Insert molding around glass members for portable electronic devices

• US 9,992,891 B2
• Filed: 01/11/2016
• Issued: 06/05/2018
• Est. Priority Date: 11/11/2010
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Pakula, David, Lynch, Stephen Brian, Dinh, Richard Hung Minh, Tan, Tang Yew, Tan, Lee Hua
• Primary Examiner(s): Ngo, Hung V
• Application Number:
  US14/993,058
• Publication Number:
  US 20160212872A1
• Time in Patent Office: 876 Days
• CPC Class Codes: A45C 11/00 Receptacles for purposes not provided for in groups A45C1/00-A45C9/00 specially adapted for toiletry or cosmetic equipment A45D29/20, A45D44/18; travelling sewing kits A45F3/48
• CPC Class Codes: A45F 5/00 Holders or carriers for hand articles; Holders or carriers for use while travelling or camping
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: G06F 3/041 Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
• CPC Class Codes: H02G 11/02 using take-up reel or drum
• CPC Class Codes: H04M 1/0249 Details of the mechanical connection between the housing parts or relating to the method of assembly
• CPC Class Codes: H04M 1/0266 for a display module assembly
• CPC Class Codes: H05K 5/0017 with operator interface units
• CPC Class Codes: H05K 5/03 Covers

Abstract

An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.

Claims

1. An electronic device enclosure, comprising:

a glass cover for a top surface for the electronic device enclosure, the glass cover further having sides around a bottom surface;

an adhesive deposited around a periphery of the bottom surface of the glass cover; and

a peripheral structure for providing a support surface for the glass cover and for providing side protective surfaces for the glass cover, the peripheral structure including an inner peripheral member and an outer peripheral member, the inner peripheral member being at least partially secured to the glass cover by the adhesive and the outer peripheral member molded about at least a portion of the sides of the glass cover and adjacent to at least a portion of the inner peripheral member.

2. The electronic device enclosure as recited in claim 1, wherein the outer peripheral structure is molded about the periphery of the bottom surface of the glass cover and molded tightly against the inner peripheral structure;

and

an enclosure support structure abutting the peripheral structure and forming, with the peripheral structure, at least part of a substantially continuous sidewall of the electronic device housing.

3. The electronic device enclosure as recited in claim 2, wherein:

the adhesive is thermally activated; and

the adhesive is thermally activated while the peripheral structure is molded about the glass cover.

4. The electronic device enclosure, comprising:

a glass cover for a top surface for the electronic device enclosure;

an adhesive deposited around a periphery of the bottom surface of the glass cover; and

a peripheral structure for providing a support surface for the glass cover and for providing side protective surfaces for the glass cover, the peripheral structure including an inner peripheral member attached to the glass cover via the adhesive and an outer peripheral member molded about at least a portion of sides of the glass cover is at least partially secured to the glass cover by the adhesive; and

an enclosure support structure having a surface coupled to the peripheral structure, the enclosure support structure further comprises another surface, wherein;

the peripheral structure and enclosure support structure cooperate to form a continuous sidewall of the electronic device enclosure.

5. An enclosure for an electronic device, comprising:

an optically-transparent member having sides and a bottom surface;

a peripheral structure comprising;

an inner peripheral member having a first surface coupled to the optically-transparent member; and

an outer peripheral member molded about at least a portion of the sides of the optically-transparent member and molded around the inner peripheral member; and

an enclosure support structure defining at least a portion of the enclosure, the enclosure support structure being coupled to the peripheral member, wherein an exterior portion of the peripheral structure and an exterior portion of the enclosure support structure are substantially coplanar and form a sidewall of the electronic device housing.

6. The enclosure of claim 5, wherein

the enclosure support structure is coupled to the outer peripheral member.

7. The enclosure of claim 5, wherein the optically-transparent member is glass.

8. The enclosure of claim 5, wherein the peripheral structure is adjacent the sides and the bottom surface of the optically-transparent member.

9. The enclosure of claim 8, wherein the sides and the bottom surface are substantially perpendicular to one another.

10. The enclosure of claim 5, wherein the optically-transparent member comprises at least one of a chamfered or rounded edge.

11. The enclosure of claim 10, wherein the peripheral structure is adjacent to the at least one of a chamfered or rounded edge.

12. The enclosure of claim 11, wherein no gap exists between the peripheral structure and the at least one of a chamfered or rounded edge.

13. The enclosure of claim 5, further comprising an adhesive between the optically-transparent member and the peripheral structure.

14. An electronic device housing, comprising:

a first cover member formed from one of glass or plastic;

a first peripheral structure supporting the first cover member;

a second cover member;

a second peripheral structure supporting the second cover member;

an enclosure support structure between and abutting the first and second peripheral structures, wherein the first peripheral structure, enclosure support structure, and second peripheral structure cooperate to form a sidewall of the electronic device housing.

15. The electronic device housing of claim 14, wherein:

the first and second peripheral structures are formed from plastic; and

the enclosure support structure is formed from metal.

16. The electronic device housing of claim 14, wherein the first and second cover members are formed from an identical material.

17. The electronic device housing of claim 14, wherein the first cover member overlies a display.

18. The electronic device housing of claim 14, further comprising an internal structure affixed to the enclosure support structure.

19. The electronic device housing of claim 18, wherein the internal structure is integral with the enclosure support structure.

20. The electronic device housing of claim 14, wherein at least one of the first and second cover members comprise a chamfered edge.

21. The electronic device housing of claim 14, wherein at least one of the first and second cover members comprise a rounded edge.

22. The electronic device housing of claim 14, wherein:

the first cover member comprises a beveled edge; and

the first peripheral structure extends at least partly around the beveled edge.

23. The electronic device housing of claim 14, wherein the sidewall is coplanar with a portion of the first cover member.

24. An electronic device, comprising:

a glass cover, the glass cover having sides and a bottom surface;

a display disposed beneath the glass cover;

a touch component operative to sense a touch on the glass cover;

a peripheral structure supporting the glass cover, the peripheral structure including an inner peripheral structure and a molded outer peripheral structure;

an enclosure support structure defining at least a portion of the enclosure and coupled to the outer peripheral structure, wherein;

the inner peripheral structure is situated about a periphery of the bottom surface of the glass cover;

the enclosure support structure is attached to the outer peripheral structure; and

the peripheral structure and enclosure support structure cooperate to form a continuous sidewall of the electronic device housing that is substantially perpendicular to a plane defined by an input surface of the glass cover.