Systems and methods for substrate lamination

• US 9,981,460 B1
• Filed: 05/06/2014
• Issued: 05/29/2018
• Est. Priority Date: 05/06/2014
• Status: Active Grant

• Current Assignee: Rockwell Collins, Inc. (Raytheon Technologies Corporation d/b/a RTX)
• Original Assignee: Rockwell Collins, Inc. (Raytheon Technologies Corporation d/b/a RTX)
• Inventors: McCalley, Cameron T., Sampica, James D., Smith, Brian K.
• Primary Examiner(s): Orlando, Michael N
• Assistant Examiner(s): Hoover, Matthew
• Application Number:
  US14/270,587
• Time in Patent Office: 1,484 Days
• CPC Class Codes: B32B 2457/20 Displays, e.g. liquid crystal displays, plasma displays
• CPC Class Codes: B32B 37/1009 using vacuum and fluid pressure

Abstract

A lamination system for laminating substrates includes a lamination device including an upper member defining an upper cavity and a lower member defining a lower cavity; a pressurization system in communication with the upper cavity and the lower cavity; and a control unit coupled to the lamination device and the pressurization system, the control unit configured to control operation of the lamination device and the pressurization system to generate a vacuum environment within the lower cavity; bring a first substrate into contact with a second substrate; pressurize the upper cavity to a first pressure to move the flexible membrane into contact with the first substrate; move the flexible membrane out of contact with the first substrate; and pressurize the lower cavity to a second pressure higher than the first pressure to apply air pressure at the second pressure to the first and second substrates and form a laminated assembly.

Claims

1. A lamination system for laminating substrates to form a laminated assembly, comprising:

a lamination device including an upper member defining an upper cavity, a flexible membrane, and a lower member defining a lower cavity, the lower cavity configured to receive at least a first substrate and a second substrate;

a pressurization system in communication with the upper cavity and the lower cavity; and

a control unit coupled to the lamination device and the pressurization system, the control unit configured to control operation of the lamination device and the pressurization system, wherein the control unit comprises a processing circuit programmed to;

control the pressurization system to generate a vacuum environment within the lower cavity;

then

control at least one substrate support of the lamination device to move the substrate support from a first position, where the substrate support is configured to support the first substrate separated from the second substrate, to a second position, where the substrate support is configured to enable contact between the first substrate and the second substrate, to bring the first substrate into contact with the second substrate;

control the pressurization system to pressurize the upper cavity to a first pressure to move the flexible membrane toward the lower member and into contact with the first substrate;

control the pressurization system to depressurize the upper cavity and to move the flexible membrane toward the upper member and out of contact with the first substrate; and

control the pressurization system to pressurize the lower cavity to a second pressure higher than the first pressure to apply air pressure at the second pressure to the first and second substrates and form a laminated assembly.

2. The system of claim 1, further comprising a heater configured to heat the lamination device such that heat energy is transferred from the lamination device to the first and second substrate.

3. The system of claim 2, wherein the control unit controls operation of the heater to maintain the lamination device at an elevated temperature during pressurization and depressurization of the upper cavity and during pressurization of the lower cavity.

4. The system of claim 3, wherein the elevated temperature is approximately 80 degrees Celsius.

5. The system of claim 1, wherein the control unit is configured to generate the vacuum environment within the lower cavity prior to pressurizing the upper cavity.

6. The system of claim 5, wherein the control unit is configured to maintain the vacuum environment within the lower cavity until after depressurization of the upper cavity.

7. The system of claim 5, wherein the control unit is configured to maintain a portion of the first substrate spaced apart from the second substrate prior to generating the vacuum environment within the lower cavity;

and move the portion of the first substrate into contact with the second substrate prior to pressurizing the upper cavity.

8. The system of claim 1, further comprising an automated loading device configured to position the first and second substrate within the lamination device.

9. The system of claim 8, further comprising an automated unloading device configured to unload the laminated assembly from the lamination device.

10. A lamination system for laminating substrates to form a laminated assembly, comprising:

a processing circuit that;

controls operation of a lamination chamber including an upper cavity and a lower cavity, the upper cavity being sealed by a flexible member;

controls operation of a pressurization system coupled to the lamination chamber to;

pressurize the upper cavity to a first pressure to move the flexible member toward a lower member of the lamination chamber and into contact with a first substrate disposed within the lamination chamber; and

then

depressurize the upper cavity to move the flexible member away from the lower member of the lamination chamber and out of contact with the first substrate;

pressurize the lower cavity to a second pressure higher than the first pressure to apply air pressure at the second pressure to the first substrate and a second substrate; and

controls operation of a heater to heat the lamination chamber during operation of the pressurization system.

11. The system of claim 10, wherein the heater is configured to maintain an elevated temperature while the first and second substrate are within the lower cavity.

12. The system of claim 10, further comprising a support member configured to maintain a separation between the first substrate and the second substrate prior to generating a vacuum environment.

13. The system of claim 10, wherein the first substrate is a first rigid substrate and the second substrate is a second rigid substrate, and wherein at least one of the first and second substrate includes a layer of pressure sensitive adhesive material.

14. The system of claim 10, further comprising a control unit configured to control operation of the lamination chamber, the pressurization system, and the heater based on inputs received from a user.

15. A lamination system for laminating substrates to form a laminated assembly, comprising:

a lamination chamber including a first cavity at least partially defined by an upper member and a second cavity at least partially defined by a lower member;

a flexible member;

a pressurization system coupled to the lamination chamber; and

a processing circuit programmed to control operation of the pressurization system to;

pressurize the first cavity to a first pressure to move the flexible member toward the lower member and into contact with a first substrate disposed within the second cavity;

depressurize the first cavity to move the flexible member toward the upper member and out of contact with the first substrate; and

then

pressurize the second cavity to a second pressure higher than the first pressure to apply air pressure at the second pressure to the first substrate and a second substrate.

16. The system of claim 15, wherein the pressurization system is configured to generate a vacuum environment within the second cavity prior to pressurization of the first cavity.

17. The system of claim 15, wherein the second cavity is configured to receive at least two substrates and maintain the substrates in a spatial relationship prior to pressurization of the first cavity.

18. The system of claim 17, further comprising a heater configured to maintain the lamination device at an elevated temperature while the first and second substrates are within the second cavity.

19. The system of claim 18, wherein the elevated temperature is approximately 80 degrees Celsius.

20. The system of claim 17, wherein the first substrate is a coverglass and the second substrate is an LCD assembly.