Cooling apparatus for cooling electronic device in aircraft

• US 9,999,164 B2
• Filed: 10/07/2016
• Issued: 06/12/2018
• Est. Priority Date: 08/13/2014
• Status: Active Grant

• Current Assignee: IHI Corporation
• Original Assignee: IHI Corporation
• Inventors: Kimura, Hiroyuki, Matsuno, Shinsuke, Morioka, Noriko, Seki, Naoki
• Primary Examiner(s): Dravininkas, Adam B
• Application Number:
  US15/288,468
• Publication Number:
  US 20170027088A1
• Time in Patent Office: 613 Days
• CPC Class Codes: B64D 13/08 the air being heated or cooled
• CPC Class Codes: B64D 2013/0614 with subsystems for cooling avionics
• CPC Class Codes: B64D 47/00 Equipment not otherwise provided for
• CPC Class Codes: H05K 7/20863 Forced ventilation, e.g. on heat dissipaters coupled to components
• CPC Class Codes: H05K 7/20881 Liquid coolant with phase change
• CPC Class Codes: Y02T 50/40 Weight reduction
• CPC Class Codes: Y02T 50/50 On board measures aiming to increase energy efficiency

Abstract

A cooling device applicable to an airplane having a pressurized cabin and a ram air channel for cooling an electronic device arranged in the pressurized cabin, is comprised of a partition wall separating the pressurized cabin from the ram air channel; and a heat exchanger thermally in contact with the electronic device and exposed to the ram air channel so as to radiate heat to a ram air.

Claims

1. A cooling device applicable to an airplane having a pressurized cabin and a ram air channel for cooling a power electronics device in a power supply system arranged in the pressurized cabin, comprising:

a partition wall separating the pressurized cabin from the ram air channel; and

a heat exchanger thermally in contact with the power electronics device and exposed to the ram air channel so as to radiate heat generated by the power electronics device to a ram air.

2. The cooling device of claim 1, wherein the heat exchanger gets thermally in contact with both faces of the partition wall, one of the faces facing to the pressurized cabin and another of the faces facing to the ram air channel, whereby the heat exchanger and the partition wall constitute a heat transfer path for transmitting heat from the power electronics device to the ram air channel.

3. The cooling device of claim 1, wherein the heat exchanger further includes a heat pipe.

4. The cooling device of claim 1, wherein connection between the power electronics device and the heat exchanger does not include circulation of a cooling medium.

5. The cooling device of claim 1, wherein the heat exchanger is directly in contact with the power electronics device.