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Semiconductor package assembly

  • US 9,997,498 B2
  • Filed: 06/16/2017
  • Issued: 06/12/2018
  • Est. Priority Date: 03/13/2015
  • Status: Active Grant
First Claim
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1. A semiconductor package assembly, comprising:

  • a semiconductor die;

    a first molding compound covering a back surface of the semiconductor die;

    a redistribution layer (RDL) structure disposed on a front surface of the semiconductor die, wherein the semiconductor die is coupled to the RDL structure;

    a passive device, embedded in the RDL structure and coupled to the semiconductor die;

    conductive structures disposed on a first surface of the RDL structure, the first surface facing away from the semiconductor die, wherein the conductive structures are coupled to the RDL structure, and a thickness of the passive device is less than a diameter of the conductive structures as viewed in vertical cross-section; and

    a second molding compound disposed on the front surface of the semiconductor die;

    wherein the RDL structure comprises conductive traces extended into the second molding compound.

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