Method and apparatus for producing an electronic device
First Claim
Patent Images
1. A method of producing an electronic device, comprising the steps of:
- applying an adhesive material in a first pattern on a surface of a first substrate;
bringing a second substrate having a metal foil disposed thereon proximate to the first substrate such that a portion of the metal foil contacts the adhesive material;
activating the adhesive material;
separating the first substrate and the second substrate, whereby the portion of the metal foil is transferred to the first substrate;
applying a further adhesive material in a second pattern on top of the transferred metal foil;
forming a via from a top surface of the further adhesive material to the transferred metal foil; and
depositing a metallic material on top of the second pattern;
wherein the metallic material is conductively coupled to a portion of the transferred metal foil.
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Abstract
A method and apparatus for producing an electronic device are disclosed. An adhesive material is jetted in a first pattern on a surface of a receiver substrate. A carrier having a metal foil disposed thereon is brought into contact with the first substrate such that a portion of the metal foil contacts the adhesive material. The adhesive material is activated using at least one of mechanical pressure and heat while the portion of the metal foil is in contact with the adhesive material. The first substrate and the second substrate are separated, whereby the portion of the metal foil is transferred to the first substrate.
57 Citations
12 Claims
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1. A method of producing an electronic device, comprising the steps of:
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applying an adhesive material in a first pattern on a surface of a first substrate; bringing a second substrate having a metal foil disposed thereon proximate to the first substrate such that a portion of the metal foil contacts the adhesive material; activating the adhesive material; separating the first substrate and the second substrate, whereby the portion of the metal foil is transferred to the first substrate; applying a further adhesive material in a second pattern on top of the transferred metal foil; forming a via from a top surface of the further adhesive material to the transferred metal foil; and depositing a metallic material on top of the second pattern; wherein the metallic material is conductively coupled to a portion of the transferred metal foil. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of producing an electronic device, comprising the steps of:
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jetting an adhesive material in a first pattern on a surface of a first substrate; bringing a second substrate having a metal foil disposed thereon proximate to the first substrate such that a portion of the metal foil contacts the adhesive material; activating the adhesive material; separating the first substrate and the second substrate, whereby the portion of the metal foil is transferred to the first substrate; applying a further adhesive material in a second pattern on top of the transferred metal foil; depositing a metallic material on top of the second pattern; and forming a via from a top surface of the further adhesive material to the transferred metal foil; wherein the metallic material is conductively coupled to a portion of the transferred metal foil.
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Specification