Epitaxial formation support structures and associated methods

• US 9,985,181 B2
• Filed: 12/04/2015
• Issued: 05/29/2018
• Est. Priority Date: 12/07/2009
• Status: Active Grant

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Sheen, Calvin Wade
• Primary Examiner(s): Oh, Jaehwan
• Assistant Examiner(s): Parker, John M
• Application Number:
  US14/959,271
• Publication Number:
  US 20160087152A1
• Time in Patent Office: 907 Days
• CPC Class Codes: B28B 1/16 for producing layered articles coating B28B11/04
• CPC Class Codes: H01L 21/02433 Crystal orientation
• CPC Class Codes: H01L 21/02458 Nitrides
• CPC Class Codes: H01L 21/0254 Nitrides
• CPC Class Codes: H01L 29/2003 Nitride compounds
• CPC Class Codes: H01L 33/007 comprising nitride compounds
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages

Abstract

Epitaxial formation support structures and associated methods of manufacturing epitaxial formation support structures and solid state lighting devices are disclosed herein. In several embodiments, a method of manufacturing an epitaxial formation support substrate can include forming an uncured support substrate that has a first side, a second side opposite the first side, and coefficient of thermal expansion substantially similar to N-type gallium nitride. The method can further include positioning the first side of the uncured support substrate on a first surface of a first reference plate and positioning a second surface of a second reference plate on the second side to form a stack. The first and second surfaces can include uniformly flat portions. The method can also include firing the stack to sinter the uncured support substrate. At least side of the support substrate can form a planar surface that is substantially uniformly flat.

Claims

1. A solid state lighting (SSL) device, comprising:

a cured support substrate having a sintered planar surface, wherein the support substrate has a coefficient of thermal expansion (CTE) substantially similar to that of N-type gallium nitride (GaN);

a formation structure directly bonded to the sintered planar surface of the support substrate; and

an SSL structure directly on the formation structure, wherein the SSL structure includes at least a first semiconductor material epitaxially grown on the formation structure,

wherein the sintered planar surface of the support substrate is uniformly flat such that any warp from the support substrate to the SSL structure is substantially eliminated.

2. The SSL device of claim 1 wherein:

the support substrate comprises aluminum nitride; and

the formation structure comprises silicon;

the first semiconductor material comprises N-type GaN; and

the SSL structure further comprises a second semiconductor material made of P-type GaN and an active region between the first and second semiconductor materials.

3. The SSL device of claim 1 wherein the support substrate includes a polycrystalline ceramic.

4. The SSL device of claim 3 wherein the polycrystalline ceramic comprises at least one of Si₃N₄, TiN, HfN, AlN, SiO₂, Al₂O₃, AlON, TiC, ZrC, HfC, SiC, and Y₂O₃.

5. The SSL device of claim 1 wherein the warp from the support substrate to the SSL structure is less than 25 micrometers.

6. The SSL device of claim 1, further comprising a bonding region bonded to the planar surface of the support substrate, wherein the bonding region is doped with at least one of Boron and Helium.

7. The SSL device of claim 1 wherein the support substrate and the formation structure are directly bonded to each other via a metal-metal bond.

8. A solid state lighting (SSL) device, comprising:

a cured support substrate having a sintered planar surface, wherein the support substrate has a coefficient of thermal expansion (CTE) substantially similar to that of III-nitrides, wherein the planar surface of the support substrate is formed by curing the support substrate between two reference plates;

a formation structure directly bonded to the sintered planar surface of the support substrate; and

an SSL structure directly on the formation structure, wherein the SSL structure includes at least a first semiconductor material epitaxially grown on the formation structure, an active region on the first semiconductor material, and a second semiconductor material on the active region,

wherein the sintered planar surface of the support substrate is uniformly flat such that any warp from the support substrate to the SSL structure is substantially eliminated.

9. The SSL device of claim 8 wherein the support substrate is a polycrystalline ceramic material.

10. The SSL device of claim 8 wherein the support substrate comprises at least one of Si₃N₄, TiN, HfN, SiO₂, Al₂O₃, AlON, TiC, ZrC, HfC, SiC, and Y₂O₃.