Integrated optical encoder for tilt able rotatable shaft

• US 9,983,029 B2
• Filed: 09/30/2015
• Issued: 05/29/2018
• Est. Priority Date: 09/30/2015
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Rai, Anant, Holenarsipur, Prashanth, Lee, Alex M.
• Primary Examiner(s): Le, Que T
• Assistant Examiner(s): BENNETT, JENNIFER D
• Application Number:
  US14/870,301
• Publication Number:
  US 20170089736A1
• Time in Patent Office: 972 Days
• CPC Class Codes: G01D 11/24 Housings ; Casings for instruments
• CPC Class Codes: G01D 5/34707 Scales; Discs, e.g. fixation, fabrication, compensation
• CPC Class Codes: G01D 5/3473 Circular or rotary encoders

Abstract

Examples of the disclosure enclose an optical target on an encoder and sensors inside a single integrated module, wherein the encoder and the sensors are coupled to the same rigid body to maintain optical alignment between the sensors and the optical target on the encoder. Further, the module itself may be hermetically sealed to protect the optical path (e.g., from a light source to the optical target to the sensors) from contamination due to outside dirt, debris, or light sources internal/external to the device that might further interfere with alignment and/or proper sensing. Because the integrated module results in smaller variations in the alignment between the optical target and the sensors, the dynamic range of the sensors may be reduced, resulting in less power consumption and, potentially, longer battery life for the device. The use of an integrated module can also enable relaxed manufacturing requirements for the optical sensor and/or the optical target.

Claims

1. An electronic device comprising:

one or more light sources;

a plurality of sensors;

an optical encoder;

an integrated module comprising a first body, wherein the light sources, the plurality of sensors, and the optical encoder are each coupled to the first body such that the light sources, the plurality of sensors, and the optical encoder are maintained in optical alignment; and

a shaft coupled to the optical encoder, wherein the shaft is disposed outside the integrated module and flexibly coupled to the optical encoder such that the shaft is able to tilt without causing the optical encoder to move out of optical alignment with the light sources and the plurality of sensors; and

one or more buttons disposed around the shaft and configured to be depressed by the shaft when the shaft is tilted.

2. The electronic device of claim 1, wherein the optical encoder includes an optical target on a surface of the optical encoder, the optical target comprising a pattern of high-reflective and low-reflective regions.

3. The electronic device of claim 1, the electronic device further comprising:

one or more O-rings that couple the optical encoder to the first body of the integrated module, wherein the O-rings are configured to allow the optical encoder to rotate but prevent the optical encoder from tilting with respect to an axis of rotation.

4. The electronic device of claim 3, wherein the one or more O-rings are further configured to seal the integrated module with the light sources, the plurality of sensors, and a portion of the optical encoder are enclosed within the integrated module.

5. The electronic device of claim 4, wherein the portion of the optical encoder enclosed within the integrated module comprises a pattern of high-reflective and low-reflective regions.

6. The electronic device of claim 1, wherein coupling the optical encoder and one of the plurality of sensors to the first body of the integrated module maintains optical alignment of the optical encoder and the one of the plurality of sensors within a predetermined tolerance.

7. The electronic device of claim 1, wherein the first body of the integrated module includes one or more components that electrically connect the plurality of sensors and the light sources to the electronic device.

8. The electronic device of claim 1, the electronic device further comprising:

circuitry of one or more of the plurality of sensors and the light sources, wherein the circuitry is enclosed within the integrated module.

9. A method of manufacturing an electronic device, the method comprising:

coupling one or more light sources, a plurality of sensors, and an optical encoder to a first body of an integrated module, wherein the integrated module encloses the light sources, the plurality of sensors, and at least a portion of the optical encoder;

sealing the integrated module using one or more O-rings that couple the optical encoder to the first body of the integrated module; and

after sealing the integrated module, coupling the optical encoder to a shaft, wherein the shaft is disposed outside the integrated module, and

disposing one or more buttons around the shaft and configured to be depressed by the shaft when the shaft is tilted,

wherein the shaft is flexibly coupled to the optical encoder such that the shaft is able to tilt without causing the optical encoder to move out of optical alignment with the light sources and the plurality of sensors.

10. The method of claim 9, the method further comprising:

before sealing the integrated module, aligning the optical encoder and one of the plurality of sensors within a predetermined tolerance;

wherein coupling the optical encoder and the one of the plurality of sensors to the first body of the integrated module maintains optical alignment of the optical encoder and the one of the plurality of sensors within the predetermined tolerance.

11. The method of claim 9, the method further comprising:

depositing an optical target on a surface of the optical encoder, the optical target comprising a pattern of high-reflective and low-reflective regions.

12. The method of claim 9, wherein the O-rings are configured to allow the optical encoder to rotate but prevent the optical encoder from tilting with respect to an axis of rotation.

13. The method of claim 9, wherein the portion of the optical encoder enclosed within the integrated module comprises a pattern of high-reflective and low-reflective regions.

14. The method of claim 9, the method further comprising:

electrically connecting the plurality of sensors and the light sources to the electronic device through one or more components of the first body.

15. The method of claim 9, wherein the integrated module further encloses circuitry of one or more of the plurality of sensors and the light sources.