Multi-band device having multiple miniaturized single-band power amplifiers
First Claim
Patent Images
1. A power amplifier die comprising:
- a semiconductor substrate; and
a plurality of narrow band power amplifiers implemented on the semiconductor substrate, each narrow band power amplifier configured to operate with a high voltage in an average power tracking mode and be capable of being coupled to an output filter associated with a respective individual frequency band, each narrow band power amplifier sized smaller than a wide band power amplifier configured to operate with more than one of the frequency bands associated with the plurality of narrow band power amplifiers.
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Abstract
Multi-band device having multiple miniaturized single-band power amplifiers. In some embodiments, a power amplifier die can include a semiconductor substrate, and a plurality of power amplifiers (PAs) implemented on the semiconductor substrate. Each PA can be configured to drive approximately a characteristic load impedance of a downstream component along an individual frequency band signal path, such that each PA is sized smaller than a wide band PA configured to drive more than one of the frequency bands associated with the plurality of PAs. The downstream component can include an output filter.
43 Citations
15 Claims
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1. A power amplifier die comprising:
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a semiconductor substrate; and a plurality of narrow band power amplifiers implemented on the semiconductor substrate, each narrow band power amplifier configured to operate with a high voltage in an average power tracking mode and be capable of being coupled to an output filter associated with a respective individual frequency band, each narrow band power amplifier sized smaller than a wide band power amplifier configured to operate with more than one of the frequency bands associated with the plurality of narrow band power amplifiers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A radio-frequency module comprising:
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a packaging substrate configured to receive a plurality of components; and a power amplification system implemented on the packaging substrate, and including a plurality of narrow band power amplifiers implemented on a semiconductor substrate, each narrow band power amplifier configured to operate with a high voltage in an average power tracking mode and be capable of being coupled to an output filter associated with a respective individual frequency band, each narrow band power amplifier sized smaller than a wide band power amplifier configured to operate with more than one of the frequency bands associated with the plurality of narrow band power amplifiers. - View Dependent Claims (12, 13, 14)
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15. A wireless device comprising:
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a transceiver configured to generate a signal; a front-end module in communication with the transceiver and having a power amplification system that includes a plurality of narrow band power amplifiers, each narrow band power amplifier configured to operate with a high voltage in an average power tracking mode and be capable of being coupled to an output filter associated with a respective individual frequency band, each narrow band power amplifier sized smaller than a wide band power amplifier configured to operate with more than one of the frequency bands associated with the plurality of narrow band power amplifiers; and an antenna in communication with the front-end module, and configured to transmit an amplified signal generated by the front-end module.
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Specification