Electronic device

• US 9,980,365 B1
• Filed: 02/06/2017
• Issued: 05/22/2018
• Est. Priority Date: 12/27/2016
• Status: Active Grant

• Current Assignee: MSI Computer Company Limited (Micro-Star International Co., Ltd.)
• Original Assignee: MSI Computer Company Limited (Micro-Star International Co., Ltd.)
• Inventors: Chen, Min-Lang
• Primary Examiner(s): Lopez Cruz, Dimary
• Assistant Examiner(s): Azam, Muhammed
• Application Number:
  US15/426,031
• Time in Patent Office: 470 Days
• Field of Search: None
• CPC Class Codes: H01L 23/345 Arrangements for heating thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H05K 1/0207 using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
• CPC Class Codes: H05K 1/0212 Printed circuits or mounted components having integral heating means
• CPC Class Codes: H05K 1/0268 for electrical inspection or testing
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2203/111 Preheating, e.g. before soldering
• CPC Class Codes: H05K 2203/165 Stabilizing, e.g. temperature stabilization
• CPC Class Codes: H05K 5/04 Metal casings
• CPC Class Codes: H05K 7/20472 Sheet interfaces

Abstract

An electronic device comprises a metal casing, a circuit board and a heating assembly. The metal casing has a storage space. The circuit board is located in the storage space. The heating assembly comprises a first heating part and a second heating part. The first heating part is in thermal contact with the circuit board, and the second heating part is in thermal contact with the metal casing.

Claims

1. An electronic device, comprising:

a metal casing having a storage space;

a circuit board located in the storage space; and

a heating assembly comprising a base part, a first heating part and a second heating part, the first heating part and the second heating part being respectively disposed on two sides of the base part opposite to each other;

wherein the first heating part comprises a first heating sheet, a first aluminum block and a first thermally conductive sheet;

the first aluminum block is stacked on one side of the base part;

the first heating sheet is embedded in one side of the first aluminum block close to the base part;

the first thermally conductive sheet is stacked on one side of the first aluminum block away from the base part;

the first thermally conductive sheet is in thermal contact with the circuit board;

the second heating part comprises a second heating sheet, a second aluminum block and a second thermally conductive sheet;

the second aluminum block is stacked on one side of the base part opposite to the first aluminum block;

the second heating sheet is embedded in one side of the second aluminum block close to the base part;

the second thermally conductive sheet is stacked on one side of the second aluminum block away from the base part; and

the second thermally conductive sheet is in thermal contact with the metal casing.

2. The electronic device according to claim 1, wherein the circuit board has an electrically conductive layer, the first thermally conductive sheet is in thermal contact with the electrically conductive layer.

3. The electronic device according to claim 2, wherein the electrically conductive layer is made of copper.

4. The electronic device according to claim 2, further comprising at least one electronic component, and the at least one electronic component connected to the electrically conductive layer.

5. The electronic device according to claim 4, further comprising at least one temperature sensor and a controller, the at least one temperature sensor close to the at least one electronic component, the at least one temperature sensor configured for detecting the temperature of the at least one electronic component, the controller configured for receiving a sensor signal from the at least one temperature sensor, and turning on/off the heating assembly according to the sensor signal.

6. The electronic device according to claim 5, wherein the quantity of the at least one electronic component and the quantity of the at least one temperature sensor are both plural, and the temperature sensors are respectively close to the electronic components.

7. The electronic device according to claim 1, wherein the metal casing has a plurality of fins.