Semiconductor package having a waveguide antenna and manufacturing method thereof

• US 9,978,688 B2
• Filed: 02/28/2013
• Issued: 05/22/2018
• Est. Priority Date: 02/28/2013
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Yen, Han-Chee, Chen, Shih-Yuan, Lai, Chien-Pai, Cheng, Ming-Hsien
• Primary Examiner(s): Ahmad, Khaja
• Application Number:
  US13/781,606
• Publication Number:
  US 20140239465A1
• Time in Patent Office: 1,909 Days
• Field of Search: None
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/81005 being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85005 being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A semiconductor package comprises a substrate, a grounding layer, a encapsulant, a shielding layer, and a conductive element. The substrate includes a chip. The encapsulant encapsulates the grounding layer and the chip, wherein the encapsulant has an upper surface. The shielding layer is formed on the upper surface of the encapsulant. The conductive element surrounds a waveguide cavity and extends to the grounding layer. The grounding layer, the shielding layer and the conductive element together form a waveguide antenna.

Claims

1. A semiconductor package comprising:

a substrate including a chip;

a grounding layer disposed on the substrate;

an encapsulant covering the chip and the grounding layer;

a conductive via extending from an upper surface of the encapsulant to the grounding layer;

a shielding layer disposed on the encapsulant, the shielding layer

electrically connected to the conductive via;

at least one signal emitting opening in the encapsulant exposing a cavity defining a waveguide;

a feeding contact on the substrate; and

a conductive element disposed directly on the feeding contact and encapsulated by the encapsulant;

wherein the signal emitting opening is disposed on a lateral surface of the encapsulant and corresponds to the conductive element, and

wherein the conductive via and the conductive element are arranged along the waveguide, and

wherein the conductive via and the conductive element have a substantially same height.

2. The semiconductor package of claim 1, wherein the grounding layer, the shielding layer, the conductive via and the conductive element form an antenna.

3. The semiconductor package of claim 1, wherein the conductive via is useable to transmit a radio frequency signal.

4. The semiconductor package of claim 1, wherein the at least one signal emitting opening includes an opening formed on a lateral surface of the encapsulant.

5. The semiconductor package of claim 1, wherein the at least one signal emitting opening includes a plurality of openings formed on the upper surface of the encapsulant.

6. The semiconductor package of claim 5, wherein the openings are substantially rectangular and arranged in a linear fashion.

7. The semiconductor package of claim 1, wherein the conductive via and the conductive element are arranged along the waveguide to form a funnel-like pattern.

8. The semiconductor package of claim 1, further including a conductive frame within the cavity extending from the conductive via outwardly to the signal emitting opening.

9. A semiconductor package comprising:

a substrate including a chip;

a package body encapsulating the chip;

a grounding layer disposed on an upper surface of the package body;

an encapsulant covering the package body and the grounding layer;

a conductive via extending from an upper surface of the encapsulant to the grounding layer;

a shielding layer disposed on the encapsulant, the shielding layer electrically connected to the conductive via;

at least one signal emitting opening in the encapsulant exposing a cavity defining a waveguide;

a feeding contact on the substrate; and

a conductive element disposed directly on the feeding contact and encapsulated by the encapsulant;

wherein the signal emitting opening is disposed on a lateral surface of the encapsulant and corresponds to the conductive element, and

wherein the conductive via and the conductive element are arranged along the waveguide.

10. The semiconductor package of claim 9, wherein the conductive via is useable to transmit a radio frequency signal.

11. The semiconductor package of claim 9, wherein the grounding layer, the shielding layer, the conductive via and the conductive element form an antenna.

12. The semiconductor package of claim 9, wherein the waveguide overlaps the chip.

13. The semiconductor package of claim 9, wherein the waveguide is funnel shaped.

14. The semiconductor package of claim 9, wherein the conductive via and the conductive element are arranged along the waveguide to form a funnel-like pattern.