LED filament, LED filament assembly and LED bulb

• US 9,995,474 B2
• Filed: 05/31/2016
• Issued: 06/12/2018
• Est. Priority Date: 06/10/2015
• Status: Active Grant

• Current Assignee: Jiaxing Super Lighting Electric Appliance Co., Ltd.
• Original Assignee: Jiaxing Super Lighting Electric Appliance Co., Ltd.
• Inventors: Jiang, Tao, Jiang, Wenjang, Xu, Hong
• Primary Examiner(s): Savusdiphol, Paultep
• Application Number:
  US15/168,541
• Publication Number:
  US 20160363267A1
• Time in Patent Office: 742 Days
• Field of Search: 36224902, 36224906
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21Y 2107/00 Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/501 characterised by the materials, e.g. binder

Abstract

A LED filament includes a frame; two metal electrodes, respectively disposed on two sides of the frame; a LED chip assembly, comprising a plurality of LED chips disposed inside the frame and electrically connecting to the two metal electrodes respectively; and a gel comprising phosphor, wrapping the LED chip assembly and parts of the metal electrodes inside the frame.

Claims

1. A LED filament, comprising:

a frame, the frame is a bottomless frame;

two metal electrodes, respectively disposed on two sides of the frame;

a LED chip assembly, comprising a plurality of LED chips disposed inside the frame and electrically connecting to the two metal electrodes respectively; and

a gel comprising phosphor, wrapping the LED chip assembly and parts of the metal electrodes inside the frame.

2. The LED filament according to claim 1, wherein the frame comprises two holding sides and two non-holding sides, and the two metals are disposed on the two holding sides respectively.

3. The LED filament according to claim 2, wherein a fasten means is configured to fasten the two metal electrodes on the two holding sides of the frame.

4. The LED filament according to claim 2, wherein two holding platforms are formed on the two holding sides respectively for holding the two metal electrodes.

5. The LED filament according to claim 4, wherein a fasten means is configured to fasten the two metal electrodes on the two holding sides of the frame.

6. The LED filament according to claim 1, wherein the two metal electrodes are respectively embedded at the two holding sides of the frame.

7. The LED filament according to claim 1, wherein the two metal electrodes respectively comprises a plurality of vias for combing with the frame.

8. The LED filament according to claim 1, wherein the frame is made of a light transmissive material.

9. The LED filament according to claim 8, wherein the material of the frame may be selected from thermostable transparent silicon gel or various kinds of plastics with the similar property.

10. The LED filament according to claim 1, wherein each sides of the plurality of LED chips contacts the gel comprising phosphor.

11. The LED filament according to claim 1, further comprising an auxiliary carrier for supporting the LED chip assembly.

12. The LED filament according to claim 11, wherein the frame further comprises a plurality of auxiliary supports, each of the auxiliary supports holds each of the LED chips respectively.

13. A LED filament, comprising:

two frame plates;

two metal electrodes, respectively configured between the two frame plates;

a LED chip assembly, comprising a plurality of LED chips electrically connecting to the two metal electrodes respectively and configured between the two frame plates and the two metal electrodes; and

a gel comprising phosphor, disposed between the two frame plates for wrapping the LED chip assembly and parts of the metal electrodes inside the frame.

14. The LED filament according to claim 13, wherein the frame plate is made of a light transmissive material.

15. The LED filament according to claim 14, wherein the material of the frame plate may be selected from thermostable transparent silicon gel or various kinds of plastics with the similar property.

16. The LED filament according to claim 13, wherein each sides of the plurality of LED chips contacts the gel comprising phosphor.

17. The LED filament according to claim 13, wherein a fasten means is configured to fasten the two metal electrodes between the two frame plates.

18. The LED filament according to claim 13, further comprising an auxiliary carrier for supporting the LED chip assembly.

19. The LED filament according to claim 18, wherein the frame plates further comprise a plurality of auxiliary supports, each of the auxiliary supports holds each of the LED chips respectively.

20. A LED light bulb, comprising:

a bulb housing, having an opening;

a metal stem, swapping the air in the LED light bulb and providing a function of thermal conductivity for the light bulb;

a heat sink, connecting with the opening of the bulb housing and having a cover near the opening of the bulb housing for supporting the metal stem and transmitting the thermal transmitted by the metal stem outside the LED light bulb;

a bulb holder, connecting to the heat sink; and

a metal conductive support, disposed on the cover of the heat sink for supporting and electrically connecting with a plurality of filaments;

wherein each of the plurality of filaments comprises a bottomless frame, two metal electrodes respectively disposed on two sides of the frame, a LED chip assembly comprising a plurality of LED chips disposed inside the frame, and a gel with phosphor wrapping the LED chip assembly and parts of the metal electrodes inside the frame.