Heat dispersion for implantable medical devices

• US 9,981,137 B2
• Filed: 01/27/2012
• Issued: 05/29/2018
• Est. Priority Date: 01/27/2012
• Status: Active Grant

• Current Assignee: Cirtec Medical Corp.
• Original Assignee: Nuvectra Corporation
• Inventors: Eiger, Jay H
• Primary Examiner(s): Flory, Christopher A
• Application Number:
  US13/359,739
• Publication Number:
  US 20130197608A1
• Time in Patent Office: 2,314 Days
• Field of Search: 607 61, 607115, 607116
• CPC Class Codes: A61N 1/37 Monitoring; Protecting
• CPC Class Codes: A61N 1/3787 from an external energy source

Abstract

An implantable medical device that includes electrical circuitry for providing a therapy to a patient. The device also includes a housing forming an inner chamber that is adapted for receiving, at least a portion of the electrical circuitry. The device further includes a thermally conductive material that is configured to disperse heat from a first portion of the implantable medical device that is located in proximity to a heat generating component of the electrical circuitry, to a second portion of the implantable medical device that is not located in proximity to said heat generating component. The thermally conductive material is a discrete component separate from the electrical circuitry and the housing.

Claims

1. An implantable medical device, comprising:

electrical circuitry including at least one heat generating component;

a housing forming an inner chamber that receives the electrical circuitry sealed within; and

a thermally conductive material that is specifically configured to passively transfer heat from a location in proximity to a said at least one heat generating component of the electrical circuitry to another location of the implantable medical device that is not located in proximity to said heat generating component, wherein the thermally conductive material is comprised of a thermally conductive non-metallic material and is sealed within said housing;

wherein said thermally conductive material is a coating provided on an interior of said housing.

2. An implantable medical device, comprising:

electrical circuitry including at least one heat generating component;

a housing forming an inner chamber that is adapted for receiving said electrical circuitry sealed within; and

a thermally conductive material that is specifically configured to passively transfer heat from a first portion of the implantable medical device that is located in proximity to the at least one heat generating component of the electrical circuitry, to the housing for dissipation into an ambient surrounding of the housing, wherein the thermally conductive material is a discrete component or treatment separate from the electrical circuitry and the housing and is provided within said housing;

wherein said thermally conductive material is a coating provided on an interior of said housing.