Substrate with array of LEDs for backlighting a display device
First Claim
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1. A circuit component for a display, comprising:
- a flexible substrate;
a circuit trace having a predetermined pattern disposed on a surface of the substrate;
a plurality of semiconductor die connected to the substrate via the circuit trace, the plurality of semiconductor die being distributed across the surface of the substrate; and
one or more substrate orientation datum points disposed on the substrate,wherein the circuit component is formed by a method including;
positioning the surface of the substrate to face a first surface of a wafer tape having at least one semiconductor die of the plurality of semiconductor die thereon,using the one or more substrate orientation datum points to orient at least one of the surface of the substrate or the wafer tape such that the circuit trace is aligned for a transfer of the at least one semiconductor die to the circuit trace,causing a needle to thrust against a second surface of the wafer tape at a position corresponding to a location of the at least one semiconductor die on the first surface of the wafer tape, the second surface of the wafer tape being opposite the first surface of the wafer tape, andattaching the at least one semiconductor die to the substrate, andwherein the substrate orientation datum points are readable via a sensor of an apparatus that performs the method, the substrate orientation datum points providing information regarding a position of the circuit trace on the substrate, thereby indicating a transfer location for the at least one semiconductor die.
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Abstract
An apparatus includes a substrate and a circuit trace having a predetermined pattern disposed on the substrate. A plurality of LEDs are connected to the substrate via the circuit trace. The predetermined pattern is arranged as an array of lines along a surface of the substrate, and the plurality of LEDs are distributed along the lines of the array.
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Citations
14 Claims
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1. A circuit component for a display, comprising:
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a flexible substrate; a circuit trace having a predetermined pattern disposed on a surface of the substrate; a plurality of semiconductor die connected to the substrate via the circuit trace, the plurality of semiconductor die being distributed across the surface of the substrate; and one or more substrate orientation datum points disposed on the substrate, wherein the circuit component is formed by a method including; positioning the surface of the substrate to face a first surface of a wafer tape having at least one semiconductor die of the plurality of semiconductor die thereon, using the one or more substrate orientation datum points to orient at least one of the surface of the substrate or the wafer tape such that the circuit trace is aligned for a transfer of the at least one semiconductor die to the circuit trace, causing a needle to thrust against a second surface of the wafer tape at a position corresponding to a location of the at least one semiconductor die on the first surface of the wafer tape, the second surface of the wafer tape being opposite the first surface of the wafer tape, and attaching the at least one semiconductor die to the substrate, and wherein the substrate orientation datum points are readable via a sensor of an apparatus that performs the method, the substrate orientation datum points providing information regarding a position of the circuit trace on the substrate, thereby indicating a transfer location for the at least one semiconductor die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification