Heat sink for integrated-circuit chip carrier
First Claim
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1. The ornamental design for a heat sink for integrated-circuit chip carrier, substantially as shown and described.
5 Assignments
0 Petitions
Accused Products
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Citations
1 Claim
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1. The ornamental design for a heat sink for integrated-circuit chip carrier, substantially as shown and described.
Specification
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Current AssigneeAavid Thermal Products Incorporated (Ansys Incorporated)
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Original AssigneeAavid Thermal Products Incorporated (Ansys Incorporated)
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InventorsMcCarthy, Alfred F.
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Primary Examiner(s)Lucas, Susan J.
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Application NumberUS06/664,258Time in Patent Office664 DaysField of SearchD13/23, 174/16 HS, 357/81, 165/80.1, 165/80.2, 165/80.3, 165/185US Class CurrentD13/179CPC Class CodesN/A
