Method for head stack assembly rework

• US 9,972,347 B1
• Filed: 02/20/2015
• Issued: 05/15/2018
• Est. Priority Date: 10/29/2010
• Status: Active Grant

• Current Assignee: Western Digital Technologies Incorporated (Western Digital Corporation)
• Original Assignee: Western Digital Technologies Incorporated (Western Digital Corporation)
• Inventors: Pan, Tzong-Shii, Zhang, Cliff, Castro, Maribel
• Primary Examiner(s): Tugbang, A. Dexter
• Application Number:
  US14/628,111
• Time in Patent Office: 1,180 Days
• CPC Class Codes: G11B 5/295 Manufacture
• CPC Class Codes: G11B 5/48 Disposition or mounting of heads or head supports relative to record carriers mounting of head within housing G11B5/105; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed driving of both record carriers and head G11B15/18; guiding record carriers G11B15/60; head selecting circuits G11B15/12
• CPC Class Codes: G11B 5/4813 Mounting or aligning of arm assemblies, e.g. actuator arm supported by bearings, multiple arm assemblies, arm stacks or multiple heads on single arm G11B5/484 takes precedence
• CPC Class Codes: G11B 5/4833 Structure of the arm assembly, e.g. load beams, flexures, parts of the arm adapted for controlling vertical force on the head G11B5/484 takes precedence
• CPC Class Codes: G11B 5/4846 Constructional details of the electrical connection between arm and support
• CPC Class Codes: G11B 5/4853 Constructional details of the electrical connection between head and arm
• CPC Class Codes: G11B 5/486 with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly
• CPC Class Codes: G11B 5/84 Processes or apparatus specially adapted for manufacturing record carriers
• CPC Class Codes: Y10T 29/49023 including dissassembly step
• CPC Class Codes: Y10T 29/49025 Making disc drive
• CPC Class Codes: Y10T 29/49027 Mounting preformed head/core onto other structure
• CPC Class Codes: Y10T 29/4903 with bonding

Abstract

A method for head stack assembly (HSA) rework is disclosed. A first head gimbal assembly (HGA) includes a first suspension attached to an arm of the HSA, and a first flexure tail that terminates in a first bonding region that is bonded to a flexible printed circuit (FPC) of the HSA. The first HGA is removed by cutting the first bonding region from a remainder of the first flexure tail and detaching the first suspension from the arm. The first bonding region of the first flexure tail is left bonded to the FPC. A replacement HGA includes a replacement suspension and a replacement flexure tail that terminates in a second bonding region. The replacement HGA is installed on the HSA by attaching the replacement suspension to the arm, overlaying the second bonding region on the first bonding region, and bonding the second bonding region to the first bonding region.

Claims

1. A method for head stack assembly (HSA) rework, comprising:

removing a first head gimbal assembly (HGA) from the HSA, the first HGA including a first suspension that is attached to an arm of the HSA, the first HGA also including a first flexure tail that terminates in a first bonding region that is bonded to a flexible printed circuit (FPC) of the HSA, wherein removing the first HGA includes;

cutting the first flexure tail to separate the first bonding region from a remainder of the first flexure tail, including leaving the first bonding region bonded to the FPC, and

detaching the first suspension from the arm; and

installing a replacement HGA on the HSA, the replacement HGA including a replacement suspension and a replacement flexure tail that terminates in a second bonding region, wherein installing the replacement HGA includes;

attaching the replacement suspension to the arm,

overlaying the second bonding region on top of the first bonding region, and

bonding the second bonding region to the first bonding region.

2. The method of claim 1 wherein bonding the second bonding region to the first bonding region establishes a plurality of electrical connections from the second bonding region to the FPC, through the first bonding region.

3. The method of claim 1 wherein overlaying the second bonding region on top of the first bonding region includes aligning a plurality of patterned features of a conductive layer of the second bonding region to a corresponding plurality of patterned features of a conductive layer of the first bonding region.

4. The method of claim 1 wherein bonding the second bonding region to the first bonding region comprises bonding a plurality of patterned features of a copper layer of the second bonding region to a corresponding plurality of patterned features of a stainless steel layer of the first bonding region.

