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Method of manufacturing a circuit device

  • US 9,998,032 B2
  • Filed: 09/12/2017
  • Issued: 06/12/2018
  • Est. Priority Date: 09/24/2010
  • Status: Active Grant
First Claim
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1. A method of manufacturing a circuit device, comprising:

  • providing a lead frame comprising a plurality of leads, each comprising an island portion, a bonding portion elevated from the island portion, a slope portion extending obliquely so as to connect the island portion and the bonding portion, and a lead portion extending from the bonding portion;

    mounting a first transistor and a first diode of a first phase on an upper surface of the island portion of a first lead;

    connecting the first transistor and the first diode of the first phase to a bonding portion of a second lead by a first wiring;

    mounting a second transistor and a second diode of the first phase on the upper surface of the island portion of a third lead;

    connecting the second transistor and the second diode of the first phase to a bonding portion of the second lead by a second wiring;

    attaching lower surfaces of the island portion of each of the plurality of leads to an upper surface of a circuit board; and

    encapsulating by a resin the circuit board, the first and second transistors, the first and second diodes and the lead frame so that the lead portion of each of the plurality of leads are not covered by the resin.

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