Method for producing 3D-structured thin films

• US 9,972,827 B2
• Filed: 02/24/2014
• Issued: 05/15/2018
• Est. Priority Date: 02/25/2013
• Status: Expired due to Fees

• Current Assignee: Centre National De La Recherche Scientifique, Commissariat a L'Energie Atomique (French Alternative Energies and Atomic Energy Commission)
• Original Assignee: Centre National De La Recherche Scientifique, Commissariat a L'Energie Atomique (French Alternative Energies and Atomic Energy Commission)
• Inventors: Porthault, Hlne, Le Cras, Frdric, Franger, Sylvain
• Primary Examiner(s): Rufo, Louis J
• Application Number:
  US14/770,238
• Publication Number:
  US 20160006016A1
• Time in Patent Office: 1,541 Days
• CPC Class Codes: C25D 9/08 by cathodic processes
• CPC Class Codes: H01M 10/052 Li-accumulators
• CPC Class Codes: H01M 10/058 Construction or manufacture
• CPC Class Codes: H01M 2004/025 with shapes other than plane or cylindrical
• CPC Class Codes: H01M 2220/30 Batteries in portable systems, e.g. mobile phone, laptop
• CPC Class Codes: H01M 4/045 Electrochemical coating; Electrochemical impregnation
• CPC Class Codes: H01M 4/139 Processes of manufacture
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

The method for producing a stack of films provided with at least one 3D-structured pattern including providing a first mold having a textured front face including a first 3D pattern, depositing a first layer of the stack on the textured front face so as to cover the first 3D pattern by a continuous layer, the first layer having a first face in contact with the front face of the mold, removing the first mold so as to release the first face of the first layer having a second 3D pattern complementary to the first 3D pattern and depositing a second layer of the stack on the first face of the first layer so as to cover the second 3D pattern by a continuous layer.

Claims

1. A method for producing a stack of layers comprising at least one structured 3D pattern, the method comprising:

providing a first mould provided with a textured front surface comprising a first 3D pattern, the first 3D pattern presenting a section increasing or decreasing monotonously in a direction perpendicular to the textured front surface;

depositing a first layer of the stack on the textured front surface so as to cover the first 3D pattern by means of a continuous layer, the first layer having a first surface in contact with the textured front surface of the first mould;

removing the first mould so as to release the first surface of the first layer presenting a second 3D pattern complementary to the first 3D pattern; and

depositing conformally a second layer of the stack on the first surface of the first layer so as to cover the second 3D pattern by means of a conform continuous layer;

wherein a third layer is conformally deposited on the second layer, wherein the second layer is an electrolyte layer and wherein the first and third layers are anode or cathode of an electrochemically active stack formed by the first layer, the second layer and the third layer.

2. The method according to claim 1, wherein before the removal of the first mould, at least one first additional metal layer is deposited conformally on the first layer, the first layer separating the first additional metal layer from the first mould.

3. The method according claim 1, wherein the first 3D pattern is formed by a blind hole opening onto the front surface of the first mould, the first 3D pattern being surrounded by a planar ring made in the front surface.

4. The method according to claim 1, wherein before the removal of the first mould, a support substrate is fixed on the first layer so that the first layer is interposed between the first mould and the support substrate,

wherein in the deposition of the second layer, the first layer and the second layer form a self-supported stack and the support substrate is removed from the first layer after depositing the second layer.

5. The method according to claim 4, wherein the support substrate is an adhesive substrate bonded to the first layer of the stack, the adhesive substrate having a bonding energy with the first layer higher than a bonding energy between the first layer and the first mould so that the first mould is removed from the first layer by applying a strain by means of the support substrate after removal of the first mould.

6. The method according to claim 4, wherein the support substrate is removed after depositing the second layer.

7. The method according to claim 1, wherein the first layer is deposited conformally so that the electrochemically active stack has a shape corresponding to the textured front surface of the first mould with the first 3D pattern.

8. The method according to claim 2,

wherein before the removal of the first mould, a support substrate is fixed on the first additional layer so that the first additional layer is interposed between the first mould and the support substrate,

wherein in the deposition of the second layer, the first additional layer, the first layer and the second layer form a self-supported stack, and

wherein the support substrate is removed from the first additional layer after depositing the second layer.

9. The method according to claim 8, wherein the support substrate is an adhesive substrate bonded to the first additional layer of the stack, the adhesive substrate having a bonding energy with the first additional layer higher than a bonding energy between the first layer and the first mould so that the first mould is removed from the first layer by applying a strain by means of the support substrate removal of the first mould.

10. The method according to claim 8, wherein the support substrate is removed from the first additional layer by means of a chemical etch of an adhesive bonding between the support substrate and the first additional layer.

11. The method according to claim 5, wherein the support substrate is removed from the first layer by means of a chemical etch of an adhesive bonding between the support substrate and the first layer.

12. The method according to claim 1, wherein the electrolyte layer is made of a solid electrolyte material.

13. The method according to claim 1, wherein the second layer is made of silica and the first 3D pattern has a shape chosen among micropyramids and array of lines.

14. The method according to claim 1, wherein the textured front surface comprises a plurality of 3D patterns configured to form microlenses and waveguides.

15. The method according to claim 2, wherein the first layer is deposited conformally.

16. The method according to claim 1, wherein the third layer is deposited conformally.

17. A method for producing a stack of layers comprising at least one structured 3D pattern, the method comprising:

providing a first mould provided with a textured front surface comprising a first 3D pattern, the first 3D pattern presenting a section increasing or decreasing monotonously in a direction perpendicular to the textured front surface;

depositing a first layer of the stack on the textured front surface so as to cover the first 3D pattern by means of a continuous layer, the first layer having a first surface in contact with the textured front surface of the first mould;

removing the first mould so as to release the first surface of the first layer presenting a second 3D pattern complementary to the first 3D pattern; and

depositing conformally a second layer of the stack on the first surface of the first layer so as to cover the second 3D pattern by means of a conform continuous layer;

wherein the textured front surface of the mould is electrically conducting, and wherein the first layer is deposited by electrodeposition by hydrothermal means.

18. The method according to claim 17, wherein the first layer comprises a lithiated oxide of at least one transition metal chosen from the group comprising nickel, cobalt, manganese, titanium and a mixture of these metals.