5. The method of claim 4 wherein each of the corresponding plurality of patterned features of the stainless steel layer of the first bonding region is coated with gold.

6. The method of claim 1 wherein bonding the second bonding region to the first bonding region comprises using a thermode tool to apply pressure to an anisotropic conductive film that includes a plurality of electrically conductive beads.

7. The method of claim 6 wherein bonding the second bonding region to the first bonding region comprises bonding a plurality of patterned features of the second bonding region to a corresponding plurality of patterned features of the first bonding region, and using a flat face of the thermode tool to apply pressure to all of the plurality of patterned features simultaneously.

8. The method of claim 1 wherein attaching the replacement suspension to the arm comprises swaging the replacement suspension to the arm, and wherein detaching the first suspension from the arm comprises de-swaging the first suspension from the arm.

9. A method to manufacture a head stack assembly, the method comprising:

providing an actuator including an arm and a flexible printed circuit (FPC) including a plurality of FPC bond pads;

providing a first head gimbal assembly (HGA) that includes a first suspension, a first read head, and a first flexure tail including a first bonding region, the first bonding region including a first plurality of flexure tail conductive bond pads;

attaching the first suspension to the arm;

bonding each of the first plurality of flexure tail conductive bond pads to a corresponding one of the plurality of FPC bond pads;

testing the HSA;

cutting the first flexure tail to separate the first bonding region from a remainder of the first flexure tail, including leaving the first plurality of flexure tail conductive bond pads bonded to the corresponding plurality of FPC bond pads;

detaching the first suspension from the arm;

installing a replacement HGA on the HSA, the replacement HGA including a replacement suspension and a replacement flexure tail that terminates in a second bonding region, the second bonding region including a second plurality of flexure tail conductive bond pads, wherein installing the replacement HGA includes;

attaching the replacement suspension to the arm,

overlaying the second bonding region on top of the first bonding region, and

bonding each of the second plurality of flexure tail conductive bond pads to a corresponding one of the first plurality of flexure tail conductive bond pads.

10. The method of claim 9 wherein overlaying the second bonding region on top of the first bonding region includes aligning the second plurality of flexure tail conductive bond pads with the first plurality of flexure tail conductive bond pads.

11. The method of claim 9 wherein bonding each of the second plurality of flexure tail conductive bond pads to a corresponding one of the first plurality of flexure tail conductive bond pads comprises:

introducing an adhesive material that includes a plurality of electrically conductive beads between the second plurality of flexure tail conductive bond pads and the first plurality of flexure tail conductive bond pads, and

bringing a thermode tool into contact with the second bonding region, with the thermode tool pressing the second plurality of flexure tail conductive bond pads against the first plurality of flexure conductive bond pads for a period.

12. The method of claim 11 wherein bringing the thermode tool into contact with the second bonding region comprises using a flat face of the thermode tool to apply pressure to a large enough area of the second bonding region that all of the second plurality of flexure tail conductive bond pads are bonded to corresponding ones of the first plurality of flexure tail conductive bond pads simultaneously.

13. The method of claim 11 wherein the thermode tool transfers heat through the second bonding region and raises the temperature of the adhesive material during the period.

14. The method of claim 9 wherein attaching the replacement suspension to the arm comprises swaging the replacement suspension to the arm.

15. The method of claim 9 wherein bonding each of the second plurality of flexure tail conductive bond pads to a corresponding one of the first plurality of flexure tail conductive bond pads establishes a plurality of electrical connections from the second bonding region to the FPC, through the first bonding region.

16. The method of claim 9 wherein each of the first plurality of flexure tail conductive bond pads includes a copper island facing the FPC and a stainless steel island facing the second bonding region of the replacement flexure tail, with the copper island being electrically connected to the stainless steel island by a via through a dielectric layer.

17. The method of claim 9 wherein each of the first plurality of flexure tail conductive bond pads includes a gold coating.

18. The method of claim 9 wherein each of the first plurality of flexure tail conductive bond pads is bonded to the corresponding one of the plurality of FPC bond pads by an anisotropic conductive film.

19. The method of claim 9 wherein detaching the first suspension from the arm comprises de-swaging the first suspension from the arm.

20. The method of claim 9 wherein testing the HSA includes testing the first read head.