Semiconductor device including leadframe with a combination of leads and lands and method
First Claim
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1. A semiconductor device, comprising:
- a die pad;
first lands in spaced relation to the die pad, wherein each of the first lands has a first land first top recessed portion disposed on a first land first end distal to the die pad, and wherein each of the first lands has a first land second top recessed portion disposed on a first land second end proximate to the die pad;
second lands in spaced relation to and detached from the die pad, wherein each of the second lands is detached from the first lands, and wherein each of the second lands has a second land first bottom recessed portion disposed on a second land first end distal to the die pad, and wherein each of the second lands has a second land second bottom recessed portion disposed on a second land second end proximate to the die pad, and wherein each second land second end proximate to the die pad comprises a top surface devoid of a recessed portion;
a semiconductor die electrically coupled to the first and second lands; and
a package body defining a bottom surface and a side surface, the package body at least partially encapsulating the first and second lands and the semiconductor die such that at least portions of the first and second lands are exposed in the bottom surface of the package body, wherein;
the first land first recessed top portion of each first land and the second land first bottom recessed portion of each second land are encapsulated by the package body; and
the second lands are positioned proximate to the side surface.
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Abstract
A semiconductor device includes a die pad, a plurality of first lands each having a first land first top recessed portion disposed on a first land first end distal to the die pad, and a plurality of second lands each having a second land first bottom recessed portion disposed on a second land first end distal to the die pad. A semiconductor die is electrically connected to the first and second lands. A package body, which defines a bottom surface and a side surface, at least partially encapsulating the first and second lands and the semiconductor die such that at least portions of the first and second lands are exposed in and substantially flush with the bottom surface of the package body.
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Citations
20 Claims
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1. A semiconductor device, comprising:
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a die pad; first lands in spaced relation to the die pad, wherein each of the first lands has a first land first top recessed portion disposed on a first land first end distal to the die pad, and wherein each of the first lands has a first land second top recessed portion disposed on a first land second end proximate to the die pad; second lands in spaced relation to and detached from the die pad, wherein each of the second lands is detached from the first lands, and wherein each of the second lands has a second land first bottom recessed portion disposed on a second land first end distal to the die pad, and wherein each of the second lands has a second land second bottom recessed portion disposed on a second land second end proximate to the die pad, and wherein each second land second end proximate to the die pad comprises a top surface devoid of a recessed portion; a semiconductor die electrically coupled to the first and second lands; and a package body defining a bottom surface and a side surface, the package body at least partially encapsulating the first and second lands and the semiconductor die such that at least portions of the first and second lands are exposed in the bottom surface of the package body, wherein; the first land first recessed top portion of each first land and the second land first bottom recessed portion of each second land are encapsulated by the package body; and the second lands are positioned proximate to the side surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor device, comprising:
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a die pad; first lands extending along peripheral edge segments of the die pad in spaced relation thereto, wherein each of the first lands has a first land first top recessed portion disposed on a first land first end distal to the die pad; second lands extending along peripheral edge segments of the die pad in spaced relation thereto, wherein each of the second lands is detached from the first lands, and wherein each of the second lands has a second land first bottom recessed portion disposed on a second land first end distal to the die pad, and wherein each of the second lands has a second land first bottom recessed portion disposed on a second land second end proximate to the die pad, and wherein each second land second end comprises a top surface devoid of a recessed portion; a semiconductor die electrically coupled to the first and second lands; and a package body defining a bottom surface and a side surface, the package body at least partially encapsulating the first and second lands and the semiconductor die such that at least portions of the first and second lands are exposed in the bottom surface of the package body, wherein; the second lands are positioned proximate to the side surface. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A semiconductor device, comprising:
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a semiconductor die defining multiple peripheral edge segments; first lands segregated into at least two sets extending along respective ones of at least two peripheral edge segments of the semiconductor die, wherein each of the first lands has a first land first top recessed portion disposed on a first land first end distal to the semiconductor die, and wherein each of the first lands has a first land second top recessed portion disposed on a first land second end proximate to the semiconductor die, and wherein each first land second end comprises a bottom surface devoid of a recessed portion; second lands segregated into at least two sets extending along respective ones of at least two peripheral edge segments of the semiconductor die; third lands segregated into at least two sets extending along respective ones of at least two peripheral edge segments of the semiconductor die, wherein each of the third lands is detached from the first lands, and wherein each of the third lands has a third land first bottom recessed portion disposed on a third land first end distal to the semiconductor die, and wherein each of the third lands has a third land first bottom recessed portion disposed on a third land second end proximate the semiconductor die, and wherein each third land first end comprises a top surface devoid of a recessed portion; and a package body defining a bottom surface and a side surface, the package body at least partially encapsulating the first, second, and third lands and the semiconductor die such that at least portions of the first, second, and third lands are exposed in the bottom surface of the package body, wherein; the semiconductor die is electrically coupled to the first, second, and third lands; and the third lands are positioned proximate to the side surface of the package body. - View Dependent Claims (19, 20)
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Specification