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Grooves formed around a semiconductor device on a circuit board

  • US D566,060 S1
  • Filed: 10/11/2005
  • Issued: 04/08/2008
  • Est. Priority Date: 04/13/2005
  • Status: Active Grant
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1. The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.

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