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Microwave integrated quantum circuits with VIAS and methods for making the same

  • US 9,971,970 B1
  • Filed: 04/27/2016
  • Issued: 05/15/2018
  • Est. Priority Date: 04/27/2015
  • Status: Active Grant
First Claim
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1. A quantum computing system comprising:

  • a quantum circuit device having at least one operating frequency;

    a first substrate having a first surface on which the quantum circuit device is disposed; and

    electrically conducting vias each extending through the first substrate outside of a footprint of the quantum circuit device,wherein the vias are arranged to suppress propagation of electromagnetic waves that have frequencies below a cutoff frequency, the cutoff frequency being larger than the operating frequency;

    a set of three or more other electrically conducting vias each extending through the first substrate outside of the footprint of the quantum circuit device, wherein the other electrically conducting vias form respective vertices of a polygon; and

    a signal line that includes a first via that extends through the first substrate and is inscribed in the polygon, wherein the signal line is electromagnetically coupled with the quantum circuit device to carry, during operation of the quantum computing system, a control signal to, or a readout signal from, the quantum circuit device.

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