MOSCAP-based circuitry for wireless communication devices, and methods of making and using the same

• US 9,985,691 B2
• Filed: 07/20/2017
• Issued: 05/29/2018
• Est. Priority Date: 05/04/2015
• Status: Expired due to Fees

• Current Assignee: Ensurge Micropower ASA
• Original Assignee: Thin Film Electronics ASA
• Inventors: Mukherjee, Somnath
• Primary Examiner(s): Yun, Eugene
• Application Number:
  US15/655,081
• Publication Number:
  US 20170317719A1
• Time in Patent Office: 313 Days
• Field of Search: 455 411
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 29/94 Metal-insulator-semiconductors, e.g. MOS
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H04B 1/04 Circuits
• CPC Class Codes: H04B 1/16 Circuits
• CPC Class Codes: H04B 5/22 Capacitive coupling
• CPC Class Codes: H04B 5/72 for local intradevice communication
• CPC Class Codes: H04B 5/77 for interrogation

Abstract

A wireless (e.g., near field or RF) communication device, and methods of manufacturing and using the same are disclosed. The wireless communication device includes a receiver and/or transmitter, a substrate with an antenna thereon, an integrated circuit, and one or more continuity sensors. The antenna receives and/or backscatters a wireless signal. The integrated circuit processes the wireless signal and/or information therefrom, and/or generates the wireless signal and/or information therefor. The continuity sensor(s) are configured to sense or determine the presence of a chemical or substance in the package or container, and thus a continuity state of a package or container on which the communication device is placed or to which the communication device is fixed or adhered. The continuity sensor(s) are electrically connected to a set of terminals of the integrated circuit different from the set of terminals to which the antenna is electrically connected.

Claims

1. A variable capacitor, comprising:

a) a first electrode, comprising a printed doped polysilicon body having source and drain terminals electrically connected to a common node;

b) a dielectric layer in contact with the first electrode; and

c) a second electrode spaced apart from the first electrode by the dielectric layer, comprising a conductor,

wherein said variable capacitor is configured to generate intermodulation components from (i) a main carrier signal from a first source at a first frequency of from 1 MHz to 10 GHz and a first power and (ii) a sub-carrier signal from a second source at a second frequency and a second power, the intermodulation components having different frequencies from the first frequency and substantially less power than the first power.

2. The variable capacitor of claim 1, wherein the second electrode comprises a second printed doped polysilicon body.

3. The variable capacitor of claim 1, wherein the dielectric layer comprises a silicon oxide.

4. The variable capacitor of claim 1, wherein the dielectric layer has a substantially constant thickness.

5. The variable capacitor of claim 1, further comprising a substrate, wherein the first electrode is on the substrate, the dielectric layer is on the first electrode, and the second electrode is on the dielectric layer.

6. The variable capacitor of claim 1, wherein the printed doped polysilicon body comprises source and drain regions of a metal-oxide-semiconductor (MOS) transistor that are electrically connected to each other, the second electrode comprises a gate of the MOS transistor, and the dielectric layer comprises a gate dielectric layer of the MOS transistor.

7. The variable capacitor of claim 6, wherein the source and drain regions of the MOS transistor comprise first and second heavily-doped regions in the printed doped polysilicon body, and the MOS transistor further comprises first and second metal electrodes respectively connected to the first and second heavily-doped regions and electrically connected to each other.

8. The variable capacitor of claim 6, wherein the MOS transistor is configured to function as a modulator and/or a detector.

9. The variable capacitor of claim 1, wherein the first frequency is x Hz, and the intermodulation components have a frequency of x±

n*y Hz, where n is an integer of 1 to 4, and x>

>

n*y.

10. A wireless device, comprising:

a) the variable capacitor of claim 1; and

b) an antenna, wherein a first end, pole or terminal of the antenna is electrically connected to the first electrode of the variable capacitor, and a second end, pole or terminal of the antenna is electrically connected to the second electrode of the variable capacitor.

11. The wireless device of claim 10, further comprising a receiver electrically connected to the variable capacitor when the wireless device receives a wireless signal, and a transmitter or signal generator electrically connected to the variable capacitor when the wireless device backscatters a wireless signal.

12. The wireless device of claim 10, further comprising (i) a switch electrically connected to one of the first and second electrodes of the variable capacitor and (ii) a power supply or ground potential, electrically connected to the other one of the first and second electrodes of the variable capacitor.

13. The wireless device of claim 12, wherein the switch has a first state when the wireless device receives a wireless signal, and the switch has a second state when the wireless device backscatters a wireless signal.

14. The wireless device of claim 13, further comprising a decoder and/or demodulator electrically connected to the variable capacitor when the wireless device receives a wireless signal, and an encoder or signal generator electrically connected to the variable capacitor when the wireless device backscatters a wireless signal.

15. The wireless device of claim 10, further comprising a memory configured to store at least identification data or code, and a sensor configured to detect a state of the wireless device or an environmental parameter.

16. A method of processing a wireless signal, comprising:

a) receiving the wireless signal at the wireless device of claim 10; and

b) processing the wireless signal using the wireless device.

17. A method of generating a wireless signal, comprising:

a) modulating the sub-carrier signal in the wireless device of claim 10; and

b) mixing the modulated signal with the main carrier signal using the variable capacitor; and

c) backscattering, transmitting or broadcasting the mixed, modulated signal using the antenna.

18. The method of claim 17, wherein the variable capacitor comprises a MOSCAP device, and the modulated signal has a frequency greater than a cut-off frequency of a transistor corresponding to the MOSCAP device.

19. The method of claim 17, wherein the modulated signal has a frequency of y Hz, and the mixed, modulated signal has a frequency of x±

n*y Hz, where x is a frequency of the main carrier signal, n is an integer of 1 to 4, and x>

>

n*y.

20. The method of claim 17, further comprising electrically connecting a modulator configured to generate the modulated signal to the variable capacitor when the wireless device backscatters the mixed, modulated signal.