Configurable double-sided modular jet impingement assemblies for electronics cooling

• US 9,980,415 B2
• Filed: 08/20/2015
• Issued: 05/22/2018
• Est. Priority Date: 08/20/2015
• Status: Active Grant

• Current Assignee: Toyota Jidosha Kabushiki Kaisha (Toyota Motor Corporation)
• Original Assignee: Toyota Motor Engineering & Manufacturing North America Incorporated (Toyota Motor Corporation)
• Inventors: Zhou, Feng, Dede, Ercan Mehmet
• Primary Examiner(s): Cunningham, Xanthia C
• Application Number:
  US14/831,208
• Publication Number:
  US 20170055378A1
• Time in Patent Office: 1,006 Days
• Field of Search: None
• CPC Class Codes: H05K 7/20927 Liquid coolant without phase change

Abstract

A modular jet impingement assembly includes an inlet tube fluidly coupled to a fluid inlet, an outlet tube fluidly coupled to a fluid outlet, and a modular manifold having a first distribution recess extending into a first side of the modular manifold, a second distribution recess extending into a second side of the modular manifold, a plurality of inlet connection tubes positioned at an inlet end of the modular manifold, and a plurality of outlet connection tubes positioned at an outlet end of the modular manifold. A first manifold insert is removably positioned within the first distribution recess, a second manifold insert is removably positioned within the second distribution recess, and a first and second heat transfer plate each removably coupled to the modular manifold. The first and second heat transfer plates each comprise an impingement surface.

Claims

1. A modular jet impingement assembly comprising:

an inlet tube fluidly coupled to a fluid inlet;

an outlet tube fluidly coupled to a fluid outlet;

a modular manifold comprising;

a first distribution recess extending into a first surface of the modular manifold and a second distribution recess extending into a second surface of the modular manifold, wherein the second surface is separate from the first surface;

a plurality of inlet connection tubes positioned at an inlet end of the modular manifold, wherein at least one inlet connection tube is angled with respect to a surface of the modular manifold, at least one inlet connection tube fluidly couples the inlet tube to the first distribution recess, and at least one inlet connection tube fluidly couples the inlet tube to the second distribution recess;

a plurality of outlet connection tubes positioned at an outlet end of the modular manifold, wherein at least one outlet connection tube fluidly couples the outlet tube to the first distribution recess and at least one outlet connection tube fluidly couples the outlet tube to the second distribution recess;

a first manifold insert removably positioned within the first distribution recess and a second manifold insert removably positioned within the second distribution recess; and

a first heat transfer plate and a second heat transfer plate each removably coupled to the modular manifold, wherein the first and second heat transfer plates each comprise an impingement surface.

2. The modular jet impingement assembly of claim 1, wherein the first surface of the modular manifold is opposite the second surface of the modular manifold.

3. The modular jet impingement assembly of claim 1, wherein the first and second manifold inserts each comprise:

one or more inlet branch channels fluidly coupled to at least one inlet connection tube of the plurality of inlet connection tubes, each inlet branch channel including an impinging slot; and

one or more outlet branch channels fluidly coupled to the one or more inlet branch channels and at least one outlet connection tube of the plurality of outlet connection tubes, each outlet branch channel including a collecting slot.

4. The modular jet impingement assembly of claim 3, wherein the impingement surface of the first and second heat transfer plates fluidly couples the impinging slot of the one or more inlet branch channels of the first and second manifold inserts, respectively, to the collecting slot of the one or more outlet branch channels of the first and second manifold inserts, respectively.

5. The modular jet impingement assembly of claim 1, wherein the impingement surface of the first heat transfer plate comprises an array of fins that extend toward the first manifold insert.

6. The modular jet impingement assembly of claim 5, wherein the array of fins are tilted with respect to the impingement surface and at least one fin of the array of fins comprises a cross-sectional area at a base portion of the at least one fin that is larger than a cross-sectional area at a tip portion of the at least one fin.

7. The modular jet impingement assembly of claim 1, wherein the impingement surface of the first heat transfer plate comprises an impingement block extending toward the first manifold insert, wherein the impingement block comprises a non-thermally conductive material.

8. The modular jet impingement assembly of claim 1, wherein the plurality of inlet connection tubes comprise a first inlet connection tube having a first inlet diameter and a second inlet connection tube having a second inlet diameter that is larger than the first inlet diameter.

9. The modular jet impingement assembly of claim 1, wherein the at least one inlet connection tube is angled with respect to the surface of the modular manifold between about 5°

and about 25°

.

