Photosensitive resin composition for projection exposure, photosensitive element, method for forming resist pattern, process for producing printed wiring board and process for producing lead frame

• US 9,989,854 B2
• Filed: 07/22/2014
• Issued: 06/05/2018
• Est. Priority Date: 07/23/2013
• Status: Active Grant

• Current Assignee: Resonac Corp. (Resonac Holdings Corp.)
• Original Assignee: Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Inventors: Kume, Masakazu, Munakata, Momoko
• Primary Examiner(s): Walke, Amanda C
• Application Number:
  US14/906,595
• Publication Number:
  US 20160170299A1
• Time in Patent Office: 1,414 Days
• Field of Search: 4302701, 4302711, 430322, 430325, 430329, 430330, 430331
• CPC Class Codes: C23C 18/1605 by masking
• CPC Class Codes: C23C 18/1633 Process of electroless plating
• CPC Class Codes: G03F 7/027 Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds G03F7/075 takes precedence
• CPC Class Codes: G03F 7/031 Organic compounds not covered by group G03F7/029
• CPC Class Codes: G03F 7/033 the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
• CPC Class Codes: G03F 7/11 having cover layers or intermediate layers, e.g. subbing layers G03F7/091 - G03F7/093, B41N3/03 take precedence
• CPC Class Codes: G03F 7/20 Exposure; Apparatus therefor photographic printing apparatus for making copies G03B27/00
• CPC Class Codes: G03F 7/32 Liquid compositions therefor, e.g. developers
• CPC Class Codes: G03F 7/38 Treatment before imagewise removal, e.g. prebaking G03F7/265 takes precedence
• CPC Class Codes: G03F 7/40 Treatment after imagewise removal, e.g. baking
• CPC Class Codes: H01L 21/0274 Photolithographic processes
• CPC Class Codes: H01L 21/0332 characterised by their composition, e.g. multilayer masks, materials
• CPC Class Codes: H01L 21/0337 characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
• CPC Class Codes: H05K 3/108 by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241

Abstract

An object of the present invention is to provide a photosensitive resin composition for projection exposure capable of forming a resist pattern that is excellent in adhesion, resolution, and inhibitory properties against the occurrence of resist footing, and the present invention provides a photosensitive resin composition for projection exposure comprising (A) a binder polymer; (B) a photopolymerizable compound having an ethylenically unsaturated bond; (C) a photopolymerization initiator; and (D) a sensitizing dye, wherein the (B) photopolymerizable compound having an ethylenically unsaturated bond comprises a (meth)acrylate compound having a skeleton derived from dipentaerythritol and a compound represented by the following formula (III):

• • wherein R⁸, R⁹, R¹⁰, and R¹¹ each independently represent a hydrogen atom or a methyl group, X and Y each independently represent an ethylene group or a propylene group, p₁, p₂, q₁, and q₂ each independently represent a numerical value of 0 to 9, both p₁+q₁ and p₂+q₂ are 1 or more, and p₁+q₁+p₂+q₂ is 2 to 9.

Claims

1. A photosensitive resin composition for projection exposure, comprising:

(A) a binder polymer;

(B) a photopolymerizable compound having an ethylenically unsaturated bond;

(C) a photopolymerization initiator; and

(D) a sensitizing dye not including a pyrazoline,

wherein the (B) photopolymerizable compound having an ethylenically unsaturated bond comprises a (meth)acrylate compound having a skeleton derived from dipentaerythritol and a compound represented by the following formula (III);

2. The photosensitive resin composition for projection exposure according to claim 1, wherein the (meth)acrylate compound having a skeleton derived from dipentaerythritol has an ethylene oxide chain.

3. A method for forming a resist pattern, comprising:

a photosensitive resin layer forming step of forming a photosensitive resin layer on a substrate using the photosensitive resin composition for projection exposure according to claim 1;

an exposure step of exposing at least a part of the photosensitive resin layer to active light projecting an image of a photomask via a lens to photocure an exposed portion; and

a development step of removing an uncured portion of the photosensitive resin layer from the substrate by development.

