Miniature high density opto-electronic package

• US 9,974,163 B2
• Filed: 12/28/2012
• Issued: 05/15/2018
• Est. Priority Date: 12/28/2012
• Status: Active Grant

• Current Assignee: Futurewei Technologies Incorporated (Huawei Investment & Holding Co., Ltd.)
• Original Assignee: Futurewei Technologies Incorporated (Huawei Investment & Holding Co., Ltd.)
• Inventors: Chen, Morgan, Miao, Rongsheng, Zheng, Xueyan, Li, Bo, Shen, Xiao, Bai, Yu Sheng
• Primary Examiner(s): Tran, Binh
• Application Number:
  US13/729,518
• Publication Number:
  US 20140185253A1
• Time in Patent Office: 1,964 Days
• Field of Search: 174251, 174257, 174259
• CPC Class Codes: G02B 6/4274 Electrical aspects G02B6/4263 and G02B6/4265 take precedence
• CPC Class Codes: H05K 1/0219 Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 1/097 Inks comprising nanoparticles and specially adapted for being sintered at low temperature H05K1/095 takes precedence
• CPC Class Codes: H05K 2201/10121 Optical component, e.g. opto-electronic component
• CPC Class Codes: H05K 2203/0278 Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion

Abstract

A method comprising coupling a circuit to an opto-electronic package via an anisotropic conductive film (ACF), wherein the opto-electronic package is configured to communicate electrical signals via the coupling at a maximum frequency of about 10 gigahertz (GHz) to about 40 GHz. An apparatus comprising, an opto-electronic package comprising a plurality of first electrodes, and a circuit comprising a plurality of second electrodes, wherein at least one of the first electrodes is coupled to at least one of the second electrodes via an ACF, and wherein the opto-electronic package is configured to communicate electrical signals via the coupling at a maximum frequency of about 10 GHz to about 40 GHz.

Claims

1. An apparatus comprising:

an opto-electronic package comprising a plurality of first electrodes and a plurality of optical components, wherein the package is configured for transmission of optical and electrical signals;

a circuit comprising a plurality of second electrodes;

an anisotropic conductive film (ACF) compressed between at least a portion of the opto-electronic package and at least a portion of the circuit, wherein at least one of the first electrodes is mechanically coupled to at least one of the second electrodes via the ACF;

a plurality of conductive traces are configured to connect the optical components and the first electrodes, wherein a first plurality of the conductive traces fan out in parallel in a first direction, a second plurality of the conductive traces fan out in parallel in a second direction, a third plurality of the conductive traces fan out in parallel in a third direction, a fourth plurality of the conductive traces fan out in parallel in a fourth direction, wherein the first direction, second direction, third direction and fourth direction are each different and the conductive traces comprise substantially similar lengths.

2. The apparatus of claim 1, wherein the ACF comprises a dielectric material and a plurality of conductive elements disposed in the dielectric material, and wherein the conductive elements each comprise a substantially spherical shape.

3. The apparatus of claim 2, wherein the conductive elements each have a diameter of about 10 microns.

4. The apparatus of claim 3, wherein the conductive elements each comprise gold.

5. The apparatus of claim 4, wherein the ACF comprises a conductive element density of about 800 conductive elements per square millimeter.

6. The apparatus of claim 5, wherein the conductive elements are substantially evenly distributed throughout the ACF.

7. The apparatus of claim 1, wherein the opto-electronic package is configured to communicate direct current electrical signals via the coupling.

8. An apparatus comprising:

an opto-electronic package comprising a plurality of first electrodes and a receiver optical sub-assembly (ROSA) or a transmitter optical sub-assembly (TOSA);

a circuit comprising a plurality of second electrodes;

an anisotropic conductive film (ACF) compressed between at least a portion of the opto-electronic package and at least a portion of the circuit, wherein at least one of the first electrodes is mechanically coupled to at least one of the second electrodes via the ACF;

a plurality of conductive traces are configured to connect the first electrodes and the ROSA or the TOSA, wherein a first plurality of the conductive traces fan out in parallel in a first direction, a second plurality of the conductive traces fan out in parallel in a second direction, a third plurality of the conductive traces fan out in parallel in a third direction, a fourth plurality of the conductive traces fan out in parallel in a fourth direction, wherein the first direction, second direction, third direction and fourth direction are each different and the conductive traces comprise substantially similar lengths.

9. The apparatus of claim 8, wherein the opto-electronic package comprises a pin pitch of about 10 micrometers (microns) to about 700 microns.