Heat releasing plate for mounting semiconductor components
First Claim
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1. The ornamental design for heat releasing plate for mounting semiconductor components, as shown and described.
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1 Claim
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1. The ornamental design for heat releasing plate for mounting semiconductor components, as shown and described.
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Current AssigneeShowa Aluminum Kabushiki Kaisha
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Original AssigneeShowa Aluminum Kabushiki Kaisha
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InventorsAsanuma, Yoshihiko
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Primary Examiner(s)Lucas, Susan J.
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Application NumberUS06/154,984Time in Patent Office830 DaysField of SearchD13/23, 165/80 R, 165/80 A, 165/80 B, 165/80 D, 357/81, 174/16 HSUS Class CurrentD13/179CPC Class CodesN/A
