Multidirectional semiconductor arrangement testing
First Claim
1. A semiconductor testing arrangement, comprising:
- a probe card comprising;
a first pin arrangement comprising a first set of linearly arranged pins aligned in a first direction; and
a second pin arrangement comprising a second set of linearly arranged pins aligned in a second direction; and
a semiconductor wafer comprising;
a first set of pads for mating with the first set of linearly arranged pins and aligned in the first direction, wherein the first set of pads is disposed between a first integrated circuit and a second integrated circuit that is immediately adjacent the first integrated circuit;
a second set of pads for mating with the first set of linearly arranged pins and aligned in the first direction, wherein;
the second set of pads is disposed between the first integrated circuit and the second integrated circuit,the first set of pads is offset from the second set of pads in the second direction perpendicular to the first direction, andthe first set of pads is offset in the first direction from the second set of pads;
a third set of pads for mating with the second set of linearly arranged pins and aligned in the second direction, wherein the third set of pads is disposed between the first integrated circuit and a third integrated circuit that is immediately adjacent the first integrated circuit; and
a fourth set of pads for mating with the second set of linearly arranged pins and aligned in the second direction, wherein;
the fourth set of pads is disposed between the first integrated circuit and the third integrated circuit,the third set of pads is offset in the first direction from the fourth set of pads, andthe third set of pads is offset in the second direction from the fourth set of pads.
1 Assignment
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Accused Products
Abstract
One or more probe cards, wafer testers, and techniques for testing a semiconductor arrangement are provided. Testline arrangements are formed within scribe lines of a semiconductor wafer, in multiple directions, such as an x-direction and a y-direction. A wafer tester is configured to concurrently test the semiconductor arrangement in multiple directions using a multidirectional probe arrangement of a probe card. In some embodiments, a first pin arrangement of the multidirectional probe arrangement is mated with a first testline arrangement in a first direction, and a second pin arrangement of the multidirectional probe arrangement is mated with a second testline arrangement in a second direction. The wafer tester concurrently tests the semiconductor arrangement in multiple directions, such as in the first direction and the second direction, through the pin arrangements mated with the testline arrangements.
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Citations
20 Claims
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1. A semiconductor testing arrangement, comprising:
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a probe card comprising; a first pin arrangement comprising a first set of linearly arranged pins aligned in a first direction; and a second pin arrangement comprising a second set of linearly arranged pins aligned in a second direction; and a semiconductor wafer comprising; a first set of pads for mating with the first set of linearly arranged pins and aligned in the first direction, wherein the first set of pads is disposed between a first integrated circuit and a second integrated circuit that is immediately adjacent the first integrated circuit; a second set of pads for mating with the first set of linearly arranged pins and aligned in the first direction, wherein; the second set of pads is disposed between the first integrated circuit and the second integrated circuit, the first set of pads is offset from the second set of pads in the second direction perpendicular to the first direction, and the first set of pads is offset in the first direction from the second set of pads; a third set of pads for mating with the second set of linearly arranged pins and aligned in the second direction, wherein the third set of pads is disposed between the first integrated circuit and a third integrated circuit that is immediately adjacent the first integrated circuit; and a fourth set of pads for mating with the second set of linearly arranged pins and aligned in the second direction, wherein; the fourth set of pads is disposed between the first integrated circuit and the third integrated circuit, the third set of pads is offset in the first direction from the fourth set of pads, and the third set of pads is offset in the second direction from the fourth set of pads. - View Dependent Claims (2, 3, 4, 5)
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6. A method for testing a semiconductor arrangement, comprising:
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utilizing a multidirectional probe arrangement to concurrently test a first testline arrangement and a second testline arrangement, comprising; mating a first set of linearly arranged pins of the multidirectional probe arrangement aligned in a first direction with a first set of pads of the first testline arrangement aligned in the first direction and disposed between a first integrated circuit and a second integrated circuit that is immediately adjacent the first integrated circuit; and mating a second set of linearly arranged pins of the multidirectional probe arrangement aligned in a second direction, different than the first direction, with a second set of pads of the second testline arrangement aligned in the second direction and disposed between the first integrated circuit and a third integrated circuit that is immediately adjacent the first integrated circuit; and utilizing the multidirectional probe arrangement to concurrently test a third testline arrangement and a fourth testline arrangement, comprising; mating the first set of linearly arranged pins with a third set of pads aligned in the first direction and offset in the first direction from the first set of pads while the first set of linearly arranged pins is not mated with the first set of pads, wherein the third set of pads is disposed between the first integrated circuit and the second integrated circuit; and mating the second set of linearly arranged pins with a fourth set of pads aligned in the second direction and offset in the second direction from the second set of pads while the second set of linearly arranged pins is unmated from the first set of pads, wherein the fourth set of pads is disposed between the first integrated circuit and the third integrated circuit. - View Dependent Claims (7, 8, 9)
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10. A semiconductor testing arrangement, comprising:
a semiconductor wafer comprising; a first set of pads aligned in a first direction for mating with a first set of linearly arranged pins of a probe card, wherein the first set of pads is disposed between a first integrated circuit and a second integrated circuit that is immediately adjacent the first integrated circuit; a second set of pads aligned in the first direction for mating with the first set of linearly arranged pins, wherein; the second set of pads is disposed between the first integrated circuit and the second integrated circuit, the first set of pads is offset from the second set of pads in a second direction different than the first direction, and the first set of pads is offset in the first direction from the second set of pads; a third set of pads aligned in the second direction for mating with a second set of linearly arranged pins of the probe card, wherein the third set of pads is disposed between the first integrated circuit and a third integrated circuit that is immediately adjacent the first integrated circuit; and a fourth set of pads aligned in the second direction for mating with the second set of linearly arranged pins, wherein; the fourth set of pads is disposed between the first integrated circuit and the third integrated circuit, and the third set of pads is offset in the second direction from the fourth set of pads. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
Specification