Multi-band device having multiple miniaturized single-band power amplifiers
First Claim
Patent Images
1. A power amplifier die comprising:
- a semiconductor substrate; and
a plurality of narrow band power amplifiers implemented on the semiconductor substrate, each narrow band power amplifier configured to operate with a high voltage in an average power tracking mode and be capable of being coupled to an output filter associated with a respective individual frequency band, each narrow band power amplifier sized smaller than a wide band power amplifier configured to operate with more than one of the frequency bands associated with the plurality of narrow band power amplifiers.
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Abstract
Multi-band device having multiple miniaturized single-band power amplifiers. In some embodiments, a power amplifier die can include a semiconductor substrate, and a plurality of power amplifiers (PAs) implemented on the semiconductor substrate. Each PA can be configured to drive approximately a characteristic load impedance of a downstream component along an individual frequency band signal path, such that each PA is sized smaller than a wide band PA configured to drive more than one of the frequency bands associated with the plurality of PAs. The downstream component can include an output filter.
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Citations
15 Claims
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1. A power amplifier die comprising:
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a semiconductor substrate; and a plurality of narrow band power amplifiers implemented on the semiconductor substrate, each narrow band power amplifier configured to operate with a high voltage in an average power tracking mode and be capable of being coupled to an output filter associated with a respective individual frequency band, each narrow band power amplifier sized smaller than a wide band power amplifier configured to operate with more than one of the frequency bands associated with the plurality of narrow band power amplifiers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A radio-frequency module comprising:
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a packaging substrate configured to receive a plurality of components; and a power amplification system implemented on the packaging substrate, and including a plurality of narrow band power amplifiers implemented on a semiconductor substrate, each narrow band power amplifier configured to operate with a high voltage in an average power tracking mode and be capable of being coupled to an output filter associated with a respective individual frequency band, each narrow band power amplifier sized smaller than a wide band power amplifier configured to operate with more than one of the frequency bands associated with the plurality of narrow band power amplifiers. - View Dependent Claims (12, 13, 14)
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15. A wireless device comprising:
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a transceiver configured to generate a signal; a front-end module in communication with the transceiver and having a power amplification system that includes a plurality of narrow band power amplifiers, each narrow band power amplifier configured to operate with a high voltage in an average power tracking mode and be capable of being coupled to an output filter associated with a respective individual frequency band, each narrow band power amplifier sized smaller than a wide band power amplifier configured to operate with more than one of the frequency bands associated with the plurality of narrow band power amplifiers; and an antenna in communication with the front-end module, and configured to transmit an amplified signal generated by the front-end module.
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Specification