Dual orientation electronic connector

• US 9,979,139 B2
• Filed: 03/29/2017
• Issued: 05/22/2018
• Est. Priority Date: 11/07/2011
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Golko, Albert J., Jol, Eric S., Schmidt, Mathias W., Terlizzi, Jeffrey J.
• Primary Examiner(s): Paumen, Gary
• Application Number:
  US15/473,480
• Publication Number:
  US 20170338603A1
• Time in Patent Office: 419 Days
• Field of Search: 43960741, 439218, 439660, 43960701, 439606
• CPC Class Codes: H01R 13/516 Means for holding or embracing insulating body, e.g. casing , hoods
• CPC Class Codes: H01R 13/642 by position or shape of contact members
• CPC Class Codes: H01R 13/6582 with resilient means for engaging mating connector
• CPC Class Codes: H01R 13/6588 with through openings for individual contacts
• CPC Class Codes: H01R 13/665 with built-in electronic circuit H01R13/70, H01R13/719 take precedence
• CPC Class Codes: H01R 13/6683 with built-in sensor
• CPC Class Codes: H01R 13/6691 with built-in signalling means H01R13/717 takes precedence
• CPC Class Codes: H01R 2107/00 Four or more poles
• CPC Class Codes: H01R 24/28 Coupling parts carrying pins, blades or analogous contacts and secured only to wire or cable
• CPC Class Codes: H01R 24/60 Contacts spaced along planar side wall transverse to longitudinal axis of engagement
• CPC Class Codes: H01R 24/64 for high frequency, e.g. RJ 45
• CPC Class Codes: H01R 25/00 Coupling parts adapted for simultaneous co-operation with two or more identical counterparts, e.g. for distributing energy to two or more circuits supported only by co-operation with a counterpart H01R31/00; with a holder adapted for supporting apparatus to which its counterpart is attached H01R33/88
• CPC Class Codes: H04L 12/40013 Details regarding a bus controller
• CPC Class Codes: H04L 12/40078 Bus configuration home automation networks H04L12/2803; arrangements for maintenance or administration H04L41/00

Abstract

An electronic device that includes a plug connector having a tab adapted to be inserted into a receptacle connector of a second device during a mating event, the tab including first and second opposing surfaces and a contact region formed at the first surface of the tab, the contact region including a plurality of contacts spaced apart along a first row, the plurality of contacts including a first contact, a power contact and a ground contact; a computer-readable memory having identification, configuration and authentication information relevant to the electronic device that can be communicated to the second device during a mating event stored therein; circuitry coupled to the first contact and configured to, after a mating event in which the plug connector is inserted into the receptacle connector, participate in a handshaking algorithm that includes receiving a command over the first contact from the second device and sending a response to the command that includes contact configuration information for the electronic device over the first contact to the second device; and power circuitry, coupled to the power contact, configured to deliver power to charge a device coupled to the electronic device via the plug connectors.

Claims

1. A method of manufacturing a plug connector including an insertion end having a width, height and length, the method comprising:

providing a conductive frame having an interior cavity defined by first and second opposing sides extending in the width and length dimensions, third and fourth opposing sides extending between the first and second sides in the height and length dimensions, and a tip extending between first and second opposing sides in the width and height dimensions at a first end of the conductive frame, the conductive frame including an opening at a second end of the conductive frame opposite the first end, and the first side including a first window that opens into the cavity;

inserting a printed circuit board into the cavity through the opening at the second end of the conductive frame such that a first plurality of contact bonding pads formed on the printed circuit board are exposed within the first window;

positioning a contact assembly having a plurality of contacts supported by a dielectric frame within the first window; and

electrically connecting the plurality of contacts to the first plurality of bonding pads on the printed circuit board.

2. The method of claim 1 further comprising, after the step of electrically connecting the plurality of contacts to the first plurality of bonding pads on the printed circuit board, placing the conductive frame and contact assembly in an insert molding tool and forming a dielectric overmold around the plurality of contacts within the first window.

3. The method of claim 2 further comprising attaching a cable bundle comprising a plurality of wires to the connector.

4. The method of claim 3 wherein a plurality of integrated circuits are formed on a portion of the printed circuit board that extends beyond the conductive frame and wherein the method further comprises overmolding a portion of the connector, including the plurality of electronic components and a portion of the cable bundle, with a plastic material forming a body coupled to the insertion end.

5. The method of claim 1 wherein:

the second side of the conductive frame includes a second window that opens into the cavity;

the printed circuit board includes a second plurality of bonding pads; and

the step of inserting a printed circuit board into the cavity positions the printed circuit board such that the second plurality of contact bonding pads formed on the printed circuit board are exposed within the second window.

