Coplanar waveguide transition for multi-band impedance matching

• US 9,991,601 B2
• Filed: 09/30/2015
• Issued: 06/05/2018
• Est. Priority Date: 09/30/2015
• Status: Active Grant

• Current Assignee: Mitre Corporation
• Original Assignee: Mitre Corporation
• Inventors: McMichael, Ian T.
• Primary Examiner(s): Levi, Dameon E
• Assistant Examiner(s): Dawkins, Collin
• Application Number:
  US14/871,877
• Publication Number:
  US 20170093041A1
• Time in Patent Office: 979 Days
• Field of Search: 343700 MS, 343757, 343893
• CPC Class Codes: H01Q 5/40 Imbricated or interleaved structures; Combined or electromagnetically coupled arrangements, e.g. comprising two or more non-connected fed radiating elements
• CPC Class Codes: H01Q 9/0414 in a stacked or folded configuration
• CPC Class Codes: H01Q 9/0435 using two feed points
• CPC Class Codes: H01Q 9/0464 Annular ring patch

Abstract

A microstrip antenna including a first substrate, a ground plane disposed on a first side of the first substrate, a first conductive layer disposed on a second side of the first substrate, wherein the first conductive layer is configured to resonate at a first frequency, a second substrate disposed on the first conductive layer, a second conductive layer disposed on a side of the second substrate, wherein the second conductive layer is configured to resonate at a second frequency, a first feed portion extending through the first substrate, and configured to provide first excitation signals to the first conductive layer, a second feed portion extending through the second substrate, wherein the second feed portion is configured to provide second excitation signals to the second conductive layer, and a conductive strip disposed in the first conductive layer and electrically connecting the first feed portion and the second feed portion.

Claims

1. A microstrip antenna comprising:

a first substrate;

a ground plane disposed on a first side of the first substrate;

a first conductive layer disposed on a second side of the first substrate, opposite the first side, wherein the first conductive layer is configured to resonate at a first frequency;

a second substrate disposed on the first conductive layer, opposite the first substrate;

a second conductive layer disposed on a side of the second substrate opposite the first conductive layer, wherein the second conductive layer is configured to resonate at a second frequency, the second frequency being different than the first frequency;

a first feed conductor extending through the first substrate and terminating at a first location of the first conductive layer, wherein the first feed conductor is configured to provide first excitation signals to the first conductive layer;

a second feed conductor extending through the second substrate and terminating at a second location of the first conductive layer that is offset from the first location, wherein the second feed conductor is configured to provide second excitation signals to the second conductive layer; and

a conductive strip disposed in the first conductive layer and extending from the first location to the second location and electrically connecting the first feed conductor and the second feed conductor.

2. The microstrip antenna of claim 1, wherein the second conductive layer is configured to resonate at the second frequency in response to a signal propagated through the first feed conductor, the conductive strip, and the second feed conductor.

3. The microstrip antenna of claim 1, wherein the conductive strip is electrically insulated from surrounding portions of the first conductive layer.

4. The microstrip antenna of claim 1, wherein the first feed conductor comprises a first diameter and the second feed conductor comprises a second diameter, the second diameter being different than the first diameter.

5. The microstrip antenna of claim 1, wherein an axis of the first feed conductor is offset from an axis of the second feed conductor.

6. The microstrip antenna of claim 1, wherein the first and second conductive layers are concentric about an axis, the first feed conductor is disposed at a first distance from the axis, and the second feed conductor is disposed at a second distance from the axis, different than the first distance.

7. The microstrip antenna of claim 6, wherein the first frequency is lower than the second frequency and the first distance is greater than the second distance.

8. The microstrip antenna of claim 1, wherein the first feed conductor and the second feed conductor comprise metal plated vias.

9. The microstrip antenna of claim 1, wherein the first feed conductor is configured to provide impedance matching for the first conductive layer at the first frequency and the second feed conductor is configured to provide impedance matching for the second conductive layer at the second frequency.

10. The microstrip antenna of claim 9, comprising a feed structure, the feed structure comprising an input portion, the first conductor, the second conductor, and the conductive strip, wherein the feed structure is configured to:

provide impedance matching between a 50 Ohm input impedance at the input portion to a first impedance of the first conductive layer at the first frequency; and

provide impedance matching between the 50 Ohm input impedance at the input portion to a second impedance of the second conductive layer at the second frequency.