Package programmable decoupling capacitor array

• US 9,998,100 B2
• Filed: 08/28/2015
• Issued: 06/12/2018
• Est. Priority Date: 08/28/2015
• Status: Active Grant

• Current Assignee: Ampere Computing LLC, MACOM Connectivity Solutions, LLC (MACOM Technology Solutions Holdings, Inc.)
• Original Assignee: Ampere Computing LLC
• Inventors: Thaik, Rich, Yeung, Alfred, Lambert, April, Plunkett, Jeremy
• Primary Examiner(s): Donovan, Lincoln
• Assistant Examiner(s): MATTISON, DAVID D
• Application Number:
  US14/838,778
• Publication Number:
  US 20170063355A1
• Time in Patent Office: 1,019 Days
• Field of Search: 327556
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/5223 Capacitor integral with wiring layers
• CPC Class Codes: H01L 23/525 with adaptable interconnections
• CPC Class Codes: H01L 23/5382 Adaptable interconnections, e.g. for engineering changes
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H03K 5/1252 Suppression or limitation of noise or interference specially adapted for transmission systems H04B15/00, H04L25/08

Abstract

A semiconductor chip allows for a selected amount of on-die decoupling capacitance to be connected to a very-large-scale integrated circuit (VLSI) system after the circuit design is complete. The semiconductor chip comprises an integrated circuit disposed on a packaging substrate, and a power distribution network that is electrically connectable to the integrated circuit via a programmable connectivity array via the packaging substrate.

Claims

1. A semiconductor chip, comprising:

an integrated circuit disposed on a packaging substrate; and

a power distribution network that is electrically connectable to the integrated circuit via a programmable connectivity array via the packaging substrate,

wherein

the programmable connectivity array comprises discrete blocks of on-die programmable decoupling capacitors formed on the semiconductor chip,

multiple electrically conductive bumps are disposed on each block of the discrete blocks and are connectable to the power distribution network,

a specified capacitance is obtainable by connecting a first subset of the discrete blocks of the on-die programmable decoupling capacitors to the power distribution network and the integrated circuit via the packaging substrate while a second subset of the discrete blocks of the on-die programmable decoupling capacitors remains unconnected, and

the first subset of the discrete blocks of the on-die programmable decoupling capacitors is configured to serve as a band rejection filter, and a frequency of the band rejection filter is controllable as a function of a first number of the first subset of the discrete blocks and a second number of the electrically conductive bumps used to connect each block of the first subset of the discrete blocks to the power distribution network.

2. The semiconductor chip of claim 1, wherein the discrete blocks of on-die programmable decoupling capacitors and the power distribution network are integrated in the semiconductor chip.

3. The semiconductor chip of claim 1, wherein the first subset of the discrete blocks of the on-die programmable decoupling capacitors is configured to serve as a notch filter.

4. The semiconductor chip of claim 1, wherein the specified capacitance is configured to suppress a resonant frequency of the semiconductor chip.

5. The semiconductor chip of claim 1, wherein the programmable connectivity array is variable by modifying the programmable connectivity array of the packaging substrate.

6. The semiconductor chip of claim 1, wherein the second subset of the discrete blocks of the on-die programmable decoupling capacitors are connectable to an alternative power distribution system of the chip.

7. The semiconductor chip of claim 1, wherein the discrete blocks of on-die programmable decoupling capacitors comprise low priority decoupling capacitors.

8. The semiconductor chip of claim 1, further comprising a processor configured to perform one or more processing functions in connection with operation of the integrated circuit.

17. The semiconductor chip of claim 1, wherein the first subset of the discrete blocks are connected to the power distribution network and the integrated circuit via conductive traces within the packaging substrate.

9. A method of suppressing supply noise in a semiconductor chip, comprising:

placing a programmable connectivity array physically near an integrated circuit embedded in a semiconductor chip, wherein the programmable connectivity array comprises discrete blocks of on-die programmable decoupling capacitors formed on the semiconductor chip, the semiconductor chip is supported on a packaging substrate, and multiple electrically conductive bumps are disposed on each block of the discrete blocks;

connecting a first subset of the discrete blocks of the on-die programmable decoupling capacitors to the integrated circuit and a power distribution network of the semiconductor chip to obtain a target capacitance, wherein the connecting causes a second subset of the discrete blocks of the on-die programmable decoupling capacitors to remain unconnected, the first subset of the discrete blocks is configured to serve as a band rejection filter, and the connecting comprises

setting a frequency of the band rejection filter as a function of a first number of the first subset of the discrete blocks and a second number of the electrically conductive bumps used to connect each block of the first subset of the discrete blocks to the power distribution network; and

supplying power to the integrated circuit via the first subset of the discrete blocks through the packaging substrate.

10. The method of claim 9, wherein the connecting comprises connecting the first number of the first subset of the discrete blocks to yield the target capacitance.

11. The method of claim 9, further comprising configuring the discrete blocks of on-die programmable decoupling capacitors to serve as a notch filter in the integrated circuit.

12. The method of claim 9, wherein the discrete blocks of on-die programmable decoupling capacitors are integrated in the semiconductor chip.

15. The method of claim 9, further comprising connecting one or more blocks of the second subset of the discrete blocks of the on-die programmable decoupling capacitors to a second power distribution network of the semiconductor chip.

16. The method of claim 9, wherein the connecting comprises forming electrical traces in the packaging substrate that electrically connect the first subset of the discrete blocks of the on-die programmable decoupling capacitors to the integrated circuit and the power distribution network.

13. A method of suppressing resonant peaks in an integrated circuit in a semiconductor chip, comprising:

supporting the semiconductor chip on a packaging substrate; and

supplying power to the integrated circuit via a programmable connectivity array through the packaging substrate,

wherein

the programmable connectivity array comprises a first subset of discrete blocks of on-die programmable decoupling capacitors that are formed on the semiconductor chip, the first subset being a selectable number of the discrete blocks, smaller than a total number of the discrete blocks, that correspond to a defined capacitance,

a second subset of the discrete blocks of on-die programmable decoupling capacitors remain unconnected,

the discrete blocks are placed physically near the integrated circuit,

the first subset of the discrete blocks form a band rejection filter of the semiconductor chip,

multiple electrically conductive bumps are formed on each block of the discrete blocks of on-die programmable decoupling capacitors, and

a frequency of the band rejection filter is configurable as a function of the number of the first subset of the discrete blocks and a number of the electrically conductive bumps through which the power is supplied to the integrated circuit.

14. The method of claim 13, further comprising configuring the first subset of discrete blocks to serve as a notch filter for the integrated circuit.

18. The method of claim 13, wherein the supplying power comprises supplying the power from a first power distribution network of the semiconductor chip, and the method further comprises supplying power from a second power distribution network of the semiconductor chip to another integrated circuit in the semiconductor chip via the second subset of the discrete blocks.

19. The method of claim 13, further comprising operating a processor to perform a processing function in connection with operation of the integrated circuit.

20. The method of claim 13, further comprising determining the defined capacitance as a capacitance determined to suppress a resonant frequency of the semiconductor chip.