Crashworthy memory module having a thermal wiring disconnect system

• US 9,991,696 B2
• Filed: 07/15/2014
• Issued: 06/05/2018
• Est. Priority Date: 07/15/2014
• Status: Active Grant

• Current Assignee: Progress Rail Services Corporation (Caterpillar Incorporated)
• Original Assignee: Progress Rail Services Corporation (Caterpillar Incorporated)
• Inventors: Bartonek, Mark Joseph
• Primary Examiner(s): Wu, Jerry
• Assistant Examiner(s): Sul, Stephen
• Application Number:
  US14/331,678
• Publication Number:
  US 20160018244A1
• Time in Patent Office: 1,421 Days
• Field of Search: 361103, 361104, 361705, 361708, 361712, 361718, 361764, 36167931, 3122236
• CPC Class Codes: G01D 11/24 Housings ; Casings for instruments
• CPC Class Codes: G01D 9/005 Solid-state data loggers
• CPC Class Codes: H02H 5/04 responsive to abnormal temperature specially adapted for electric machines H02H7/0852

Abstract

A memory module is disclosed. The memory module may have an enclosure and a device disposed within the enclosure. The memory module may also have an orifice in a wall of the enclosure and a wire passing through the orifice. One end of the wire may be attached to the device. The memory module may further have a stopper attached to the wire. The stopper may be located abutting an outer surface of the enclosure. The memory module may also have a filler disposed within the enclosure. The filler may be configured to expand and be ejected out of the orifice when subjected to a threshold temperature. The filler may also be configured to push the stopper away from the outer surface and disconnect the wire from the device.

Claims

1. A memory module, including:

an enclosure;

a device disposed within the enclosure;

an orifice in a wall of the enclosure;

a wire passing through the orifice, one end of the wire being attached to the device;

a stopper attached to the wire, the stopper being located abutting an outer surface of the enclosure; and

a filler disposed within the enclosure and disposed on the device, the filler being configured to;

expand and be ejected out of the orifice when subjected to a threshold temperature;

push the stopper away from the outer surface; and

disconnect the wire from the device.

2. The memory module of claim 1, wherein the one end of the wire is soldered to a pad on the device.

3. The memory module of claim 1, wherein the stopper comprises at least one of a knot, a bead, a grommet, and a crimp.

4. The memory module of claim 1, wherein the filler is wrapped around the device.

5. The memory module of claim 1, wherein the enclosure includes:

a top portion having an upper recess; and

a bottom portion having a lower recess, the bottom portion being configured to be fixedly attached to the top portion.

6. The memory module of claim 5, wherein the filler comprises:

a first filler portion disposed in the upper recess; and

a second filler portion disposed in the lower recess.

7. The memory module of claim 6, further including the device disposed in the enclosure such that:

the first filler portion is disposed adjacent a first side of the device; and

the second filler portion is disposed adjacent a second side of the device opposite the first side.

8. The memory module of claim 1, wherein the filler occupies about 30% to 60% of a volume of the enclosure.

9. The memory module of claim 1, wherein the filler comprises a thermal clay having a thermal conductivity of about 0.5 to 2 W/mK.

10. A thermal wiring disconnect system for a device disposed within an enclosure, comprising:

a stopper attached to a wire connected to the device, the wire exiting the enclosure through an orifice and the stopper being located adjacent an outer surface of the enclosure; and

a filler disposed within the enclosure and disposed on the device, the filler being configured to;

expand and be ejected through the orifice when subjected to a threshold temperature;

push the stopper away from the outer surface; and

disconnect the wire from the device.

11. The thermal wiring disconnect system of claim 10, wherein the wire is soldered to a pad on the device.

12. The thermal wiring disconnect system of claim 10, wherein the stopper comprises at least one of a knot, a bead, a grommet, and a crimp.

13. The thermal wiring disconnect system of claim 10, wherein the filler is wrapped around the device within the enclosure.

14. The thermal wiring disconnect system of claim 10, wherein the filler comprises a thermal clay.

15. The thermal wiring disconnect system of claim 14, wherein the thermal clay is configured to expand by about 2 to 5 times an initial volume of the thermal clay when the thermal clay is subjected to the threshold temperature.

16. The thermal wiring disconnect system of claim 10, wherein the threshold temperature ranges from about 250°

F. to 370°

F.