Electronic inverter assembly
First Claim
1. An electronic inverter assembly, the assembly comprising:
- an inverter power module comprising one or more pairs of semiconductor switches mounted on a substrate, each pair of semiconductors comprising a low-side semiconductor switch and a high-side semiconductor switch, each of the semiconductor switches comprising a control terminal and switched terminals;
a first circuit board having an outer side adjacent to or facing the inverter power module and a first inner side opposite the outer side;
a first driver portion comprising a set of first components mounted on or associated with the first circuit board;
a second circuit board spaced apart from the first circuit board, the second circuit board having a second inner side facing the first inner side;
a second driver portion comprising a set of second components mounted on or associated with the second circuit board, where the first driver portion and the second driver portion collectively are adapted to provide input signals to the control terminal of each semiconductor switch;
a first edge connector mounted on the first inner side of the first circuit board;
a second edge connector mounted on the second inner side of the second circuit board; and
an interface board with mating edges that mate with the first edge connector and the second edge connector;
wherein a current sensor comprises;
a magnetic field sensor overlying at least a portion of a plurality of conductive traces of a coil; and
one or more flux concentrators on opposite sides of the magnetic field sensor.
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Accused Products
Abstract
A first driver portion comprises a set of first components mounted on or associated with a first circuit board. A second circuit board is spaced apart from the first circuit board. A second driver portion comprises a set of second components mounted on or associated with the second circuit board, where the first driver portion and the second driver portion collectively are adapted to provide input signals to the control terminal of each semiconductor switch of an inverter. A first edge connector is mounted on the first circuit board. A second edge connector is mounted on the second circuit board. An interface board has mating edges that mate with the first edge connector and the second edge connector.
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Citations
15 Claims
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1. An electronic inverter assembly, the assembly comprising:
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an inverter power module comprising one or more pairs of semiconductor switches mounted on a substrate, each pair of semiconductors comprising a low-side semiconductor switch and a high-side semiconductor switch, each of the semiconductor switches comprising a control terminal and switched terminals; a first circuit board having an outer side adjacent to or facing the inverter power module and a first inner side opposite the outer side; a first driver portion comprising a set of first components mounted on or associated with the first circuit board; a second circuit board spaced apart from the first circuit board, the second circuit board having a second inner side facing the first inner side; a second driver portion comprising a set of second components mounted on or associated with the second circuit board, where the first driver portion and the second driver portion collectively are adapted to provide input signals to the control terminal of each semiconductor switch; a first edge connector mounted on the first inner side of the first circuit board; a second edge connector mounted on the second inner side of the second circuit board; and an interface board with mating edges that mate with the first edge connector and the second edge connector;
wherein a current sensor comprises;a magnetic field sensor overlying at least a portion of a plurality of conductive traces of a coil; and one or more flux concentrators on opposite sides of the magnetic field sensor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An electronic inverter assembly, the assembly comprising:
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an inverter power module comprising one or more pairs of semiconductor switches mounted on a substrate, each pair of semiconductors comprising a low-side semiconductor switch and a high-side semiconductor switch, each of the semiconductor switches comprising a control terminal and switched terminals; a first circuit board having an outer side adjacent to or facing the inverter power module and a first inner side opposite the outer side; a first driver portion comprising a set of first components mounted on or associated with the first circuit board; a second circuit board spaced apart from the first circuit board, the second circuit board having a second inner side facing the first inner side; a second driver portion comprising a set of second components mounted on or associated with the second circuit board, where the first driver portion and the second driver portion collectively are adapted to provide input signals to the control terminal of each semiconductor switch; a first edge connector mounted on the first inner side of the first circuit board; a second edge connector mounted on the second inner side of the second circuit board; and an interface board with mating edges that mate with the first edge connector and the second edge connector, wherein the first circuit board has first plurality of first edge connectors on the first inner side, the second circuit board has a second plurality of second edge connectors on the second inner side, and further comprising a plurality of interface boards for interconnecting the first driver portion and the second driver portion. - View Dependent Claims (15)
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Specification