6. The method of claim 1 wherein the step of positioning a contact assembly comprises aligning an alignment post on the contact assembly with a guide hole on the printed circuit board.

7. The method of claim 6 wherein the step of positioning a contact assembly further comprises positioning the contact assembly such that crushable cones extending from a surface of the contact assembly come into physical contact with the printed circuit board.

8. The method of claim 7 wherein the step of electrically connecting the plurality of contacts to the plurality of bonding pads on the printed circuit board comprises applying solder to the plurality of bonding pads and heating the solder bumps above a melting temperature of the solder using a hot bar.

9. The method of claim 8 wherein the step of electrically connecting the plurality of contacts to the plurality of bonding pads on the printed circuit board further comprises depressing the contact assembly with the hotbar until the hot bar stops on an exterior surface of the first side of the ground ring.

10. The method of claim 9 wherein the step of electrically connecting the plurality of contacts to the plurality of bonding pads on the printed circuit board further comprises cooling the hot bar tool until the solder solidifies and, thereafter, retracting the hot bar tool away from the ground ring.

11. The method of claim 1 wherein each contact in the first plurality of contacts includes an elongated contact surface.

12. The method of claim 11 wherein the first plurality of contacts are spaced apart from each other in a single row.

13. The method of claim 11 wherein each contact in the first plurality of contacts includes first and second protrusions at a bottom surface of the contact opposite the elongated contact surface.

14. A method of manufacturing a plug connector having an insertion end with a width, height and length, the method comprising:

providing a conductive frame having first and second opposing sides extending in the width and length dimensions, and a tip extending between first and second opposing sides in the width and height dimensions at a first end of the conductive frame, the first side including a first window and the second side including a second window;

aligning a printed circuit board between the first and second opposing sides such that a first plurality of contact bonding pads formed on a first side of the printed circuit board are exposed within the first window and a second plurality of contact bonding pads formed on a second side of the printed circuit board are exposed within the second window;

positioning a first contact assembly having a first plurality of contacts supported by a dielectric frame within the first window;

positioning a second contact assembly having a second plurality of contacts supported by a dielectric frame within the second window; and

electrically connecting the first plurality of contacts to the first plurality of bonding pads and the second plurality of contacts to the second plurality of bonding pads.

15. The method of claim 14 further comprising, after the step of electrically connecting the plurality of contacts to the first plurality of bonding pads on the printed circuit board, placing the ground ring and contact assembly in an insert molding tool and forming a dielectric overmold around the first plurality of contacts within the first window such that an outer contact surface of each contact in the first plurality of contacts defines a portion of an external surface of the connector.

16. The method of claim 15 further comprising, forming a dielectric overmold around the second plurality of contacts within the second window such that an outer contact surface of each contact in the second plurality of contacts defines a portion of an external surface of the connector.

17. The method of claim 16 further comprising attaching a cable bundle comprising a plurality of wires to the connector.

18. The method of claim 17 wherein a plurality of integrated circuits are formed on a portion of the printed circuit board that extends beyond the conductive frame and wherein the method further comprises overmolding a portion of the connector, including the plurality of electronic components and a portion of the cable bundle, with a plastic material forming a body coupled to the insertion end.

19. The method of claim 14 wherein the step of positioning the first contact assembly comprises:

aligning an alignment post on the first contact assembly with a guide hole on the printed circuit board;

positioning the first contact assembly such that crushable cones extending from a surface of the first contact assembly come into physical contact with the printed circuit board;

contacting the first plurality of contacts with a hot bar and pushing the first contact assembly towards the printed circuit board to partially deform the first plurality of crushable combs;

heating solder bumps formed between the first plurality of contacts and the first plurality of bonding pads above a reflow temperature of the solder; and

pushing the first contact assembly further towards the printed circuit board until the hot bar stops on an exterior surface of the first side of the ground ring.

20. The method of claim 19 wherein the step of positioning the second contact assembly comprises:

aligning an alignment post on the second contact assembly with a guide hole on the printed circuit board;

positioning the second contact assembly such that crushable cones extending from a surface of the second contact assembly come into physical contact with the printed circuit board;

contacting the second plurality of contacts with a hot bar and pushing the second contact assembly towards the printed circuit board to partially deform the second plurality of crushable combs;

heating solder bumps formed between the second plurality of contacts and the second plurality of bonding pads above a reflow temperature of the solder; and

pushing the second contact assembly further towards the printed circuit board until the hot bar stops on an exterior surface of the second side of the ground ring.