10. The modular jet impingement assembly of claim 1, further comprising one or more valves fluidly coupled to the plurality of inlet connection tubes, wherein the one or more valves comprise an electro active polymer and the one or more valves are communicatively coupled to a feedback loop controller, wherein the feedback loop controller provides a signal to the electro active polymer of the one or more valves to adjust a rigidity of the electro active polymer.

11. The modular jet impingement assembly of claim 1, further comprising one or more porous media portions positioned within the inlet tube, at least one inlet connection tube, the outlet tube, or a combination thereof.

12. The modular jet impingement assembly of claim 1, wherein a first modular manifold is removably coupled to a second modular manifold positioned adjacent the first modular manifold and one or more plugs are positioned between the first modular manifold and the second modular manifold such that a fluid flow path through the first modular manifold and the second modular manifold comprises a parallel flow pattern or a series flow pattern.

13. A power electronics module comprising:

a modular jet impingement assembly comprising;

an inlet tube fluidly coupled to a fluid inlet;

an outlet tube fluidly coupled to a fluid outlet;

a modular manifold comprising;

a first distribution recess extending into a first surface of the modular manifold and a second distribution recess extending into a second surface of the modular manifold, wherein the second surface is separate from the first surface;

a plurality of inlet connection tubes positioned at an inlet end of the modular manifold, wherein at least one inlet connection tube is angled with respect to a surface of the modular manifold, at least one inlet connection tube fluidly couples the inlet tube to the first distribution recess, and at least one inlet connection tube fluidly couples the inlet tube to the second distribution recess;

a plurality of outlet connection tubes positioned at an outlet end of the modular manifold, wherein at least one outlet connection tube fluidly couples the outlet tube to the first distribution recess and at least one outlet connection tube fluidly couples the outlet tube to the second distribution recess;

a first manifold insert removably positioned within the first distribution recess and a second manifold insert removably positioned within the second distribution recess; and

a first heat transfer plate and a second heat transfer plate each removably coupled to the modular manifold, wherein the first and second heat transfer plates each comprise an impingement surface; and

an electronics device positioned in thermal contact with the first heat transfer plate.

14. The power electronics module of claim 13, wherein the first and second manifold inserts each comprise:

one or more inlet branch channels fluidly coupled to at least one inlet connection tube of the plurality of inlet connection tubes, each inlet branch channel including an impinging slot; and

one or more outlet branch channels fluidly coupled to the one or more inlet branch channels and at least one outlet connection tube of the plurality of outlet connection tubes, each outlet branch channel including a collecting slot.

15. The power electronics module of claim 14, wherein the impingement surface of the first and second heat transfer plates fluidly couples the impinging slot of the one or more inlet branch channels of the first and second manifold inserts, respectively, to the collecting slot of the one or more outlet branch channels of the first and second manifold inserts, respectively.

16. The power electronics module of claim 14, wherein the plurality of inlet connection tubes comprise a first inlet connection tube having a first inlet diameter and a second inlet connection tube having a second inlet diameter that is larger than the first inlet diameter.

17. The power electronics module of claim 13, wherein the impingement surface of the first heat transfer plate comprises an array of fins that extend toward the first manifold insert and the impingement surface of the second heat transfer plate comprises an impingement block extending toward the second manifold insert, wherein the impingement block comprises a non-thermally conductive material.

18. A power electronics module comprising:

a modular jet impingement assembly comprising;

an inlet tube fluidly coupled to a fluid inlet;

an outlet tube fluidly coupled to a fluid outlet;

a modular manifold comprising a distribution recess extending into the modular manifold, wherein the distribution recess is fluidly coupled to the inlet tube and the outlet tube;

a manifold insert removably positioned within the distribution recess;

a heat transfer plate comprising an impingement surface; and

a bracket extending along a length of the heat transfer plate to removably couple the heat transfer plate to the modular manifold; and

an electronics device positioned in thermal contact with the heat transfer plate, adjacent the bracket.

19. The power electronics module of claim 18, wherein the manifold insert comprises

one or more inlet branch channels fluidly coupled to the inlet tube, each inlet branch channel including an impinging slot;

and

one or more outlet branch channels fluidly coupled to the one or more inlet branch channels and the outlet tube, each outlet branch channel including a collecting slot.

20. The power electronics module of claim 18, wherein the impingement surface of the heat transfer plate comprises an array of fins extending toward the manifold insert or comprises an impingement block extending toward the manifold insert, wherein the impingement block comprises a non-thermally conductive material.