strain sensor and motion sensing apparatus using the strain sensor

• US 9,970,832 B2
• Filed: 04/22/2014
• Issued: 05/15/2018
• Est. Priority Date: 06/24/2013
• Status: Active Grant

• Current Assignee: SNU R&DB Foundation (Seoul National University)
• Original Assignee: SNU R&DB Foundation (Seoul National University)
• Inventors: Hong, Yong Taek, Kim, Tae Hoon
• Primary Examiner(s): Macchiarolo, Peter
• Assistant Examiner(s): Jenkins, Jermaine
• Application Number:
  US14/900,743
• Publication Number:
  US 20160377493A1
• Time in Patent Office: 1,484 Days
• Field of Search: None
• CPC Class Codes: G01B 7/16 for measuring the deformation in a solid, e.g. by resistance strain gauge
• CPC Class Codes: G01B 7/18 using change in resistance
• CPC Class Codes: G01L 1/205 using distributed sensing elements
• CPC Class Codes: G01L 1/2287 constructional details of the strain gauges adjustable resistors H01C10/00
• CPC Class Codes: G09B 19/0038 Sports

Abstract

A strain sensor according to the present disclosure includes a flexible substrate, a rigid pattern on a side of the flexible substrate, and a conductive flexible pattern extending in a first direction on a side of the flexible substrate, in which the conductive flexible pattern overlaps the rigid pattern such that as the flexible substrate is compressed or stretched, the conductive flexible pattern is compressed or stretched, thereby changing electric resistance.

Claims

1. A strain sensor comprising:

a flexible substrate;

a rigid pattern on one side of the flexible substrate; and

a conductive flexible pattern extending in a first direction on the one side of the flexible substrate,

wherein the conductive flexible pattern is configured to overlap the rigid pattern such that as the flexible substrate is compressed or stretched, the conductive flexible pattern is compressed or stretched, thereby changing electrical resistance,

wherein the flexible pattern is configured to form a crack thereon at a portion adjacent to the rigid pattern when the flexible pattern is stretched such that the electrical resistance of the conductive flexible pattern is changed by the crack formed on the flexible pattern.

2. The strain sensor of claim 1, wherein the flexible substrate includes any one of PDMS, rubber, PDMS, poly-urethane, a stretchable fiber, ecoflex, and a stretchable tape.

3. The strain sensor of claim 1, wherein the conductive flexible pattern is made of a printable conductive material.

4. The strain sensor of claim 3, wherein the printable conductive material includes at least any one of CNT, carbon black, and PEDOT.

5. The strain sensor of claim 1, wherein a plurality of the rigid patterns is formed in the first direction.

6. The strain sensor of claim 5, wherein the rigid patterns are arranged alternately with respect to the conductive flexible pattern extending in the first direction.

7. The strain sensor of claim 5, wherein the rigid patterns are arranged symmetrically to each other with respect to the conductive flexible pattern extending in the first direction.

8. The strain sensor of claim 1, wherein a hardness of the rigid pattern is bigger than a hardness of the conductive flexible pattern.

9. A method of manufacturing a strain sensor, comprising:

preparing a flexible substrate;

forming a first pattern on a side of the flexible substrate;

forming a rigid pattern by hardening the first pattern; and

forming a conductive flexible pattern on the side of the flexible substrate to have a first portion which is overlapped with and in direct contact with the rigid pattern, the flexible pattern configured to form a crack thereon at a second portion adjacent to the first portion when the flexible pattern is stretched,

wherein the forming of a rigid pattern and the forming of a conductive flexible pattern are performed by printing.

10. The method of claim 9, wherein the flexible substrate includes any one of PDMS, rubber, PDMS, poly-urethane, a stretchable fiber, ecoflex, and a common stretchable tape.

11. The method of claim 9, wherein the forming of a first pattern and the forming of a conductive flexible pattern is performed by using a printable conductive material.

12. The method of claim 11, wherein the printable conductive material includes at least any one of CNT, carbon black, and PEDOT.

13. The method of claim 9, wherein the forming of a rigid pattern by hardening the first pattern is performed by at least any one of ultraviolet treatment, heat treatment, laser radiation, and chemical treatment.

14. The method of claim 9, wherein the forming of a rigid pattern by hardening the first pattern is performed with changing the property of the surface of the flexible substrate.

15. The method of claim 9, wherein the printing is performed by any one of transfer printing, inkjet printing, and roll-to-roll printing.

16. The method of claim 9, wherein the forming of a rigid pattern by hardening the first pattern is performed such that the rigid pattern is larger at least in hardness than the conductive flexible pattern.

17. A motion sensing device comprising:

a strain sensor including;

a flexible substrate;

a rigid pattern on one side of the flexible substrate; and

a conductive flexible pattern extending in a first direction on the one side of the flexible substrate,

wherein the conductive flexible pattern is configured to overlap the rigid pattern such that as the flexible substrate is compressed or stretched, the conductive flexible pattern is compressed or stretched, thereby changing electrical resistance,

wherein the flexible pattern is configured to form a crack thereon at a portion adjacent to the rigid pattern when the flexible pattern is stretched such that the electrical resistance of the conductive flexible pattern is changed by the crack formed on the flexible pattern,

a signal source applying an electrical stimulus to the strain sensor; and

a lead-out circuit performing processing in response to an electrical signal according to a change in electrical resistance of the strain sensor.

18. The motion sensing device of claim 17, the motion sensing device is disposed on the skin of a joint, on a band or a glove covering a joint, and in a joint.