Circuit board and method for fabricating the same

• US 9,974,171 B2
• Filed: 11/17/2015
• Issued: 05/15/2018
• Est. Priority Date: 05/23/2013
• Status: Active Grant

• Current Assignee: BYD Company Limited
• Original Assignee: BYD Company Limited
• Inventors: Xu, Qiang, Lin, Xinping
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US14/943,747
• Publication Number:
  US 20160073497A1
• Time in Patent Office: 910 Days
• Field of Search: 174257, 174258, 174266, 174256, 361783, 257664, 257758, 148244, 148264, 148272, 148275, 4281951, 428209, 428447, 428472, 428544, 428551, 428607, 438158, 438688, 252582
• CPC Class Codes: C23C 18/1608 from pretreatment step, i.e. selective pre-treatment
• CPC Class Codes: C23C 18/1612 through irradiation means
• CPC Class Codes: C23C 18/1868 Radiation, e.g. UV, laser
• CPC Class Codes: C23C 18/1879 Use of metal, e.g. activation, sensitisation with noble metals
• CPC Class Codes: C23C 18/40 using reducing agents
• CPC Class Codes: C25D 11/08 containing inorganic acids
• CPC Class Codes: C25D 11/10 containing organic acids
• CPC Class Codes: C25D 11/16 Pretreatment , e.g. desmutting
• CPC Class Codes: C25D 11/246 for sealing layers
• CPC Class Codes: H05K 1/053 the metal substrate being covered by an inorganic insulating layer
• CPC Class Codes: H05K 2201/0116 Porous, e.g. foam
• CPC Class Codes: H05K 2203/0315 Oxidising metal
• CPC Class Codes: H05K 2203/107 Using laser light
• CPC Class Codes: H05K 2203/1147 Sealing or impregnating, e.g. of pores
• CPC Class Codes: H05K 3/185 by making a catalytic pattern by photo-imaging
• CPC Class Codes: H05K 3/44 Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits H05K3/0058, H05K3/4608, and H05K3/4641 take precedence

Abstract

Embodiments of the present disclosure are directed to a circuit board. The circuit board comprises: an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof.

Claims

1. A circuit board, comprising:

an aluminum-based substrate;

an alumina layer formed on at least one surface of the aluminum-based substrate, wherein the alumina layer includes a circuit pattern formed by irradiation of an energy beam; and

a circuit layer formed on the circuit pattern of the alumina,

wherein the alumina layer comprises alumina and at least one element selected from chromium, lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, thulium, ytterbium, lutetium, scandium, or a combination thereof.

2. The circuit board according to claim 1, wherein a content of the element in the alumina layer ranges from 0.001 wt % to 20 wt %.

3. The circuit board according to claim 1, wherein the content of the element in the alumina layer ranges from 0.01 wt % to 1 wt %.

4. The circuit board according to claim 1, wherein a thickness of the alumina layer ranges from 10 μ

m to 300 μ

m.

5. The circuit board according to claim 1, wherein the thickness of the alumina layer ranges from 50 μ

m to 100 μ

m.

6. The circuit board according to claim 1, wherein the alumina layer is sealed with a sealing agent.

7. The circuit board according to claim 6, wherein the sealing agent is selected from one or more dichromate, one or more nickel salt, one or more rare earth metal salt, or a combination thereof.

8. The circuit board according to claim 6, wherein the sealing agent is selected from potassium dichromate, sodium dichromate, nickel fluoride, nickel acetate, nickel sulfate, or a combination thereof.