Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods

• US 9,987,661 B2
• Filed: 12/02/2015
• Issued: 06/05/2018
• Est. Priority Date: 12/02/2015
• Status: Active Grant

• Current Assignee: BFLY Operations, Inc. (Butterfly Network, Inc.)
• Original Assignee: Butterfly Network, Inc.
• Inventors: Alie, Susan A., Zahorian, Jaime Scott, Chen, Kailiang
• Primary Examiner(s): San Martin, Edgardo
• Application Number:
  US14/957,098
• Publication Number:
  US 20170157646A1
• Time in Patent Office: 916 Days
• CPC Class Codes: A61B 8/4488 the transducer being a phased array
• CPC Class Codes: B06B 1/02 making use of electrical energy B06B1/18, B06B1/20 take precedence
• CPC Class Codes: B06B 1/0292 Electrostatic transducers, e.g. electret-type
• CPC Class Codes: B06B 1/0614 for generating several frequencies

Abstract

Electrical biasing of ultrasonic transducers of an ultrasound device is described. The ultrasonic transducers may be capacitive micromachined ultrasonic transducers (CMUTs). The ultrasonic transducers may be grouped together, with the different groups receiving different bias voltages. The bias voltages for the various groups of ultrasonic transducers may be selected to account for differences between the groups.

Claims

1. An ultrasound device, comprising:

a substrate;

a plurality of ultrasonic transducers integrated with the substrate and including a first group of ultrasonic transducers and a second group of ultrasonic transducers; and

a plurality of individually electrically controllable bias electrodes including;

a first bias electrode corresponding to the first group of ultrasonic transducers and comprising a first common membrane of the first group of ultrasonic transducers; and

a second bias electrode corresponding to the second group of ultrasonic transducers and comprising a second common membrane of the second group of ultrasonic transducers.

2. The ultrasound device of claim 1, wherein the first group of ultrasonic transducers are capacitive micromachined ultrasonic transducers.

3. The ultrasound device of claim 2, wherein the substrate is a semiconductor die, and wherein the capacitive micromachined ultrasonic transducers are monolithically integrated with the semiconductor die.

4. The ultrasound device of claim 2, wherein the substrate has a device surface with a width between approximately 20 mm and approximately 40 mm and a height between approximately 2 mm and approximately 10 mm, and wherein the plurality of individually electrically controllable bias electrodes includes between four bias electrodes and ten bias electrodes corresponding to respective groups of the plurality of ultrasonic transducers.

5. The ultrasound device of claim 2, further comprising a plurality of bias lines corresponding to the plurality of individually electrically controllable bias electrodes and including a first bias line coupled to the first bias electrode and a first power supply and a second bias line coupled to the second bias electrode and a second power supply.

6. The ultrasound device of claim 1, further comprising a detection circuit integrated with the substrate and configured to detect an electrical response of the first group of ultrasonic transducers.

7. The ultrasound device of claim 1, further comprising an integrated circuit integrated with the substrate and coupled to the first and second groups of ultrasonic transducers.

8. A method of operating an ultrasound device having a substrate and a plurality of ultrasonic transducers integrated with the substrate, the method comprising:

electrically biasing at a first bias voltage a first bias electrode comprising a first common membrane corresponding to a first group of ultrasonic transducers of the plurality of ultrasonic transducers; and

simultaneously with biasing the first bias electrode, electrically biasing at a second bias voltage different than the first bias voltage a second bias electrode comprising a second common membrane corresponding to a second group of ultrasonic transducers of the plurality of ultrasonic transducers.

9. The method of claim 8, wherein the first group of ultrasonic transducers are capacitive micromachined ultrasonic transducers.

10. The method of claim 8, further comprising, in response to electrically biasing the first bias electrode, detecting an electrical response of the first group of ultrasonic transducers.

11. The method of claim 8, wherein the first bias voltage is up to approximately 30% greater than the second bias voltage.

12. The method of claim 8, wherein electrically biasing the first bias electrode is performed using an integrated circuit integrated with the substrate.