Wireless communications package with integrated antennas and air cavity
First Claim
1. An antenna package, comprising:
- a package carrier comprising an antenna ground plane and an antenna feed line; and
a package cover comprising a planar lid, the planar lid comprising a planar antenna element formed on a first surface of the planar lid;
wherein the package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element on the first surface of the planar lid aligned to the antenna ground plane and the antenna feed line of the package carrier;
wherein the package cover is bonded to the package carrier with the first surface of the planar lid fixedly disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the first surface of the package carrier; and
wherein the package cover comprises a rectangular frame structure that is bonded to the planar lid using a first array of solder bump connections, and wherein the rectangular frame structure is bonded to the first surface of the package carrier using a second array of solder hump connections.
1 Assignment
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Accused Products
Abstract
Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.
37 Citations
20 Claims
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1. An antenna package, comprising:
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a package carrier comprising an antenna ground plane and an antenna feed line; and a package cover comprising a planar lid, the planar lid comprising a planar antenna element formed on a first surface of the planar lid; wherein the package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element on the first surface of the planar lid aligned to the antenna ground plane and the antenna feed line of the package carrier; wherein the package cover is bonded to the package carrier with the first surface of the planar lid fixedly disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the first surface of the package carrier; and wherein the package cover comprises a rectangular frame structure that is bonded to the planar lid using a first array of solder bump connections, and wherein the rectangular frame structure is bonded to the first surface of the package carrier using a second array of solder hump connections. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A wireless communications package comprising:
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an antenna package, comprising; a package carrier comprising an antenna ground plane and an antenna feed line; and a package cover comprising a planar lid, the planar lid comprising a planar antenna element formed on a first surface of the planar lid; wherein the package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the -first surface of the package carrier, and with the planar antenna element on the first surface of the planar lid aligned to the antenna ground plane and the antenna feed line of the package carrier; wherein the package cover is bonded to the package carrier with the first surface of the planar lid fixedly disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the first surface of the package carrier; and wherein the package cover comprises a rectangular frame structure that is bonded to the planar lid using a first array of solder bump connections, and wherein the rectangular frame structure is bonded to the first surface of the package carrier using a second array of solder bump connections; and an RFIC (radio frequency integrated circuit) chip flip-chip bonded to a second surface of the package carrier opposite the first surface of the package carrier. - View Dependent Claims (12, 13, 14)
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15. An antenna package, comprising:
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a package carrier comprising a plurality of antenna ground planes, and a plurality of antenna feed lines; and a package cover comprising a planar lid, wherein the planar lid comprises a planar antenna array patterned on a first surface of the planar lid, wherein the planar antenna array comprises an array of planar antenna elements; wherein the package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, wherein each planar antenna element on the first surface of the planar lid is aligned to a corresponding one of the antenna ground planes and a corresponding one of the antenna feed lines; wherein each antenna feed line comprises a first antenna feed line and a second antenna feed line, wherein the first and second antenna feed lines enable a dual polarization mode of operation of the planar antenna elements; and wherein the package cover is bonded to the package carrier with the first surface of the planar lid fixedly disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna array and the first surface of the package carrier. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification