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Semiconductor device including leadframe with a combination of leads and lands and method

  • US 9,978,695 B1
  • Filed: 03/13/2017
  • Issued: 05/22/2018
  • Est. Priority Date: 01/27/2011
  • Status: Active Grant
First Claim
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1. A semiconductor device, comprising:

  • a die pad;

    first lands in spaced relation to the die pad, wherein each of the first lands has a first land first top recessed portion disposed on a first land first end distal to the die pad, and wherein each of the first lands has a first land second top recessed portion disposed on a first land second end proximate to the die pad;

    second lands in spaced relation to and detached from the die pad, wherein each of the second lands is detached from the first lands, and wherein each of the second lands has a second land first bottom recessed portion disposed on a second land first end distal to the die pad, and wherein each of the second lands has a second land second bottom recessed portion disposed on a second land second end proximate to the die pad, and wherein each second land second end proximate to the die pad comprises a top surface devoid of a recessed portion;

    a semiconductor die electrically coupled to the first and second lands; and

    a package body defining a bottom surface and a side surface, the package body at least partially encapsulating the first and second lands and the semiconductor die such that at least portions of the first and second lands are exposed in the bottom surface of the package body, wherein;

    the first land first recessed top portion of each first land and the second land first bottom recessed portion of each second land are encapsulated by the package body; and

    the second lands are positioned proximate to the side surface.

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