Flexible heat spreader
First Claim
1. An electronic device, comprising:
- a component;
a heat dissipation member coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion;
a flexible member thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side of the flexible portion to the second side of the flexible portion and is to transfer heat from the component to the heat dissipation member, wherein the flexible portion is a hinge assembly that couples a first side of the electronic device to a second side of the electronic device, the hinge assembly being located intermediate to the first side of the electronic device and the second side of the electronic device, wherein the hinge assembly is surrounded by a superelastic material, and wherein the flexible member is affixed to the superelastic material opposite to the hinge assembly; and
a structural memory member that extends along a portion of the flexible member and extends from the first side of the electronic device to the second side of the electronic device, wherein the structural memory member is to flex as the hinge assembly swivels and is to return to an original shape of the structural memory member in response to an application of heat.
1 Assignment
0 Petitions
Accused Products
Abstract
Apparatuses, systems and methods associated with flexible heat spreader design are disclosed herein. In embodiments, an electronic device may include a component, a heat dissipation member, and a flexible member. The heat dissipation member may be coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion. The flexible member may be thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side to the second side and is to transfer heat from the component to the heat dissipation member. Other embodiments may be described and/or claimed.
20 Citations
23 Claims
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1. An electronic device, comprising:
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a component; a heat dissipation member coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion; a flexible member thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side of the flexible portion to the second side of the flexible portion and is to transfer heat from the component to the heat dissipation member, wherein the flexible portion is a hinge assembly that couples a first side of the electronic device to a second side of the electronic device, the hinge assembly being located intermediate to the first side of the electronic device and the second side of the electronic device, wherein the hinge assembly is surrounded by a superelastic material, and wherein the flexible member is affixed to the superelastic material opposite to the hinge assembly; and a structural memory member that extends along a portion of the flexible member and extends from the first side of the electronic device to the second side of the electronic device, wherein the structural memory member is to flex as the hinge assembly swivels and is to return to an original shape of the structural memory member in response to an application of heat. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An electronic device, comprising:
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electronic circuitry located on a first side of a flexible portion of the electronic device;
a display located on a second side of the flexible portion, the display communicatively coupled to the electronic circuitry;a flexible member thermally coupled to a component of the electronic circuitry and a heat dissipation member located on the second side of the flexible portion, wherein the flexible member extends along the flexible portion from the first side of the flexible portion to the second side of the flexible portion and is to transfer heat from the component to the heat dissipation member; a hinge assembly that couples a first side of the electronic device to a second side of the electronic device, the hinge assembly being located intermediate to the first side of the electronic device and the second side of the electronic device, wherein the flexible portion is the hinge assembly; a superelastic material that abuts at least a portion the hinge assembly, wherein the flexible member abuts the superelastic material on a side of the superelastic material opposite to the hinge assembly; and a structural memory member that extends along a portion of the flexible member and extends from the first side of the electronic device to the second side of the electronic device across the hinge assembly, wherein the structural memory member is to flex as the hinge assembly swivels and is to return to an original shape of the structural memory member in response to an application of heat. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
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19. A method of producing an electronic device, comprising:
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thermally coupling a first portion of a flexible member to a component of electronic circuitry located on a first side of a flexible portion of the electronic device; and thermally coupling a second portion of the flexible member to a heat dissipation member located on a second side of the flexible portion, the flexible member extending along the flexible portion from the first side to the second side, wherein the flexible portion is a hinge assembly located intermediate to a first side of the electronic device and a second side of the electronic device; forming a superelastic material along at least a portion of a circumference of the hinge assembly, wherein a third portion of the flexible member abuts the superelastic material on an opposite side of the superelastic material from the hinge assembly; and positioning a structural memory member to extend along a third portion of the flexible member and to extend from the first side of the electronic device to the second side of the electronic device, wherein the structural memory member is to flex as the hinge assembly swivels and is to return to an original shape of the structural memory member in response to an application of heat. - View Dependent Claims (20, 21, 22, 23)
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Specification