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Method for producing 3D-structured thin films

  • US 9,972,827 B2
  • Filed: 02/24/2014
  • Issued: 05/15/2018
  • Est. Priority Date: 02/25/2013
  • Status: Expired due to Fees
First Claim
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1. A method for producing a stack of layers comprising at least one structured 3D pattern, the method comprising:

  • providing a first mould provided with a textured front surface comprising a first 3D pattern, the first 3D pattern presenting a section increasing or decreasing monotonously in a direction perpendicular to the textured front surface;

    depositing a first layer of the stack on the textured front surface so as to cover the first 3D pattern by means of a continuous layer, the first layer having a first surface in contact with the textured front surface of the first mould;

    removing the first mould so as to release the first surface of the first layer presenting a second 3D pattern complementary to the first 3D pattern; and

    depositing conformally a second layer of the stack on the first surface of the first layer so as to cover the second 3D pattern by means of a conform continuous layer;

    wherein a third layer is conformally deposited on the second layer, wherein the second layer is an electrolyte layer and wherein the first and third layers are anode or cathode of an electrochemically active stack formed by the first layer, the second layer and the third layer.

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