Uniform dielectric recess depth during fin reveal
First Claim
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1. A method for providing a uniform recess depth between different fin gap sizes, comprising:
- tuning reactive ion etch lag for etching a dielectric material, between fins on a substrate, between narrow gaps faster than the dielectric material between wider gaps such that the dielectric material in the narrow gaps reaches a target depth; and
etching the dielectric material in the wider gaps to the target depth.
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Abstract
A method for providing a uniform recess depth between different fin gap sizes includes depositing a dielectric material between fins on a substrate. Etch lag is tuned for etching the dielectric material between narrow gaps faster than the dielectric material between wider gaps such that the dielectric material in the narrow gaps reaches a target depth. An etch block is formed in the narrow gaps. The wider gaps are etched to the target depth. The etch block is removed.
16 Citations
10 Claims
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1. A method for providing a uniform recess depth between different fin gap sizes, comprising:
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tuning reactive ion etch lag for etching a dielectric material, between fins on a substrate, between narrow gaps faster than the dielectric material between wider gaps such that the dielectric material in the narrow gaps reaches a target depth; and etching the dielectric material in the wider gaps to the target depth. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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