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Optically-masked microelectronic packages and methods for the fabrication thereof

  • US 9,997,492 B2
  • Filed: 11/21/2013
  • Issued: 06/12/2018
  • Est. Priority Date: 11/21/2013
  • Status: Active Grant
First Claim
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1. A method for fabricating an optically-masked microelectronic package, comprising:

  • building redistribution layers over the frontside of a semiconductor die, the redistribution layers comprising a body of dielectric material in which a plurality of interconnect lines are formed;

    forming an optical mask layer overlying the frontside of the semiconductor die and at least a portion of the redistribution layers, the optical mask layer having an opacity greater than the opacity of the body of dielectric material and blocking or obscuring visual observation of an interior portion of the microelectronic package through the redistribution layers; and

    producing a contact array before or after formation of the optical mask layer electrically coupled to the plurality of interconnect lines, at least some of the contacts included within the contact array projecting through openings in the optical mask layer, the openings sized such that a circumferential clearance having a predetermined gap width is formed around each contact projecting through the optical mask layer.

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