Touch Pad with flexible substrate
First Claim
1. A sensor device comprising:
- a flexible circuit substrate that is dimensionally stable up to a first temperature, wherein the flexible circuit substrate comprises at least one selected from a group consisting of a condensate film, a thermoset material, polyimide, epoxy resin, and a liquid crystal polymer film;
a first plurality of conductive pads disposed on the flexible circuit substrate;
a touch controller affixed to the flexible circuit substrate and coupled to the first plurality of conductive pads via a first plurality of conductors;
a flexible sensor substrate that is dimensionally stable up to a second temperature that is lower than the first temperature, wherein the flexible sensor substrate is not dimensionally stable at the first temperature, wherein the flexible sensor substrate comprises at least one selected from a group consisting of a thermoplastic material, vinyl, polyethylene terephthalate (PET), polystyrene (PS), polyvinylchloride (PVC), and polycarbonate;
a second plurality of conductive pads disposed on the flexible sensor substrate, wherein at least one of the first plurality of conductive pads is coupled to at least one of the second plurality of conductive pads; and
a first plurality of capacitive sensing elements disposed on the flexible sensor substrate and coupled to the second plurality of conductive pads via a second plurality of conductors.
2 Assignments
0 Petitions
Accused Products
Abstract
A touch sensor device is provided that uses a flexible circuit substrate to provide an improved input device. Specifically, the present invention uses a touch sensor controller affixed to the flexible circuit substrate, which is coupled to a sensor component to provide a flexible, reliable and cost effective touch sensor suitable for a wide variety of applications. In one embodiment the touch sensor uses a flexible circuit substrate that provides relatively high temperature resistance. This allows the touch sensor controller to be affixed using reliable techniques, such as various types of soldering. The sensor component can comprise a relatively low-temperature-resistant substrate that can provide a cost effective solution. Taken together, this embodiment of the touch sensor provides reliability and flexibility at relatively low cost.
-
Citations
32 Claims
-
1. A sensor device comprising:
-
a flexible circuit substrate that is dimensionally stable up to a first temperature, wherein the flexible circuit substrate comprises at least one selected from a group consisting of a condensate film, a thermoset material, polyimide, epoxy resin, and a liquid crystal polymer film; a first plurality of conductive pads disposed on the flexible circuit substrate; a touch controller affixed to the flexible circuit substrate and coupled to the first plurality of conductive pads via a first plurality of conductors; a flexible sensor substrate that is dimensionally stable up to a second temperature that is lower than the first temperature, wherein the flexible sensor substrate is not dimensionally stable at the first temperature, wherein the flexible sensor substrate comprises at least one selected from a group consisting of a thermoplastic material, vinyl, polyethylene terephthalate (PET), polystyrene (PS), polyvinylchloride (PVC), and polycarbonate; a second plurality of conductive pads disposed on the flexible sensor substrate, wherein at least one of the first plurality of conductive pads is coupled to at least one of the second plurality of conductive pads; and a first plurality of capacitive sensing elements disposed on the flexible sensor substrate and coupled to the second plurality of conductive pads via a second plurality of conductors. - View Dependent Claims (2, 3, 4, 5, 6, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32)
-
-
7. A touch sensor device comprising:
-
a flexible circuit substrate that is dimensionally stable up to a first temperature, the flexible circuit substrate comprising a first plurality of conductive pads and a first plurality of conductors coupled to the first plurality of conductive pads, wherein the flexible circuit substrate comprises at least one selected from a group consisting of a condensate film, a thermoset material, polyimide, epoxy resin, and a liquid crystal polymer film; a touch controller affixed to the flexible circuit substrate and coupled to the first plurality of conductors; and a sensor component comprising; a transparent flexible sensor substrate that is dimensionally stable up to a second temperature that is lower than the first temperature, wherein the transparent flexible sensor substrate comprises at least one selected from a group consisting of a thermoplastic material, vinyl, polyethylene terephthalate (PET), polystyrene (PS), polyvinylchloride (PVC), and polycarbonate; a second plurality of conductive pads disposed on the transparent flexible sensor substrate, wherein the second plurality of conductive pads are coupled to the first plurality of conductive pads; and a first plurality of transparent sensing elements disposed on the transparent flexible sensor substrate and coupled to the second plurality of conductive pads via a second plurality of conductors. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
-
-
20. An input device comprising:
-
a flexible circuit substrate dimensionally stable up to a first temperature, wherein the first temperature allows thermal bonding to the flexible circuit substrate without significant thermally induced degradation, wherein the flexible circuit substrate comprises at least one selected from a group consisting of a condensate film, a thermoset material, polyimide, epoxy resin, and a liquid crystal polymer film; a first at least one conductive pad disposed on the flexible circuit substrate; a touch controller affixed to the flexible circuit substrate and coupled to the first at least one conductive pad via at least one conductor; a transparent sensor substrate that is dimensionally stable up to a second temperature that is lower than the first temperature, wherein the transparent sensor substrate is not dimensionally stable above the second temperature, wherein the transparent sensor substrate comprises at least one selected from a group consisting of a thermoplastic material, vinyl, polyethylene terephthalate (PET), polystyrene (PS), polyvinylchloride (PVC), and polycarbonate; a second at least one conductive pad disposed on the transparent sensor substrate, wherein the second at least one conductive pad is coupled to the first at least one conductive pad; and at least one conductive sensing element disposed on the transparent sensor substrate, wherein the second at least one conductive pad is coupled to the at least one conductive sensing element, and wherein the touch controller is configured to receive electrical signals from the at least one conductive sensing element to detect a position of at least one object in a sensing region of the input device.
-
Specification