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Atomic layer etching of tungsten for enhanced tungsten deposition fill

  • US 9,972,504 B2
  • Filed: 08/19/2015
  • Issued: 05/15/2018
  • Est. Priority Date: 08/07/2015
  • Status: Active Grant
First Claim
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1. A method of filling features on a substrate, the method comprising:

  • (a) depositing a first amount of a metal in a feature; and

    (b) preferentially etching the deposited first amount of the metal at or near an opening of the feature relative to an interior region of the feature by(i) modifying a surface of the deposited first amount of the metal by exposing the metal to a halogen-containing gas, wherein the surface is modified preferentially at or near the opening of the feature relative to the interior region of the feature; and

    (ii) exposing the modified surface to an activation gas to preferentially etch the metal at or near the opening of the feature relative to the interior region of the feature.

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