Implantable biomedical devices on bioresorbable substrates
First Claim
Patent Images
1. An implantable biomedical device for actuating a target tissue or sensing a parameter associated with the target tissue in a biological environment, said device comprising:
- a bioresorbable substrate;
an electronic device comprising one or more metallic conductor components including at least one electrode supported by said bioresorbable substrate, wherein at least one of said metallic conductor components has at least one physical dimension less than or equal to 100 microns;
a barrier layer encapsulating at least a portion of said metallic conductor components; and
a transmitter or a receiver operationally connected to said one or more metallic conductor components;
wherein said bioresorbable substrate, said electronic device, and said barrier layer provide a net bending stiffness of the implantable biomedical device of less than 1×
109 GPa μ
m4; and
wherein upon contact with said biological environment said bioresorbable substrate is at least partially resorbed, and the Young'"'"'s modulus of the implantable biomedical device decreases by at least 20% upon complete or partial resorption of the bioresorbable substrate, thereby establishing an interface providing for conformal contact between said electronic device and said target tissue.
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Accused Products
Abstract
Provided herein are implantable biomedical devices and methods of administering implantable biomedical devices, making implantable biomedical devices, and using implantable biomedical devices to actuate a target tissue or sense a parameter associated with the target tissue in a biological environment.
345 Citations
33 Claims
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1. An implantable biomedical device for actuating a target tissue or sensing a parameter associated with the target tissue in a biological environment, said device comprising:
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a bioresorbable substrate; an electronic device comprising one or more metallic conductor components including at least one electrode supported by said bioresorbable substrate, wherein at least one of said metallic conductor components has at least one physical dimension less than or equal to 100 microns; a barrier layer encapsulating at least a portion of said metallic conductor components; and a transmitter or a receiver operationally connected to said one or more metallic conductor components; wherein said bioresorbable substrate, said electronic device, and said barrier layer provide a net bending stiffness of the implantable biomedical device of less than 1×
109 GPa μ
m4; and
wherein upon contact with said biological environment said bioresorbable substrate is at least partially resorbed, and the Young'"'"'s modulus of the implantable biomedical device decreases by at least 20% upon complete or partial resorption of the bioresorbable substrate, thereby establishing an interface providing for conformal contact between said electronic device and said target tissue.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
(ii) a thickness selected from the range of 100 nanometers to 10000 μ
m;(iii) a net bending stiffness selected from the range of 0.1×
104 GPa μ
m4 to 1×
109 GPa μ
m4;
or(iv) a degree of crystallinity selected over the range of 0 to 55%.
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10. The device of claim 1, wherein said implantable biomedical device has a neutral mechanical plane and at least a portion of said one or more metallic conductor components is positioned proximate to said neutral mechanical plane.
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11. The device of claim 1, wherein at least one of said one or more metallic conductor components is a flexible structure or a stretchable structure.
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12. The device of claim 1, wherein at least one of said one or more metallic conductor components of the electronic device has a thickness less than or equal to 10 microns or lateral dimensions less than or equal to 10000 microns.
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13. The device of claim 1, wherein said one or more metallic conductor components form an array, wherein said one or more metallic conductor components are physically separated from each other.
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14. The device of claim 13, wherein each of said one or more metallic conductor components of said array is in electrical contact with at least one electronic interconnect.
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15. The device of claim 13, wherein adjacent metallic conductor components in said array are separated from each other by a distance selected from the range of 10 microns to 10 millimeters.
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16. The device of claim 13, wherein said array comprises 10 to 1000 metallic conductor components.
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17. The device of claim 1, wherein said one or more metallic conductor components comprise a bioinert metal or a biocompatible metal.
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18. The device of claim 1, wherein said one or more metallic conductor components comprise a bioinert metal selected from the group consisting of titanium, gold, silver, platinum, and any combination of these.
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19. The device of claim 1, wherein said one or more metallic conductor components comprise a biocompatible metal selected from the group consisting of iron, magnesium, and any combination of these.
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20. The device of claim 1, wherein said barrier layer has a mesh structure.
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21. The device of claim 20, wherein said mesh structure is a perforated mesh structure or a tentacle mesh structure.
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22. The device of claim 1, wherein said barrier layer is in physical contact with at least a portion of said metallic conductor components or wherein said bioresorbable substrate is in physical contact with at least a portion of said metallic conductor components or in physical contact with at least a portion of said barrier layer.
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23. The device of claim 1, wherein said barrier layer has a thickness selected from the range of 1 μ
- m to 100 μ
m.
- m to 100 μ
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24. The device of claim 1, wherein said barrier layer is configured as a discontinuous layer.
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25. The device of claim 1, wherein said barrier layer comprises a material selected from the group consisting of SU-8, an insulator, a polyimide, a dielectric, an inorganic dielectric and any combination of these.
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26. The device of claim 1, wherein said barrier layer encapsulates all of the metallic conductor components of the electronic device.
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27. The device of claim 1, wherein said barrier layer completely encapsulates the electronic device.
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28. The device of claim 1, wherein said barrier layer limits net leakage current from said electronic device to 10 μ
- A/μ
m2 or less.
- A/μ
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29. The device of claim 1, wherein said barrier layer comprises a bioresorbable material or a bioinert material.
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30. A method for administering an implantable biomedical device, said method comprising:
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providing the implantable biomedical device comprising; a bioresorbable substrate; an electronic device comprising one or more metallic conductor components supported by said bioresorbable substrate, wherein at least one of said metallic conductor components has at least one physical dimension less than or equal to 100 microns; a barrier layer encapsulating at least a portion of said metallic conductor components;
wherein said bioresorbable substrate, said electronic device, and said barrier layer provide a net bending stiffness of the implantable biomedical device of less than 1×
109 GPa μ
m4; anda transmitter or a receiver operationally connected to said one or more metallic conductor components and contacting said one or more metallic conductor components with a target tissue in a biological environment;
wherein upon contact with said biological environment said bioresorbable substrate is at least partially resorbed, the Young'"'"'s modulus of the implantable biomedical device decreases by at least 20% upon complete or partial resorption of the bioresorbable substrate thereby establishing an interface providing for conformal contact between said electronic device and said target tissue. - View Dependent Claims (31, 32, 33)
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Specification