Method of manufacturing an electronic sticker

• US 9,999,128 B2
• Filed: 11/04/2016
• Issued: 06/12/2018
• Est. Priority Date: 11/06/2015
• Status: Active Grant

• Current Assignee: Chibitronics Pte Limited
• Original Assignee: Chibitronics Private Limited
• Inventors: Huang, Andrew Shane, Qi, Jie
• Primary Examiner(s): ARBES, CARL J
• Application Number:
  US15/344,217
• Publication Number:
  US 20170135212A1
• Time in Patent Office: 585 Days
• CPC Class Codes: C09J 9/02 Electrically-conducting adhesives
• CPC Class Codes: H01R 4/04 using electrically conductive adhesives
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2203/0228 Cutting, sawing, milling or shearing
• CPC Class Codes: H05K 2203/066 Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
• CPC Class Codes: H05K 3/20 by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/22 Secondary treatment of printed circuits H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence

Abstract

Electronic sticker technology that enables assembly of circuits at ambient temperature without the use of any special tools.

Claims

1. A method of manufacturing an electronic sticker comprising:

cutting an anisotropic adhesive into an anisotropic adhesive panel, the anisotropic adhesive panel having a first side and a second side;

protecting the first side of the anisotropic adhesive panel with a first wax paper;

protecting the second side of the anisotropic adhesive panel with a second wax paper, the second wax paper having a lower surface energy than the first wax paper;

die-cutting the anisotropic adhesive panel using a full-release technique, the die-cutting forming a pattern featuring alignment holes;

holding a fully-assembled electronics circuit module in place on a flexible substrate with a vacuum chuck that has been machined with cavities to accommodate a profile on a first side of the flexible substrate, the vacuum chuck containing pins that pierce both the flexible substrate and the anisotropic adhesive panel;

peeling back the second wax paper, semi-exposing the anisotropic adhesive panel;

aligning the semi-exposed anisotropic adhesive panel to the pins of the vacuum chuck;

laminating the anisotropic adhesive panel and the fully-assembled electronics circuit module to the flexible substrate with a roller;

holding the anisotropic adhesive panel, the fully-assembled electronics circuit module and the flexible substrate in an oven.

2. The method of claim 1, wherein the roller applies a temperature of at least 30°

C.

3. The method of claim 2, wherein the roller further applies a pressure of at least 15 psi.

4. The method of claim 3, wherein the roller is applied for a period of at least five seconds.

5. The method of claim 4, wherein the holding in the oven is at approximately 40°

C.

6. The method of claim 5, wherein the holding in the oven for at least half an hour.

7. The method of claim 6, wherein the vacuum chuck is heated.