Apparatus operable to perform a measurement operation on a substrate, lithographic apparatus, and method of performing a measurement operation on a substrate

• US 9,989,858 B2
• Filed: 12/05/2014
• Issued: 06/05/2018
• Est. Priority Date: 01/24/2014
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Slotboom, Daan Maurits, Kramer, Pieter Jacob, Leenders, Martinus Hendrikus Antonius, Paarhuis, Bart Dinand
• Primary Examiner(s): Whitesell Gordon, Steven H
• Application Number:
  US15/111,457
• Publication Number:
  US 20160334713A1
• Time in Patent Office: 1,278 Days
• CPC Class Codes: G03F 7/70141 Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
• CPC Class Codes: G03F 9/7046 Strategy, e.g. mark, sensor or wavelength selection
• CPC Class Codes: G03F 9/7096 Arrangement, mounting, housing, environment, cleaning or maintenance of apparatus

Abstract

Disclosed is an apparatus and method for performing a measurement operation on a substrate in accordance with one or more substrate alignment models. The one or more substrate alignment models are selected from a plurality of candidate substrate alignment models. The apparatus, which may be a lithographic apparatus, includes an external interface which enables selection of the substrate alignment model(s) and/or alteration of the substrate alignment model(s) prior to the measurement operation.

Claims

1. An apparatus configured to perform a measurement operation on a substrate in accordance with one or more substrate alignment models, wherein the one or more substrate alignment models are selected from a plurality of candidate substrate alignment models;

and wherein the apparatus comprises an external interface configured to enable the selection of the one or more substrate alignment models from the plurality of candidate substrate alignment models and/or alteration of one or more candidate substrate alignment models of the candidate substrate alignment models, prior to the measurement operation.

2. An apparatus as claimed in claim 1, wherein the external interface enables the selection of the substrate alignment model(s) and/or alteration of the substrate alignment model(s) for each lot of substrates, prior to the measurement operation on each lot of substrates.

3. An apparatus as claimed in claim 1, wherein the external interface enables the selection of the substrate alignment model(s) and/or alteration of the substrate alignment model(s) for each substrate, prior to the measurement operation on each substrate.

4. An apparatus as claimed in claim 1, configured to select one or more substrate alignment models from the plurality of candidate substrate alignment models according to a determination as to which model(s) would best fit a particular substrate or lot of substrates.

5. An apparatus as claimed in claim 1, configured to select one or more of the candidate substrate alignment models based, at least in part, upon substrate processing context information of the particular substrate being measured.

6. An apparatus as claimed in claim 1, wherein the external interface is an interface according to a semiconductor equipment industry standard.

7. An apparatus as claimed in claim 1, configured to select one or more of the candidate substrate alignment models based, at least in part, upon post-exposure measurement data comprising measurements which have been taken from a previously exposed substrate subsequent to it being measured and exposed.

8. An apparatus as claimed in claim 7, configured:

to measure the substrate to obtain pre-exposure measurement data;

to compare the post-exposure measurement data with the pre-exposure measurement data; and

to use the result of the comparison in the selection of one or more of the candidate substrate alignment models for measurement of subsequent substrates.

9. An apparatus as claimed in claim 8, configured such that the comparison determines whether modelled post-exposure measurement data correlates to the pre-exposure measurement data;

and configured to;

attribute errors to substrate deformation if the modelled post-exposure measurement data correlates with the pre-exposure measurement data; and

attribute errors to deformation of one or more measurement targets on the substrate if the modelled post-exposure measurement data does not correlate with the pre-exposure measurement data;

the apparatus further configured such that the selection of the substrate alignment model(s) is dependent at least in part on whether the errors are attributed to deformation of one or more measurement targets or attributed to substrate deformation.

10. An apparatus as claimed in claim 1, configured to select one or more process correction models from a plurality of candidate process correction models, the process correction models being usable in modelling corrections for subsequent substrates.

11. An apparatus as claimed in claim 1, wherein the plurality of candidate substrate alignment models comprise at least one physical substrate alignment model wherein the actual physics of substrate deformation is taken into account in the model.

12. An apparatus as claimed in claim 11, wherein the physical substrate alignment model is configured such that measurement points which have physically nonsensical values, either in themselves or in the context of a measurement data set as a whole, are not considered or are given less weight in modelling of the substrate.

13. An apparatus as claimed in claim 1, specifically configured as a lithographic apparatus operable to perform a lithographic process on the substrate subsequent to the measurement operation.

14. A method of performing a measurement operation on a substrate, the method comprising:

determining as to which substrate alignment model(s) from a plurality of candidate substrate alignment models would best fit a particular substrate or lot of substrates;

selecting one or more substrate alignment models from the plurality of candidate substrate alignment models based upon the determination; and

performing the measurement operation on the substrate or lot of substrates in accordance with the selected one or more substrate alignment models;

wherein the determining and selecting are performed either per each lot of substrates such that one lot of a particular device manufacturing process has a different substrate alignment model than another lot of the particular device manufacturing process, or per substrate such that one substrate of a lot has a different substrate alignment model than another substrate of the lot.

15. A non-transitory program carrier comprising machine readable instructions which, when run on a suitable apparatus, cause the apparatus to:

determine as to which substrate alignment model(s) from a plurality of candidate substrate alignment models would best fit a particular substrate or lot of substrates;

select one or more substrate alignment models from the plurality of candidate substrate alignment models based upon the determination; and

cause performance of a measurement operation on the substrate or lot of substrates in accordance with the selected one or more substrate alignment models,

wherein the determination and selection are performed either per each lot of substrates such that one lot of a particular device manufacturing process can have a different substrate alignment model than another lot of the particular device manufacturing process, or per substrate such that one substrate of a lot can have a different substrate alignment model than another substrate of the lot.

16. The program carrier of claim 15, wherein the instructions are further configured to cause the apparatus to enable selection of the substrate alignment model(s) via an external interface comprised within a lithographic apparatus used to perform the measurement operation.

17. The program carrier of claim 15, wherein the instructions are further configured to cause the apparatus to:

obtain substrate processing context information comprising information relating to a known processing characteristic imposed on a substrate as a result of processing on a particular tool; and

make the selection of the substrate alignment model(s) based, at least in part, upon the substrate processing context information of the particular substrate being measured.

18. The program carrier of claim 15, wherein the instructions are further configured to cause the apparatus to:

obtain post-exposure measurement data comprising measurements which have been taken from a previously exposed substrate subsequent to it being measured and exposed; and

make the selection of the substrate alignment model(s) based, at least in part, upon the post-exposure measurement data.

19. The program carrier of claim 18, wherein the instructions are further configured to cause the apparatus to:

obtain pre-exposure measurement data of the substrate;

compare the post-exposure measurement data with the pre-exposure measurement data;

use the result of the comparison in the selection of the substrate alignment model(s) for measurement of subsequent substrates.

20. The program carrier of claim 15, wherein the plurality of candidate substrate alignment models comprise at least one physical substrate alignment model wherein the actual physics of substrate deformation are taken into account in the model.