Grooves formed around a semiconductor device on a circuit board
First Claim
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1. The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.
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1 Claim
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1. The ornamental design for grooves formed around a semiconductor device on a circuit board, as shown and described.
Specification
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Current AssigneeNitto Denko Corporation
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Original AssigneeNitto Denko Corporation
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InventorsNaito, Toshiki, Kataoka, Kouji, Ohsawa, Tetsuya, Terada, Naohiro
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Primary Examiner(s)Sikder; Selina
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Application NumberUS29/306,339Time in Patent Office224 DaysField of SearchD13/182, 174/250, 174/251, 174/253, 174/254, 174/255, 174/256, 174/265, 174/260, 174/261, 361/760, 361/748, 361/720, 336/200US Class CurrentD13/182CPC Class CodesN/A