4. A photosensitive element comprising:

a support; and

a photosensitive resin layer formed on the support using the photosensitive resin composition for projection exposure according to claim 1.

5. A process for producing a printed wiring board, comprising:

a step of forming a resist pattern on a substrate including a conductor layer by the method for forming a resist pattern according to claim 3; and

a step of forming a conductor pattern by etching portions of the conductor layer not covered by photosensitive resin of the resist pattern or by plating portions of the conductor layer not covered by photosensitive resin of the resist pattern.

6. A process for producing a lead frame, comprising:

a step of forming a resist pattern on a substrate including a conductor layer by the method for forming a resist pattern according to claim 3; and

a step of forming a conductor pattern by plating portions of the conductor layer not covered by photosensitive resin of the resist pattern.

7. A method for forming a resist pattern, comprising:

a photosensitive resin layer forming step of forming a photosensitive resin layer on a substrate using the photosensitive resin composition for projection exposure according to claim 2;

an exposure step of exposing at least a part of the photosensitive resin layer to active light projecting an image of a photomask via a lens to photocure an exposed portion; and

a development step of removing an uncured portion of the photosensitive resin layer from the substrate by development.

8. A photosensitive element comprising:

a support; and

a photosensitive resin layer formed on the support using the photosensitive resin composition for projection exposure according to claim 2.

9. A process for producing a printed wiring board, comprising:

a step of forming a resist pattern on a substrate including a conductor layer by the method for forming a resist pattern according to claim 7; and

a step of forming a conductor pattern by etching portions of the conductor layer not covered by photosensitive resin of the resist pattern or plating portions of the conductor layer not covered by photosensitive resin of the resist pattern.

10. A process for producing a lead frame, comprising:

a step of forming a resist pattern on a substrate including a conductor layer by the method for forming a resist pattern according to claim 7; and

a step of forming a conductor pattern by plating portions of the conductor layer not covered by photosensitive resin of the resist pattern.

11. A process for producing a printed wiring board, comprising:

a step of forming a resist pattern on a substrate including a conductor layer by the method for forming a resist pattern according to claim 7; and

a step of forming a conductor pattern by etching portions of the conductor layer not covered by photosensitive resin of the resist pattern.

12. A process for producing a printed wiring board, comprising:

a step of forming a resist pattern on a substrate including a conductor layer by the method for forming a resist pattern according to claim 3; and

a step of forming a conductor pattern by etching portions of the conductor layer not covered by photosensitive resin of the resist pattern.

13. A process for producing a printed wiring board, comprising:

a step of forming a resist pattern on a substrate including a conductor layer by the method for forming a resist pattern according to claim 3; and

a step of forming a conductor pattern by plating portions of the conductor layer not covered by photosensitive resin of the resist pattern, then removing the resist pattern and etching the conductor layer that had been covered by the resist pattern.

14. A process for producing a printed wiring board, comprising:

a step of forming a resist pattern on a substrate including a conductor layer by the method for forming a resist pattern according to claim 7; and

a step of forming a conductor pattern by plating portions of the conductor layer not covered by photosensitive resin of the resist pattern, then removing the resist pattern and etching the conductor layer that had been covered by the resist pattern.

15. A process for producing a lead frame, comprising:

a step of forming a resist pattern on a substrate including a conductor layer by the method for forming a resist pattern according to claim 3; and

a step of forming a conductor pattern by plating portions of the conductor layer not covered by photosensitive resin of the resist pattern, then removing the resist pattern and etching the conductor layer that had been covered by the resist pattern.

16. A process for producing a lead frame, comprising:

a step of forming a resist pattern on a substrate including a conductor layer by the method for forming a resist pattern according to claim 7; and

a step of forming a conductor pattern by plating portions of the conductor layer not covered by photosensitive resin of the resist pattern, then removing the resist pattern and etching the conductor layer that had been covered by the resist pattern.