Integrated micro-channel heatsink in DMD substrate for enhanced cooling capacity

• US 9,971,147 B2
• Filed: 09/26/2016
• Issued: 05/15/2018
• Est. Priority Date: 09/26/2016
• Status: Active Grant

• Current Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Original Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Inventors: Atwood, Christopher D., Adiletta, Mark A., Dergham, Ali R., Leighton, Roger G., Zirilli, Francisco
• Primary Examiner(s): SAHLE, MAHIDERE S
• Application Number:
  US15/275,633
• Publication Number:
  US 20180088319A1
• Time in Patent Office: 596 Days
• Field of Search: 359238-324
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81B 7/0019 Protection against thermal alteration or destruction B81B7/0083 takes precedence
• CPC Class Codes: B81B 7/0067 for controlling the passage of optical signals through the package
• CPC Class Codes: B81C 1/00333 Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325
• CPC Class Codes: G02B 26/0833 the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD G02B26/0825 takes precedence; micromechanical devices in general B81B
• CPC Class Codes: G02B 7/181 with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
• CPC Class Codes: G03F 7/70891 Temperature

Abstract

A DMD cooling apparatus and method includes a DMD chip configured on a substrate, and a heatsink located within and integrated into the substrate upon which the DMD is configured. A plurality of micro-channels can be formed on a backside of the substrate. The micro-channels are fabricated via microlithography in association with a fabrication of the DMD chip such that the heatsink integrated into the silicon substrate allows for direct heat removal from the substrate.

Claims

1. A DMD cooling apparatus, comprising:

a DMD configured on a silicon substrate, said DMD including a mirror array located below a glass cover;

a heatsink located within and integrated into said substrate upon which said DMD is configured, and wherein said heatsink comprises an integrated heatsink located inside a DMD chip that comprises said DMD; and

a plurality of micro-channels in a micro-channel cooling arrangement configured on a backside of said substrate, said heatsink comprising said plurality of micro-channels through which a cooling fluid flows for cooling of said DMD wherein said plurality of micro-channels is fabricated in association with a fabrication of said DMD such that said heatsink is integrated into said substrate and allows for direct heat removal from said substrate and wherein a pre-heat beam from at least one LDA (Laser Diode Array) pre-heats said substrate to a specified temperature before an imaging beam from at least one imaging LDA writes on said substrate and wherein a laser output from said at least one LDA or said at least one imaging LDA is directed to a substrate coated with a photochromatic ink wherein each pixel on said substrate coated with said photochromatic ink responds in a gradient to an amount of energy applied by said laser output.

2. The apparatus of claim 1 wherein said cooling fluid comprises water.

3. The apparatus of claim 1 wherein said DMD comprises a housing and an inlet port and outlet port formed from said housing.

4. The apparatus of claim 3 wherein said housing comprises an alumina housing.

5. The apparatus of claim 3 wherein a fluid path for said cooling fluid is formed between said inlet port and said outlet port.

6. The apparatus of claim 5 wherein said fluid path for said cooling fluid comprises said plurality of micro-channels.

7. The apparatus of claim 5 further comprising an epoxy seal that contains cooling fluid disposed on an underside of said substrate so that none of said cooling fluid interferes with mirrors on an upper surface of said DMD.

8. A DMD cooling apparatus, comprising:

a DMD configured on a substrate, wherein said DMD comprises a housing and an inlet port and outlet port formed from said housing, said DMD including a mirror array located below a glass cover;

a heatsink located within and integrated into said substrate upon which said DMD is configured, and wherein said heatsink comprises an integrated heatsink located inside a DMD chip that comprises said DMD; and

a plurality of micro-channels in a micro-channel cooling arrangement configured on a backside of said substrate, said heatsink comprising said plurality of micro-channels through which a cooling fluid flows for cooling of said DMD wherein said plurality of micro-channels is fabricated via microlithography in association with a fabrication of said DMD such that said heatsink is integrated into said substrate and allows for direct heat removal from said substrate and wherein a pre-heat beam from at least one LDA (Laser Diode Array) pre-heats said substrate to a specified temperature before an imaging beam from at least one imaging LDA writes on said substrate and wherein a laser output from said at least one LDA or said at least one imaging LDA is directed to a substrate coated with a photochromatic ink wherein each pixel on said substrate coated with said photochromatic ink responds in a gradient to an amount of energy applied by said laser output.

9. The apparatus of claim 8 wherein said cooling fluid comprises water.

10. The apparatus of claim 8 wherein said housing comprises an alumina housing and wherein said cooling fluid comprises water.

11. The apparatus of claim 8 wherein a fluid path of said cooling fluid is formed between said inlet port and said outlet port.

12. The apparatus of claim 11 wherein said fluid path comprises said plurality of micro-channels and further comprises an epoxy seal that contains cooling fluid disposed on an underside of said substrate so that none of said cooling fluid interferes with mirrors on an upper surface of said DMD.

13. A method of fabricating a DMD cooling apparatus, comprising:

configuring a DMD on a silicon substrate;

configuring said DMD to include a mirror array located below a glass cover;

locating a heatsink within and integrated into said substrate upon which said DMD is configured, and wherein said heatsink comprises an integrated heatsink located inside a DMD chip that comprises said DMD; and

configuring a plurality of micro-channels in a micro-channel cooling arrangement on a backside of said substrate, such that said heatsink is configured to comprise said plurality of micro-channels through which a cooling fluid flows for cooling of said DMD;

configuring said plurality of micro-channels in association with a fabrication of said DMD such that said heatsink is integrated into said substrate and allows for direct heat removal from said substrate and wherein a pre-heat beam from at least one LDA (Laser Diode Array) pre-heats said substrate to a specified temperature before an imaging beam from at least one imaging LDA writes on said substrate and wherein a laser output from said at least one LDA or said at least one imaging LDA is directed to a substrate coated with a photochromatic ink wherein each pixel on said substrate coated with said photochromatic ink responds in a gradient to an amount of energy applied by said laser output.

14. The method of claim 13 further comprising configuring said plurality of micro-channels via microlithography in association with said fabrication of said DMD and wherein said cooling fluid comprises water.

15. The method of claim 14 further comprising:

configuring said DMD to include a housing; and

forming an inlet port and outlet port from said housing.

16. The method of claim 15 further comprising forming a fluid path for said cooling fluid between said inlet port and said outlet port.

17. The method of claim 16 wherein said fluid path comprises said plurality of micro-channels.

18. The method of claim 16 further comprising providing an epoxy seal that contains cooling fluid disposed on an underside of said substrate so that none of said cooling fluid interferes with mirrors on an upper surface of said DMD.

19. The method of claim 15 wherein said substrate comprises silicon and wherein said housing comprises an alumina housing.