Micro-transfer-printed light-emitting diode device
First Claim
1. A compound light-emitting diode (LED) device, comprising:
- a semiconductor substrate having an active electronic circuit formed in or on the semiconductor substrate;
two or more electrically conductive circuit connection pads formed in or on the semiconductor substrate, the active electronic circuit electrically connected to the two or more circuit connection pads;
one or more LEDs, each LED having at least two LED electrodes or connection pads and a fractured LED tether;
an adhesive layer disposed between the semiconductor substrate and each LED, wherein each LED is micro-transfer printed on the adhesive layer and the adhesive layer adheres the semiconductor substrate to the LED; and
two or more electrical conductors, each electrical conductor electrically connecting one of the electrodes or LED connection pads to one of the circuit connection pads.
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Accused Products
Abstract
A compound light-emitting diode (LED) device includes a semiconductor substrate having an active electronic circuit formed in or on the semiconductor substrate. Two or more electrically conductive circuit connection pads are formed in or on the semiconductor substrate and are electrically connected to the active electronic circuit. One or more micro-transfer printed LEDs each have at least two LED electrodes or connection pads and a fractured LED tether. An adhesive layer is disposed between the semiconductor substrate and each LED to adhere the semiconductor substrate to the LED. Two or more electrical conductors electrically connect one of the electrodes or LED connection pads to one of the circuit connection pads.
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Citations
20 Claims
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1. A compound light-emitting diode (LED) device, comprising:
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a semiconductor substrate having an active electronic circuit formed in or on the semiconductor substrate; two or more electrically conductive circuit connection pads formed in or on the semiconductor substrate, the active electronic circuit electrically connected to the two or more circuit connection pads; one or more LEDs, each LED having at least two LED electrodes or connection pads and a fractured LED tether; an adhesive layer disposed between the semiconductor substrate and each LED, wherein each LED is micro-transfer printed on the adhesive layer and the adhesive layer adheres the semiconductor substrate to the LED; and two or more electrical conductors, each electrical conductor electrically connecting one of the electrodes or LED connection pads to one of the circuit connection pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method of making a compound light-emitting diode (LED) device, comprising:
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providing a semiconductor substrate having an active electronic circuit formed in or on the semiconductor substrate and two or more electrically conductive circuit connection pads formed on the semiconductor substrate, the active electronic circuit electrically connected to the two or more circuit connection pads; providing one or more LEDs, each LED having at least two LED connection pads and a fractured LED tether; disposing an adhesive layer between the semiconductor substrate and each LED; disposing each LED on the adhesive layer and the adhesive layer adheres the semiconductor substrate to the LED; and forming two or more electrical conductors, each electrical conductor electrically connecting one of the LED connection pads to one of the circuit connection pads. - View Dependent Claims (20)
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Specification